{"id":"https://openalex.org/W4413092887","doi":"https://doi.org/10.1145/3701717.3735574","title":"Real-Time Thermal Defect Detection in Additive Manufacturing with Apache Flink","display_name":"Real-Time Thermal Defect Detection in Additive Manufacturing with Apache Flink","publication_year":2025,"publication_date":"2025-06-09","ids":{"openalex":"https://openalex.org/W4413092887","doi":"https://doi.org/10.1145/3701717.3735574"},"language":"en","primary_location":{"id":"doi:10.1145/3701717.3735574","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3701717.3735574","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 19th ACM International Conference on Distributed and Event-based Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1145/3701717.3735574","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Zishuo Liu","orcid":"https://orcid.org/0009-0001-5367-3423"},"institutions":[{"id":"https://openalex.org/I111088046","display_name":"Boston University","ror":"https://ror.org/05qwgg493","country_code":"US","type":"education","lineage":["https://openalex.org/I111088046"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Zishuo Liu","raw_affiliation_strings":["Computer Science, Boston University, Boston, Massachusetts, USA"],"raw_orcid":"https://orcid.org/0009-0001-5367-3423","affiliations":[{"raw_affiliation_string":"Computer Science, Boston University, Boston, Massachusetts, USA","institution_ids":["https://openalex.org/I111088046"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jingzhi Yan","orcid":"https://orcid.org/0009-0007-6295-0086"},"institutions":[{"id":"https://openalex.org/I111088046","display_name":"Boston University","ror":"https://ror.org/05qwgg493","country_code":"US","type":"education","lineage":["https://openalex.org/I111088046"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jingzhi Yan","raw_affiliation_strings":["Computer Science, Boston University, Boston, Massachusetts, USA"],"raw_orcid":"https://orcid.org/0009-0007-6295-0086","affiliations":[{"raw_affiliation_string":"Computer Science, Boston University, Boston, Massachusetts, USA","institution_ids":["https://openalex.org/I111088046"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5119264484","display_name":"Yixin Lao","orcid":null},"institutions":[{"id":"https://openalex.org/I111088046","display_name":"Boston University","ror":"https://ror.org/05qwgg493","country_code":"US","type":"education","lineage":["https://openalex.org/I111088046"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yixin Lao","raw_affiliation_strings":["Computer Science, Boston University, Boston, Massachusetts, USA"],"raw_orcid":"https://orcid.org/0009-0000-8912-3549","affiliations":[{"raw_affiliation_string":"Computer Science, Boston University, Boston, Massachusetts, USA","institution_ids":["https://openalex.org/I111088046"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I111088046"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1868003,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"229","last_page":"234"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5194489359855652},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.49805140495300293},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.3841666579246521},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.13750594854354858},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08072715997695923}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5194489359855652},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.49805140495300293},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.3841666579246521},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13750594854354858},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08072715997695923},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3701717.3735574","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3701717.3735574","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 19th ACM International Conference on Distributed and Event-based Systems","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3701717.3735574","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3701717.3735574","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 19th ACM International Conference on Distributed and Event-based Systems","raw_type":"proceedings-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.5099999904632568}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2999500572","https://openalex.org/W3170491157","https://openalex.org/W4283757822","https://openalex.org/W4388923635"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}