{"id":"https://openalex.org/W2975684421","doi":"https://doi.org/10.1145/3313231.3352363","title":"ClusCross","display_name":"ClusCross","publication_year":2019,"publication_date":"2019-09-26","ids":{"openalex":"https://openalex.org/W2975684421","doi":"https://doi.org/10.1145/3313231.3352363","mag":"2975684421"},"language":"en","primary_location":{"id":"doi:10.1145/3313231.3352363","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3313231.3352363","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3313231.3352363","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3313231.3352363","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087978342","display_name":"Hesam Shabani","orcid":null},"institutions":[{"id":"https://openalex.org/I186143895","display_name":"Lehigh University","ror":"https://ror.org/012afjb06","country_code":"US","type":"education","lineage":["https://openalex.org/I186143895"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hesam Shabani","raw_affiliation_strings":["Lehigh University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lehigh University","institution_ids":["https://openalex.org/I186143895"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028757963","display_name":"Xiaochen Guo","orcid":"https://orcid.org/0000-0001-7704-0412"},"institutions":[{"id":"https://openalex.org/I186143895","display_name":"Lehigh University","ror":"https://ror.org/012afjb06","country_code":"US","type":"education","lineage":["https://openalex.org/I186143895"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaochen Guo","raw_affiliation_strings":["Lehigh University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lehigh University","institution_ids":["https://openalex.org/I186143895"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I186143895"],"apc_list":null,"apc_paid":null,"fwci":0.9614,"has_fulltext":true,"cited_by_count":9,"citation_normalized_percentile":{"value":0.71438269,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.8146530389785767},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.7299474477767944},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.7196491956710815},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6534519791603088},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4941542446613312},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.45246410369873047},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.43256285786628723},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.41736239194869995},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1535331904888153},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1142517626285553}],"concepts":[{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.8146530389785767},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.7299474477767944},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.7196491956710815},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6534519791603088},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4941542446613312},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.45246410369873047},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.43256285786628723},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.41736239194869995},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1535331904888153},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1142517626285553}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3313231.3352363","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3313231.3352363","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3313231.3352363","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3313231.3352363","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3313231.3352363","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3313231.3352363","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 13th IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"proceedings-article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8199999928474426}],"awards":[{"id":"https://openalex.org/G4178133345","display_name":null,"funder_award_id":"CCF-1750826","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G5391017766","display_name":"CAREER: Revamping the Memory Systems for Efficient Data Movement","funder_award_id":"1750826","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G5563387174","display_name":null,"funder_award_id":"CCF-1723624","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G7772818242","display_name":"CAPA: Collaborative Research: Lightweight Abstract Memory Features","funder_award_id":"1723624","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320310365","display_name":"Lehigh University","ror":"https://ror.org/012afjb06"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2975684421.pdf","grobid_xml":"https://content.openalex.org/works/W2975684421.grobid-xml"},"referenced_works_count":21,"referenced_works":["https://openalex.org/W1501077214","https://openalex.org/W1515364274","https://openalex.org/W1939228150","https://openalex.org/W2034822545","https://openalex.org/W2038667206","https://openalex.org/W2048789167","https://openalex.org/W2055509164","https://openalex.org/W2068094405","https://openalex.org/W2114542420","https://openalex.org/W2118231264","https://openalex.org/W2118961575","https://openalex.org/W2123184444","https://openalex.org/W2128998437","https://openalex.org/W2139164850","https://openalex.org/W2155765360","https://openalex.org/W2234584938","https://openalex.org/W2497599918","https://openalex.org/W2728730510","https://openalex.org/W2790310590","https://openalex.org/W4239561798","https://openalex.org/W4244048786"],"related_works":["https://openalex.org/W2011430815","https://openalex.org/W4321606653","https://openalex.org/W121182129","https://openalex.org/W2065289416","https://openalex.org/W2502691491","https://openalex.org/W2017236304","https://openalex.org/W2115579119","https://openalex.org/W3142211975","https://openalex.org/W1879443270","https://openalex.org/W2018912978"],"abstract_inverted_index":{"The":[0],"increasing":[1],"number":[2,46],"of":[3,8,16,47],"cores":[4],"challenges":[5],"the":[6,14,45,51],"scalability":[7],"chip":[9,22],"multiprocessors.":[10],"Recent":[11],"studies":[12],"proposed":[13],"idea":[15],"disintegration":[17],"by":[18],"partitioning":[19],"a":[20,55],"large":[21],"into":[23],"multiple":[24],"smaller":[25,36],"chips":[26,49],"and":[27],"using":[28],"silicon":[29],"interposer-based":[30],"integration":[31],"(2.5D)":[32],"to":[33],"connect":[34],"these":[35],"chips.":[37],"This":[38],"method":[39],"can":[40],"improve":[41],"yield,":[42],"but":[43],"as":[44],"small":[48],"increases,":[50],"chip-to-chip":[52],"communication":[53],"becomes":[54],"performance":[56],"bottleneck.":[57]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2019-10-03T00:00:00"}