{"id":"https://openalex.org/W2082014834","doi":"https://doi.org/10.1145/1053355.1053361","title":"Package level interconnect options","display_name":"Package level interconnect options","publication_year":2005,"publication_date":"2005-04-02","ids":{"openalex":"https://openalex.org/W2082014834","doi":"https://doi.org/10.1145/1053355.1053361","mag":"2082014834"},"language":"en","primary_location":{"id":"doi:10.1145/1053355.1053361","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1053355.1053361","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 international workshop on System level interconnect prediction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026095972","display_name":"Jayaprakash Balachandran","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"J. Balachandran","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055975576","display_name":"S. Brebels","orcid":"https://orcid.org/0000-0002-1568-0286"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. Brebels","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037256255","display_name":"G. Carchon","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"G. Carchon","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027513846","display_name":"Tomas Webers","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Webers","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070645752","display_name":"W. De Raedt","orcid":"https://orcid.org/0000-0002-7117-7976"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. De Raedt","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032370530","display_name":"Bart Nauwelaers","orcid":"https://orcid.org/0000-0003-3986-2786"},"institutions":[{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"B. Nauwelaers","raw_affiliation_strings":["Katholieke Universiteit Leuven, Belgium","Katholieke Universiteit , Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"Katholieke Universiteit Leuven, Belgium","institution_ids":["https://openalex.org/I99464096"]},{"raw_affiliation_string":"Katholieke Universiteit , Leuven, Belgium","institution_ids":["https://openalex.org/I99464096"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["Microwave and RF Systems Group, Belgium"],"affiliations":[{"raw_affiliation_string":"Microwave and RF Systems Group, Belgium","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5026095972"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.32683453,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.82835149,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"21","last_page":"27"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.61025071144104},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6075922250747681},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5860329270362854},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5618212819099426},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.5130800008773804},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.45640289783477783},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.44348815083503723},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.4393221139907837},{"id":"https://openalex.org/keywords/electric-power-transmission","display_name":"Electric power transmission","score":0.4122101068496704},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3736751675605774},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.31334590911865234},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2248803973197937},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14468029141426086},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1084977388381958}],"concepts":[{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.61025071144104},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6075922250747681},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5860329270362854},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5618212819099426},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5130800008773804},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.45640289783477783},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44348815083503723},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.4393221139907837},{"id":"https://openalex.org/C140311924","wikidata":"https://www.wikidata.org/wiki/Q200928","display_name":"Electric power transmission","level":2,"score":0.4122101068496704},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3736751675605774},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31334590911865234},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2248803973197937},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14468029141426086},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1084977388381958}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1053355.1053361","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1053355.1053361","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 international workshop on System level interconnect prediction","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8600000143051147,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1502784226","https://openalex.org/W1515587081","https://openalex.org/W1556480701","https://openalex.org/W1605656908","https://openalex.org/W1740839669","https://openalex.org/W2050117348","https://openalex.org/W2073685115","https://openalex.org/W2101998766","https://openalex.org/W2105327704","https://openalex.org/W2106933609","https://openalex.org/W2111655361","https://openalex.org/W2120149280","https://openalex.org/W2153683722","https://openalex.org/W2154029772","https://openalex.org/W2158741398","https://openalex.org/W2159917268","https://openalex.org/W2160642395","https://openalex.org/W2163060908","https://openalex.org/W2166213383","https://openalex.org/W2167848093","https://openalex.org/W2205633887","https://openalex.org/W2798875205","https://openalex.org/W3132427080","https://openalex.org/W4246553706","https://openalex.org/W6675446942","https://openalex.org/W6675519790","https://openalex.org/W6683464302","https://openalex.org/W6687995109","https://openalex.org/W6750616722","https://openalex.org/W6791066542"],"related_works":["https://openalex.org/W2018755015","https://openalex.org/W3022507253","https://openalex.org/W2377520147","https://openalex.org/W4233448569","https://openalex.org/W2129522428","https://openalex.org/W3213269153","https://openalex.org/W2011815926","https://openalex.org/W1543593092","https://openalex.org/W3210715942","https://openalex.org/W2270036762"],"abstract_inverted_index":{"Scaling":[0],"enhances":[1],"intrinsic":[2],"transistor":[3],"performance":[4,64],"and":[5,47,58,70,108,122],"degrades":[6],"interconnects.":[7],"As":[8],"the":[9,75],"technology":[10,88],"steps":[11],"into":[12],"nanometer":[13],"era,":[14],"global":[15,38,83],"interconnects":[16,31,41,84,98],"are":[17,32,99],"becoming":[18],"bottleneck":[19],"for":[20,36,51,85,102],"overall":[21],"chip":[22],"performance.":[23],"In":[24],"this":[25],"paper,":[26],"we":[27,94,109],"show":[28,95],"package":[29,76,96],"level":[30,77,97],"an":[33],"effective":[34],"alternative":[35],"on-chip":[37,82],"wiring.":[39],"These":[40],"behave":[42],"as":[43],"LC":[44],"transmission":[45,57,78],"lines":[46,79],"can":[48],"be":[49],"exploited":[50],"their":[52],"near":[53],"speed":[54],"of":[55,74],"light":[56],"low":[59,105],"attenuation":[60],"characteristics.":[61],"We":[62],"compare":[63],"-":[65,73],"bandwidth,":[66],"bandwidth":[67],"density,":[68],"latency":[69,106],"power":[71,103,123],"consumption":[72],"with":[80],"conventional":[81],"different":[86,111],"ITRS":[87],"nodes.":[89],"Based":[90],"on":[91],"these":[92],"results,":[93],"well":[100],"suited":[101],"demanding":[104],"applications":[107],"analyze":[110],"interconnect":[112],"options":[113],"like":[114],"memory":[115],"buses,":[116],"long":[117],"inter":[118],"tile":[119],"interconnects,":[120],"clock":[121],"distribution.":[124]},"counts_by_year":[{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}