{"id":"https://openalex.org/W7130412132","doi":"https://doi.org/10.1145/3774746.3779250","title":"Demonstrating Y-AR: A Mixed Reality CAD Tool for 3D Wire Bending","display_name":"Demonstrating Y-AR: A Mixed Reality CAD Tool for 3D Wire Bending","publication_year":2025,"publication_date":"2025-11-20","ids":{"openalex":"https://openalex.org/W7130412132","doi":"https://doi.org/10.1145/3774746.3779250"},"language":null,"primary_location":{"id":"doi:10.1145/3774746.3779250","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3774746.3779250","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Adjunct Proceedings of the 10th ACM Symposium on Computational Fabrication","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074250745","display_name":"Shuo Feng","orcid":"https://orcid.org/0000-0003-2350-321X"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shuo Feng","raw_affiliation_strings":["Information Science, Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0000-0003-2350-321X","affiliations":[{"raw_affiliation_string":"Information Science, Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5126319418","display_name":"Bo Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bo Liu","raw_affiliation_strings":["Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0000-0002-4331-1541","affiliations":[{"raw_affiliation_string":"Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yifan Shan","orcid":"https://orcid.org/0009-0002-5457-8783"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yifan Shan","raw_affiliation_strings":["Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0009-0002-5457-8783","affiliations":[{"raw_affiliation_string":"Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5120350884","display_name":"Roy Zunder","orcid":"https://orcid.org/0009-0000-5714-7300"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Roy Zunder","raw_affiliation_strings":["Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0009-0000-5714-7300","affiliations":[{"raw_affiliation_string":"Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074435825","display_name":"Wei-che Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei-Che Lin","raw_affiliation_strings":["Cornell University, Ithaca, NY, USA"],"raw_orcid":"https://orcid.org/0009-0003-5269-223X","affiliations":[{"raw_affiliation_string":"Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113889283","display_name":"Tri Dinh","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142519","display_name":"MacAulay-Brown (United States)","ror":"https://ror.org/03vgy2486","country_code":"US","type":"company","lineage":["https://openalex.org/I4210142519"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tri Dinh","raw_affiliation_strings":["Macaulay Honors College, New York, NY, USA"],"raw_orcid":"https://orcid.org/0009-0008-6575-5996","affiliations":[{"raw_affiliation_string":"Macaulay Honors College, New York, NY, USA","institution_ids":["https://openalex.org/I4210142519"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023199779","display_name":"Harald Haraldsson","orcid":"https://orcid.org/0000-0002-3858-4721"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Harald Haraldsson","raw_affiliation_strings":["Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0000-0002-3858-4721","affiliations":[{"raw_affiliation_string":"Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060673486","display_name":"Ofer Berman","orcid":"https://orcid.org/0000-0003-0010-2261"},"institutions":[{"id":"https://openalex.org/I174306211","display_name":"Technion \u2013 Israel Institute of Technology","ror":"https://ror.org/03qryx823","country_code":"IL","type":"education","lineage":["https://openalex.org/I174306211"]},{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["IL","US"],"is_corresponding":false,"raw_author_name":"Ofer Berman","raw_affiliation_strings":["Technion, Haifa, Israel and Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0000-0003-0010-2261","affiliations":[{"raw_affiliation_string":"Technion, Haifa, Israel and Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I174306211","https://openalex.org/I205783295"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091347616","display_name":"Thijs Roumen","orcid":"https://orcid.org/0000-0003-2042-6597"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Thijs Roumen","raw_affiliation_strings":["Information Science, Cornell Tech, New York, NY, USA"],"raw_orcid":"https://orcid.org/0000-0003-2042-6597","affiliations":[{"raw_affiliation_string":"Information Science, Cornell Tech, New York, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":9,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.67429766,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.7134000062942505,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.7134000062942505,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10888","display_name":"Augmented Reality Applications","score":0.11410000175237656,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10719","display_name":"3D Shape Modeling and Analysis","score":0.03819999843835831,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.6029999852180481},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.5813000202178955},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5748999714851379},{"id":"https://openalex.org/keywords/usability","display_name":"Usability","score":0.5593000054359436},{"id":"https://openalex.org/keywords/computer-aided-design","display_name":"Computer Aided Design","score":0.5407999753952026},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4368000030517578},{"id":"https://openalex.org/keywords/user-interface","display_name":"User interface","score":0.39989998936653137},{"id":"https://openalex.org/keywords/engineering-design-process","display_name":"Engineering design process","score":0.3869999945163727},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.38339999318122864}],"concepts":[{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.6029999852180481},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.5813000202178955},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5748999714851379},{"id":"https://openalex.org/C170130773","wikidata":"https://www.wikidata.org/wiki/Q216378","display_name":"Usability","level":2,"score":0.5593000054359436},{"id":"https://openalex.org/C119823426","wikidata":"https://www.wikidata.org/wiki/Q184793","display_name":"Computer Aided Design","level":2,"score":0.5407999753952026},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5131999850273132},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.49470001459121704},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4368000030517578},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.43470001220703125},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.424699991941452},{"id":"https://openalex.org/C89505385","wikidata":"https://www.wikidata.org/wiki/Q47146","display_name":"User interface","level":2,"score":0.39989998936653137},{"id":"https://openalex.org/C34972735","wikidata":"https://www.wikidata.org/wiki/Q2920267","display_name":"Engineering design process","level":2,"score":0.3869999945163727},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.38339999318122864},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.3801000118255615},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.3756999969482422},{"id":"https://openalex.org/C48262172","wikidata":"https://www.wikidata.org/wiki/Q16908765","display_name":"Design process","level":3,"score":0.3292999863624573},{"id":"https://openalex.org/C108882727","wikidata":"https://www.wikidata.org/wiki/Q2991685","display_name":"Solid modeling","level":2,"score":0.32839998602867126},{"id":"https://openalex.org/C194969405","wikidata":"https://www.wikidata.org/wiki/Q170519","display_name":"Virtual reality","level":2,"score":0.32260000705718994},{"id":"https://openalex.org/C165292400","wikidata":"https://www.wikidata.org/wiki/Q686261","display_name":"Wire drawing","level":2,"score":0.32089999318122864},{"id":"https://openalex.org/C2781052500","wikidata":"https://www.wikidata.org/wiki/Q2230313","display_name":"Shell (structure)","level":2,"score":0.3158999979496002},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.30320000648498535},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.2980000078678131},{"id":"https://openalex.org/C180539650","wikidata":"https://www.wikidata.org/wiki/Q660192","display_name":"Computer-aided manufacturing","level":3,"score":0.2822999954223633},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.2766999900341034},{"id":"https://openalex.org/C2781089630","wikidata":"https://www.wikidata.org/wiki/Q21856745","display_name":"Realization (probability)","level":2,"score":0.27250000834465027},{"id":"https://openalex.org/C2779747408","wikidata":"https://www.wikidata.org/wiki/Q211367","display_name":"Sheet metal","level":2,"score":0.2639000117778778},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.25999999046325684},{"id":"https://openalex.org/C2777897806","wikidata":"https://www.wikidata.org/wiki/Q568742","display_name":"3D modeling","level":2,"score":0.25459998846054077}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3774746.3779250","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3774746.3779250","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Adjunct Proceedings of the 10th ACM Symposium on Computational Fabrication","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"Wire":[0],"bending":[1,22],"is":[2],"a":[3,56,126,147,197],"technique":[4],"used":[5],"in":[6,19,91,122,151],"manufacturing":[7],"to":[8,51,70,78,82,106,143,175],"mass-produce":[9],"items":[10],"such":[11],"as":[12,87,99,153,155],"clips,":[13,74],"mounts,":[14,75],"and":[15,76,109,119,145,195],"braces.":[16],"Recent":[17],"advances":[18],"programmable":[20],"wire":[21,34,64,178],"have":[23],"made":[24,157],"this":[25],"process":[26],"increasingly":[27],"accessible":[28],"for":[29,62],"custom":[30,48],"fabrication.":[31],"However,":[32],"CNC":[33],"benders":[35],"are":[36,125],"controlled":[37],"using":[38,158,182,201],"Computer":[39,57],"Aided":[40,58],"Manufacturing":[41],"(CAM)":[42],"software,":[43],"without":[44],"design":[45,100,128,144,160,170],"tools,":[46],"making":[47],"designs":[49],"challenging":[50],"produce.":[52],"We":[53,140,162],"present":[54],"Y-AR,":[55],"Design":[59],"(CAD)":[60],"interface":[61,96],"3D":[63],"bending.":[65],"Y-AR":[66,152],"uses":[67],"mixed":[68],"reality":[69],"let":[71],"designers":[72],"create":[73,176],"braces":[77],"physically":[79],"connect":[80],"objects":[81],"their":[83],"surrounding":[84],"environment":[85],"(such":[86],"the":[88],"mount":[89],"shown":[90],"Figure":[92],"1":[93],"c).":[94],"The":[95],"incorporates":[97],"springs":[98],"primitives":[101],"which":[102],"(1)":[103],"apply":[104],"forces":[105],"hold":[107],"objects,":[108],"(2)":[110],"counter-act":[111],"dimensional":[112],"inaccuracies":[113],"inherently":[114],"caused":[115],"by":[116],"mid-air":[117],"modeling":[118],"measurement":[120],"errors":[121],"AR.":[123],"Springs":[124],"natural":[127],"element":[129],"when":[130,181],"working":[131],"with":[132,168],"metal":[133],"wire-bending":[134],"given":[135],"its":[136],"specific":[137],"material":[138],"properties.":[139],"demonstrate":[141],"workflows":[142],"fabricate":[146],"range":[148],"of":[149],"mechanisms":[150],"well":[154],"structures":[156],"free-hand":[159],"tools.":[161],"found":[163],"that":[164],"combining":[165],"gesture-based":[166],"interaction":[167],"fabrication-aware":[169],"principles":[171],"allowed":[172],"novice":[173],"users":[174],"functional":[177,198],"connectors,":[179],"even":[180],"imprecise":[183],"XR-based":[184],"input.":[185],"In":[186],"our":[187],"usability":[188],"evaluation,":[189],"all":[190],"12":[191],"participants":[192],"successfully":[193],"designed":[194],"fabricated":[196],"bottle":[199],"holder":[200],"Y-AR.":[202]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2026-02-19T00:00:00"}