{"id":"https://openalex.org/W7153888792","doi":"https://doi.org/10.1145/3772363.3798951","title":"3D Printing as Material Probe: Supporting Fiber Understanding in Papermaking Craft","display_name":"3D Printing as Material Probe: Supporting Fiber Understanding in Papermaking Craft","publication_year":2026,"publication_date":"2026-04-13","ids":{"openalex":"https://openalex.org/W7153888792","doi":"https://doi.org/10.1145/3772363.3798951"},"language":null,"primary_location":{"id":"doi:10.1145/3772363.3798951","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3772363.3798951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Extended Abstracts of the 2026 CHI Conference on Human Factors in Computing Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034108996","display_name":"B. C. Liu","orcid":"https://orcid.org/0009-0004-8441-6173"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Beituo Liu","raw_affiliation_strings":["Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0004-8441-6173","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101760576","display_name":"Zhihao Yao","orcid":"https://orcid.org/0009-0003-9638-7413"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhihao Yao","raw_affiliation_strings":["Tsinghua University, Beijing, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0003-9638-7413","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037770584","display_name":"Yao Lu","orcid":"https://orcid.org/0000-0002-1094-8562"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yao Lu","raw_affiliation_strings":["Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0002-1094-8562","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027891530","display_name":"Xuezhu Wang","orcid":"https://orcid.org/0009-0007-0206-9801"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuezhu Wang","raw_affiliation_strings":["Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0007-0206-9801","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128369040","display_name":"Xiwen Yao","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiwen Yao","raw_affiliation_strings":["Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0001-5897-0312","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5022394827","display_name":"Haipeng Mi","orcid":"https://orcid.org/0000-0003-0560-4228"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haipeng Mi","raw_affiliation_strings":["Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0003-0560-4228","affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5034108996"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.79538763,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.22010000050067902,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.22010000050067902,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13316","display_name":"Crafts, Textile, and Design","score":0.061900001019239426,"subfield":{"id":"https://openalex.org/subfields/1209","display_name":"Museology"},"field":{"id":"https://openalex.org/fields/12","display_name":"Arts and Humanities"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T13518","display_name":"Architecture and Computational Design","score":0.031599998474121094,"subfield":{"id":"https://openalex.org/subfields/2216","display_name":"Architecture"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/papermaking","display_name":"Papermaking","score":0.8416000008583069},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6144999861717224},{"id":"https://openalex.org/keywords/craft","display_name":"Craft","score":0.5629000067710876},{"id":"https://openalex.org/keywords/fiber","display_name":"Fiber","score":0.5012999773025513},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.3409000039100647}],"concepts":[{"id":"https://openalex.org/C2779093316","wikidata":"https://www.wikidata.org/wiki/Q335415","display_name":"Papermaking","level":2,"score":0.8416000008583069},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6144999861717224},{"id":"https://openalex.org/C2779732396","wikidata":"https://www.wikidata.org/wiki/Q2207288","display_name":"Craft","level":2,"score":0.5629000067710876},{"id":"https://openalex.org/C519885992","wikidata":"https://www.wikidata.org/wiki/Q161","display_name":"Fiber","level":2,"score":0.5012999773025513},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4000999927520752},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3912999927997589},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.3409000039100647},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3346000015735626},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.29670000076293945},{"id":"https://openalex.org/C206139338","wikidata":"https://www.wikidata.org/wiki/Q192355","display_name":"Raw material","level":2,"score":0.29269999265670776},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2768999934196472},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2687000036239624},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.2655999958515167}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3772363.3798951","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3772363.3798951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Extended Abstracts of the 2026 CHI Conference on Human Factors in Computing Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2043127143","https://openalex.org/W2050394745","https://openalex.org/W2294102697","https://openalex.org/W2796338462","https://openalex.org/W4213244052","https://openalex.org/W4396832781","https://openalex.org/W4409736038"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-04-29T09:16:38.111599","created_date":"2026-04-13T00:00:00"}