{"id":"https://openalex.org/W6940365459","doi":"https://doi.org/10.1145/3746059.3747628","title":"ProForm: Solder-Free Circuit Assembly Using Thermoforming","display_name":"ProForm: Solder-Free Circuit Assembly Using Thermoforming","publication_year":2025,"publication_date":"2025-09-27","ids":{"openalex":"https://openalex.org/W6940365459","doi":"https://doi.org/10.1145/3746059.3747628"},"language":"en","primary_location":{"id":"doi:10.1145/3746059.3747628","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3746059.3747628","pdf_url":null,"source":null,"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"},"type":"article","indexed_in":["arxiv","crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1145/3746059.3747628","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Narjes Pourjafarian","orcid":"https://orcid.org/0000-0001-5298-6797"},"institutions":[{"id":"https://openalex.org/I12912129","display_name":"Northeastern University","ror":"https://ror.org/04t5xt781","country_code":"US","type":"education","lineage":["https://openalex.org/I12912129"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Narjes Pourjafarian","raw_affiliation_strings":["Northeastern University, Boston, MA, USA"],"raw_orcid":"https://orcid.org/0000-0001-5298-6797","affiliations":[{"raw_affiliation_string":"Northeastern University, Boston, MA, USA","institution_ids":["https://openalex.org/I12912129"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Zhenming Yang","orcid":"https://orcid.org/0009-0005-5856-1809"},"institutions":[{"id":"https://openalex.org/I12912129","display_name":"Northeastern University","ror":"https://ror.org/04t5xt781","country_code":"US","type":"education","lineage":["https://openalex.org/I12912129"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhenming Yang","raw_affiliation_strings":["Northeastern University, Boston, MA, USA"],"raw_orcid":"https://orcid.org/0009-0005-5856-1809","affiliations":[{"raw_affiliation_string":"Northeastern University, Boston, MA, USA","institution_ids":["https://openalex.org/I12912129"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jeffrey Ian Lipton","orcid":"https://orcid.org/0000-0003-0843-0999"},"institutions":[{"id":"https://openalex.org/I12912129","display_name":"Northeastern University","ror":"https://ror.org/04t5xt781","country_code":"US","type":"education","lineage":["https://openalex.org/I12912129"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jeffrey Ian Lipton","raw_affiliation_strings":["Northeastern University, Boston, MA, USA"],"raw_orcid":"https://orcid.org/0000-0003-0843-0999","affiliations":[{"raw_affiliation_string":"Northeastern University, Boston, MA, USA","institution_ids":["https://openalex.org/I12912129"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Benyamin Davaji","orcid":"https://orcid.org/0000-0002-6375-4120"},"institutions":[{"id":"https://openalex.org/I12912129","display_name":"Northeastern University","ror":"https://ror.org/04t5xt781","country_code":"US","type":"education","lineage":["https://openalex.org/I12912129"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Benyamin Davaji","raw_affiliation_strings":["Northeastern University, Boston, MA, USA"],"raw_orcid":"https://orcid.org/0000-0002-6375-4120","affiliations":[{"raw_affiliation_string":"Northeastern University, Boston, MA, USA","institution_ids":["https://openalex.org/I12912129"]}]},{"author_position":"last","author":{"id":null,"display_name":"Gregory D. Abowd","orcid":"https://orcid.org/0000-0002-3408-587X"},"institutions":[{"id":"https://openalex.org/I12912129","display_name":"Northeastern University","ror":"https://ror.org/04t5xt781","country_code":"US","type":"education","lineage":["https://openalex.org/I12912129"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gregory D. Abowd","raw_affiliation_strings":["Northeastern University, Boston, MA, USA"],"raw_orcid":"https://orcid.org/0000-0002-3408-587X","affiliations":[{"raw_affiliation_string":"Northeastern University, Boston, MA, USA","institution_ids":["https://openalex.org/I12912129"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I12912129"],"apc_list":null,"apc_paid":null,"fwci":1.5401,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.8817885,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":true,"primary_topic":{"id":"https://openalex.org/T10451","display_name":"Mycorrhizal Fungi and Plant Interactions","score":0.5045999884605408,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T10451","display_name":"Mycorrhizal Fungi and Plant Interactions","score":0.5045999884605408,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10015","display_name":"Genomics and Phylogenetic Studies","score":0.15870000422000885,"subfield":{"id":"https://openalex.org/subfields/1312","display_name":"Molecular Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10825","display_name":"Plant Pathogens and Fungal Diseases","score":0.03709999844431877,"subfield":{"id":"https://openalex.org/subfields/1307","display_name":"Cell Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoforming","display_name":"Thermoforming","score":0.9365000128746033},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6647999882698059},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.6111000180244446},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.6100999712944031},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5950000286102295},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5353000164031982},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5327000021934509},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.41110000014305115},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.37599998712539673}],"concepts":[{"id":"https://openalex.org/C26593445","wikidata":"https://www.wikidata.org/wiki/Q1759746","display_name":"Thermoforming","level":2,"score":0.9365000128746033},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6647999882698059},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.6111000180244446},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6100999712944031},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5950000286102295},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5353000164031982},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5327000021934509},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.459199994802475},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.43380001187324524},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.41110000014305115},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.37700000405311584},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.37599998712539673},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.36399999260902405},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.36160001158714294},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.35040000081062317},{"id":"https://openalex.org/C17511633","wikidata":"https://www.wikidata.org/wiki/Q830694","display_name":"SMT placement equipment","level":3,"score":0.3490000069141388},{"id":"https://openalex.org/C151201525","wikidata":"https://www.wikidata.org/wiki/Q177239","display_name":"Limit (mathematics)","level":2,"score":0.3427000045776367},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3131999969482422},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.31279999017715454},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.31049999594688416},{"id":"https://openalex.org/C196796808","wikidata":"https://www.wikidata.org/wiki/Q132629","display_name":"Electrical network","level":2,"score":0.2994999885559082},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2890999913215637},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.2777999937534332},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.2741999924182892},{"id":"https://openalex.org/C2989044035","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronic equipment","level":2,"score":0.2676999866962433},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.26649999618530273},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.2635999917984009},{"id":"https://openalex.org/C2984557284","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design","level":2,"score":0.26010000705718994},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.25859999656677246},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25440001487731934}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/3746059.3747628","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3746059.3747628","pdf_url":null,"source":null,"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"},{"id":"pmh:oai:arXiv.org:2507.20933","is_oa":true,"landing_page_url":"http://arxiv.org/abs/2507.20933","pdf_url":"https://arxiv.org/pdf/2507.20933","source":{"id":"https://openalex.org/S4393918464","display_name":"ArXiv.org","issn_l":"2331-8422","issn":["2331-8422"],"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"}],"best_oa_location":{"id":"doi:10.1145/3746059.3747628","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3746059.3747628","pdf_url":null,"source":null,"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"},"sustainable_development_goals":[{"score":0.40887007117271423,"id":"https://metadata.un.org/sdg/12","display_name":"Responsible consumption and production"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":52,"referenced_works":["https://openalex.org/W1992100984","https://openalex.org/W1994547327","https://openalex.org/W2005437290","https://openalex.org/W2021698073","https://openalex.org/W2029055514","https://openalex.org/W2037399747","https://openalex.org/W2054044780","https://openalex.org/W2076265265","https://openalex.org/W2090390805","https://openalex.org/W2103339808","https://openalex.org/W2116817356","https://openalex.org/W2126138368","https://openalex.org/W2144575742","https://openalex.org/W2234224816","https://openalex.org/W2506540514","https://openalex.org/W2783831346","https://openalex.org/W2941350334","https://openalex.org/W2949310090","https://openalex.org/W2972228339","https://openalex.org/W2972653395","https://openalex.org/W2973972636","https://openalex.org/W3011343656","https://openalex.org/W3012448282","https://openalex.org/W3029740816","https://openalex.org/W3029978778","https://openalex.org/W3032538313","https://openalex.org/W3094083774","https://openalex.org/W3162410915","https://openalex.org/W3163446703","https://openalex.org/W3201053291","https://openalex.org/W4225096941","https://openalex.org/W4225123014","https://openalex.org/W4225136364","https://openalex.org/W4292421676","https://openalex.org/W4307475305","https://openalex.org/W4319441613","https://openalex.org/W4321320514","https://openalex.org/W4366547429","https://openalex.org/W4366547558","https://openalex.org/W4366548270","https://openalex.org/W4366549178","https://openalex.org/W4366550204","https://openalex.org/W4387835389","https://openalex.org/W4387835423","https://openalex.org/W4392348015","https://openalex.org/W4393300607","https://openalex.org/W4395675310","https://openalex.org/W4396832746","https://openalex.org/W4396919515","https://openalex.org/W4399899651","https://openalex.org/W4403334457","https://openalex.org/W6940972148"],"related_works":[],"abstract_inverted_index":{"Electronic":[0],"waste":[1],"(e-waste)":[2],"is":[3],"a":[4,44,75,116],"growing":[5],"global":[6],"challenge,":[7],"with":[8,55],"millions":[9],"of":[10,18,78],"functional":[11],"components":[12,54],"discarded":[13],"due":[14],"to":[15,38,97],"the":[16,64],"difficulty":[17],"repair":[19],"and":[20,36,83,90,110],"reuse.":[21],"Traditional":[22],"circuit":[23,49],"assembly":[24],"relies":[25],"on":[26],"soldering,":[27],"which":[28],"creates":[29],"semi-permanent":[30],"bonds":[31],"that":[32,103],"limit":[33],"component":[34],"recovery":[35],"contribute":[37],"unnecessary":[39],"waste.":[40],"We":[41,93,101],"introduce":[42],"ProForm,":[43],"thermoforming":[45],"approach":[46,73],"for":[47,66,118],"solder-free":[48],"prototyping.":[50,92],"By":[51],"encapsulating":[52],"electronic":[53],"pressure-formed":[56],"thermoplastics,":[57],"ProForm":[58,122],"enables":[59],"secure,":[60],"reversible":[61],"mounting":[62],"without":[63],"need":[65,117],"solder":[67],"or":[68],"custom":[69],"mechanical":[70,111],"housings.":[71],"This":[72],"supports":[74],"wide":[76],"range":[77],"substrates,":[79],"including":[80],"flexible,":[81],"paper-based,":[82],"non-planar":[84],"circuits,":[85],"facilitating":[86],"easy":[87],"reuse,":[88],"replacement,":[89],"rapid":[91],"demonstrate":[94],"ProForm's":[95],"versatility":[96],"support":[98],"prototyping":[99],"practices.":[100],"show":[102],"ProFormed":[104],"circuits":[105],"exhibit":[106],"good":[107],"electrical":[108],"performance":[109],"stability.":[112],"While":[113],"motivated":[114],"by":[115],"sustainable":[119],"electronics":[120],"practices,":[121],"has":[123],"other":[124],"significant":[125],"advantages":[126],"over":[127],"traditional":[128],"soldering.":[129]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}