{"id":"https://openalex.org/W7134196652","doi":"https://doi.org/10.1145/3731459.3773307","title":"Printegrated Circuits: Personal Fabrication of 3D Printed Devices with Embedded PCBs","display_name":"Printegrated Circuits: Personal Fabrication of 3D Printed Devices with Embedded PCBs","publication_year":2026,"publication_date":"2026-03-07","ids":{"openalex":"https://openalex.org/W7134196652","doi":"https://doi.org/10.1145/3731459.3773307"},"language":null,"primary_location":{"id":"doi:10.1145/3731459.3773307","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3731459.3773307","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1145/3731459.3773307","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5093784489","display_name":"Oliver Child","orcid":"https://orcid.org/0000-0002-9699-1288"},"institutions":[{"id":"https://openalex.org/I36234482","display_name":"University of Bristol","ror":"https://ror.org/0524sp257","country_code":"GB","type":"education","lineage":["https://openalex.org/I36234482"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Oliver Child","raw_affiliation_strings":["Deparment of Computer Science, University of Bristol, Bristol, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0002-9699-1288","affiliations":[{"raw_affiliation_string":"Deparment of Computer Science, University of Bristol, Bristol, United Kingdom","institution_ids":["https://openalex.org/I36234482"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040597930","display_name":"Ollie Hanton","orcid":"https://orcid.org/0000-0001-8261-1099"},"institutions":[{"id":"https://openalex.org/I51601045","display_name":"University of Bath","ror":"https://ror.org/002h8g185","country_code":"GB","type":"education","lineage":["https://openalex.org/I51601045"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Ollie Hanton","raw_affiliation_strings":["Department of Computer Science, University of Bath, Bath, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0001-8261-1099","affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Bath, Bath, United Kingdom","institution_ids":["https://openalex.org/I51601045"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jack Dawson","orcid":"https://orcid.org/0000-0002-8477-4489"},"institutions":[{"id":"https://openalex.org/I51601045","display_name":"University of Bath","ror":"https://ror.org/002h8g185","country_code":"GB","type":"education","lineage":["https://openalex.org/I51601045"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Jack Dawson","raw_affiliation_strings":["Department of Computer Science, University of Bath, Bath, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0002-8477-4489","affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Bath, Bath, United Kingdom","institution_ids":["https://openalex.org/I51601045"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031564691","display_name":"Steve Hodges","orcid":"https://orcid.org/0000-0001-9314-7762"},"institutions":[{"id":"https://openalex.org/I67415387","display_name":"Lancaster University","ror":"https://ror.org/04f2nsd36","country_code":"GB","type":"education","lineage":["https://openalex.org/I67415387"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Steve Hodges","raw_affiliation_strings":["School of Computing and Communications, Lancaster University, Lancaster, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0001-9314-7762","affiliations":[{"raw_affiliation_string":"School of Computing and Communications, Lancaster University, Lancaster, United Kingdom","institution_ids":["https://openalex.org/I67415387"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5128335183","display_name":"Mike Fraser","orcid":null},"institutions":[{"id":"https://openalex.org/I36234482","display_name":"University of Bristol","ror":"https://ror.org/0524sp257","country_code":"GB","type":"education","lineage":["https://openalex.org/I36234482"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Mike Fraser","raw_affiliation_strings":["Deparment of Computer Science, University of Bristol, Bristol, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0001-9374-3759","affiliations":[{"raw_affiliation_string":"Deparment of Computer Science, University of Bristol, Bristol, United Kingdom","institution_ids":["https://openalex.org/I36234482"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":19.0866,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.98292875,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":91,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"19"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.5188999772071838,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.5188999772071838,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.14390000700950623,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.09189999848604202,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bespoke","display_name":"Bespoke","score":0.9412999749183655},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.6884999871253967},{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.6161999702453613},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6151000261306763},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5307000279426575},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.5077999830245972},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5055999755859375},{"id":"https://openalex.org/keywords/fused-filament-fabrication","display_name":"Fused filament fabrication","score":0.4966999888420105},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.4948999881744385}],"concepts":[{"id":"https://openalex.org/C44210515","wikidata":"https://www.wikidata.org/wiki/Q16968978","display_name":"Bespoke","level":2,"score":0.9412999749183655},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.6884999871253967},{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.6161999702453613},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6151000261306763},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5307000279426575},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5077999830245972},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5055999755859375},{"id":"https://openalex.org/C2777510241","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused filament fabrication","level":3,"score":0.4966999888420105},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.4948999881744385},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4819999933242798},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4754999876022339},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.47429999709129333},{"id":"https://openalex.org/C64434820","wikidata":"https://www.wikidata.org/wiki/Q523366","display_name":"Digital Light Processing","level":3,"score":0.44760000705718994},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4399000108242035},{"id":"https://openalex.org/C2984377249","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printer","level":2,"score":0.39239999651908875},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.392300009727478},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.37310001254081726},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.36899998784065247},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.365200012922287},{"id":"https://openalex.org/C3020000807","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrically conductive","level":2,"score":0.35249999165534973},{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.3296999931335449},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.328900009393692},{"id":"https://openalex.org/C17511633","wikidata":"https://www.wikidata.org/wiki/Q830694","display_name":"SMT placement equipment","level":3,"score":0.32820001244544983},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.32249999046325684},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.31220000982284546},{"id":"https://openalex.org/C28719098","wikidata":"https://www.wikidata.org/wiki/Q44946","display_name":"Point (geometry)","level":2,"score":0.2994000017642975},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28839999437332153},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2833000123500824},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2782000005245209},{"id":"https://openalex.org/C2779747408","wikidata":"https://www.wikidata.org/wiki/Q211367","display_name":"Sheet metal","level":2,"score":0.27250000834465027},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.259799987077713},{"id":"https://openalex.org/C54290928","wikidata":"https://www.wikidata.org/wiki/Q4845080","display_name":"Wearable technology","level":3,"score":0.2587999999523163},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.25780001282691956}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3731459.3773307","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3731459.3773307","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3731459.3773307","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3731459.3773307","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction","raw_type":"proceedings-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":94,"referenced_works":["https://openalex.org/W1266913904","https://openalex.org/W1845382878","https://openalex.org/W2006306676","https://openalex.org/W2012606450","https://openalex.org/W2029055514","https://openalex.org/W2033310265","https://openalex.org/W2054044780","https://openalex.org/W2060652749","https://openalex.org/W2073953353","https://openalex.org/W2126240885","https://openalex.org/W2149241078","https://openalex.org/W2168018860","https://openalex.org/W2180067629","https://openalex.org/W2198727081","https://openalex.org/W2207283590","https://openalex.org/W2218683243","https://openalex.org/W2234795416","https://openalex.org/W2323970951","https://openalex.org/W2346808065","https://openalex.org/W2396596466","https://openalex.org/W2404856281","https://openalex.org/W2410055381","https://openalex.org/W2464320027","https://openalex.org/W2532886788","https://openalex.org/W2534558385","https://openalex.org/W2536183727","https://openalex.org/W2592368662","https://openalex.org/W2611427051","https://openalex.org/W2611629043","https://openalex.org/W2736870873","https://openalex.org/W2762149733","https://openalex.org/W2766624619","https://openalex.org/W2770823368","https://openalex.org/W2795599829","https://openalex.org/W2795650540","https://openalex.org/W2796418395","https://openalex.org/W2921164978","https://openalex.org/W2925130711","https://openalex.org/W2942288414","https://openalex.org/W2962947588","https://openalex.org/W2980462859","https://openalex.org/W3000996643","https://openalex.org/W3017640030","https://openalex.org/W3029740816","https://openalex.org/W3030149602","https://openalex.org/W3031942812","https://openalex.org/W3032137745","https://openalex.org/W3082978641","https://openalex.org/W3094083774","https://openalex.org/W3094897256","https://openalex.org/W3100353733","https://openalex.org/W3135980675","https://openalex.org/W3159598808","https://openalex.org/W3160586402","https://openalex.org/W3161716008","https://openalex.org/W3162148001","https://openalex.org/W3173369552","https://openalex.org/W3175737456","https://openalex.org/W3206866304","https://openalex.org/W4200385851","https://openalex.org/W4220676965","https://openalex.org/W4220811070","https://openalex.org/W4225096941","https://openalex.org/W4225117133","https://openalex.org/W4292421676","https://openalex.org/W4320519346","https://openalex.org/W4364374626","https://openalex.org/W4366547763","https://openalex.org/W4366548902","https://openalex.org/W4366549831","https://openalex.org/W4383682933","https://openalex.org/W4386077075","https://openalex.org/W4387801273","https://openalex.org/W4387835393","https://openalex.org/W4387835401","https://openalex.org/W4388872760","https://openalex.org/W4391968654","https://openalex.org/W4393300607","https://openalex.org/W4396832427","https://openalex.org/W4396832503","https://openalex.org/W4400818832","https://openalex.org/W4402721562","https://openalex.org/W4403333976","https://openalex.org/W4403334032","https://openalex.org/W4403334181","https://openalex.org/W4407941920","https://openalex.org/W4407941931","https://openalex.org/W4408807412","https://openalex.org/W4409735446","https://openalex.org/W4409736007","https://openalex.org/W4409736176","https://openalex.org/W4409748840","https://openalex.org/W4415536226","https://openalex.org/W6940972148"],"related_works":[],"abstract_inverted_index":{"Consumer-level":[0],"multi-material":[1],"3D":[2,57],"printing":[3],"with":[4],"conductive":[5,81],"thermoplastics":[6],"enables":[7],"fabrication":[8],"of":[9,25],"interactive":[10,60],"elements":[11],"for":[12,100],"bespoke":[13,104],"tangible":[14],"devices.":[15],"However,":[16],"large":[17],"feature":[18],"sizes,":[19],"high":[20],"resistance":[21],"materials,":[22],"and":[23,74,94,117,121,139],"limitations":[24],"printable":[26],"control":[27],"circuitry":[28],"mean":[29],"that":[30,50,113],"deployable":[31],"devices":[32],"cannot":[33],"be":[34],"printed":[35],"without":[36],"post-print":[37],"assembly":[38],"steps.":[39],"To":[40],"address":[41],"these":[42],"challenges,":[43],"we":[44,78,128],"present":[45],"Printegrated":[46,132],"Circuits,":[47],"a":[48,69,76],"technique":[49],"uses":[51],"traditional":[52],"electronics":[53],"as":[54,142,144],"material":[55],"to":[56],"print":[58],"self-contained":[59],"objects.":[61],"Embedded":[62],"PCBs":[63],"are":[64],"placed":[65],"into":[66,85,136],"recesses":[67],"during":[68],"pause":[70],"in":[71],"the":[72,98,108,131],"print,":[73],"through":[75],"process":[77,134],"term":[79],"Prinjection,":[80],"filament":[82],"is":[83],"injected":[84],"their":[86],"plated-through":[87],"holes.":[88],"This":[89],"automatically":[90],"creates":[91],"reliable":[92],"electrical":[93,120],"mechanical":[95,122],"contact,":[96],"eliminating":[97],"need":[99],"manual":[101],"wiring":[102],"or":[103],"connectors.":[105],"We":[106],"describe":[107],"custom":[109],"machine":[110],"code":[111],"generation":[112],"supports":[114],"our":[115,125],"approach,":[116],"characterise":[118],"its":[119],"properties.":[123],"With":[124],"6":[126],"demonstrations,":[127],"highlight":[129],"how":[130],"Circuits":[133],"fits":[135],"existing":[137],"design":[138],"prototyping":[140],"workflows":[141],"well":[143],"informs":[145],"future":[146],"research":[147],"agendas.":[148]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2026-03-09T00:00:00"}