{"id":"https://openalex.org/W4409282493","doi":"https://doi.org/10.1145/3676536.3676771","title":"A Processing-using-Memory Architecture for Commodity DRAM Devices with Enhanced Compatibility and Reliability","display_name":"A Processing-using-Memory Architecture for Commodity DRAM Devices with Enhanced Compatibility and Reliability","publication_year":2024,"publication_date":"2024-10-27","ids":{"openalex":"https://openalex.org/W4409282493","doi":"https://doi.org/10.1145/3676536.3676771"},"language":"en","primary_location":{"id":"doi:10.1145/3676536.3676771","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676771","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676771","source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676771","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102189064","display_name":"Hoon Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]},{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hoon Shin","raw_affiliation_strings":["Samsung Electronics, Hwasung, Republic of Korea","Seoul National University, Seoul, Republic of Korea"],"raw_orcid":"https://orcid.org/0009-0002-7676-3058","affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwasung, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Seoul National University, Seoul, Republic of Korea","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051297622","display_name":"Rihae Park","orcid":null},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Rihae Park","raw_affiliation_strings":["Seoul National University, Seoul, Republic of Korea"],"raw_orcid":"https://orcid.org/0009-0000-0977-2478","affiliations":[{"raw_affiliation_string":"Seoul National University, Seoul, Republic of Korea","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100415731","display_name":"Jae W. Lee","orcid":"https://orcid.org/0000-0002-4266-4919"},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae W. Lee","raw_affiliation_strings":["Seoul National University, Seoul, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0002-4266-4919","affiliations":[{"raw_affiliation_string":"Seoul National University, Seoul, Republic of Korea","institution_ids":["https://openalex.org/I139264467"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.30601093,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.9089809656143188},{"id":"https://openalex.org/keywords/compatibility","display_name":"Compatibility (geochemistry)","score":0.7847421169281006},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5955235362052917},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.5409948825836182},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5390872359275818},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5080978870391846},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46383318305015564},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3774203360080719},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.24761894345283508},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.15016132593154907},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1445813775062561}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.9089809656143188},{"id":"https://openalex.org/C2778648169","wikidata":"https://www.wikidata.org/wiki/Q967768","display_name":"Compatibility (geochemistry)","level":2,"score":0.7847421169281006},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5955235362052917},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.5409948825836182},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5390872359275818},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5080978870391846},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46383318305015564},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3774203360080719},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.24761894345283508},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.15016132593154907},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1445813775062561},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3676536.3676771","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676771","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676771","source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3676536.3676771","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676771","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676771","source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3436121829","display_name":null,"funder_award_id":"RS-2024-00405857","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"}],"funders":[{"id":"https://openalex.org/F4320315121","display_name":"Samsung Advanced Institute of Technology","ror":null},{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320328359","display_name":"Ministry of Science and ICT, South Korea","ror":"https://ror.org/01wpjm123"},{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4409282493.pdf","grobid_xml":"https://content.openalex.org/works/W4409282493.grobid-xml"},"referenced_works_count":28,"referenced_works":["https://openalex.org/W1981220134","https://openalex.org/W1992487929","https://openalex.org/W2032227140","https://openalex.org/W2034861439","https://openalex.org/W2096973557","https://openalex.org/W2158319074","https://openalex.org/W2169370030","https://openalex.org/W2170257519","https://openalex.org/W2238633138","https://openalex.org/W2332254524","https://openalex.org/W2518511512","https://openalex.org/W2605347906","https://openalex.org/W2760882153","https://openalex.org/W2765234579","https://openalex.org/W2766489088","https://openalex.org/W2809205380","https://openalex.org/W2979874885","https://openalex.org/W2980688670","https://openalex.org/W3016765354","https://openalex.org/W3100710793","https://openalex.org/W3134274954","https://openalex.org/W3147974890","https://openalex.org/W3155004489","https://openalex.org/W3189166979","https://openalex.org/W3214176793","https://openalex.org/W4211095909","https://openalex.org/W4211105506","https://openalex.org/W4283276755"],"related_works":["https://openalex.org/W3120961607","https://openalex.org/W4401568740","https://openalex.org/W3148568549","https://openalex.org/W2098207691","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W2161286015","https://openalex.org/W2269474412","https://openalex.org/W2433923775","https://openalex.org/W2038503502"],"abstract_inverted_index":{"Processing-in-memory":[0],"(PIM)":[1],"paradigm":[2,27],"is":[3,66],"a":[4,108],"promising":[5],"solution":[6],"to":[7,24,76,85,89,125,143,159,172,200],"minimize":[8],"the":[9,15,29,126,154,220,223],"cost":[10],"of":[11,99],"data":[12],"movement":[13],"in":[14,28,41,49,153,176],"von":[16],"Neumann":[17],"architecture.":[18],"Many":[19],"proposals":[20],"have":[21,73],"explored":[22],"possibilities":[23],"realize":[25],"this":[26],"main":[30],"memory":[31,58],"leveraging":[32],"DRAM":[33,94,113],"technologies.":[34],"DRAM-based":[35,69],"PIM":[36],"technology":[37],"can":[38],"be":[39],"implemented":[40],"two":[42,150],"ways:":[43],"processing-in-memory":[44],"with":[45,92],"digital":[46,61],"compute":[47,62],"units":[48,63],"peripheral":[50],"area":[51,130],"and":[52,97,188,235],"processing-using-memory":[53],"(PUM).":[54],"Although":[55],"computing":[56],"within":[57],"cells":[59,141],"without":[60,163],"at":[64],"peripherals":[65],"certainly":[67],"appealing,":[68],"PUM":[70,87,202,225],"architectures":[71,226],"still":[72],"various":[74,174],"limitations":[75],"overcome.":[77],"In":[78],"particular,":[79],"we":[80,105],"identify":[81],"three":[82],"major":[83],"challenges":[84],"bring":[86],"closer":[88],"production:":[90],"compatibility":[91,234],"commodity":[93],"microarchitecture,":[95],"reliability,":[96],"coverage":[98],"operations.":[100],"To":[101],"address":[102],"these":[103],"challenges,":[104],"propose":[106],"PRADA,":[107,177],"Processing-using-Memory":[109],"Architecture":[110],"based":[111],"on":[112],"cell":[114,129],"Array.":[115],"Unlike":[116],"existing":[117],"proposals,":[118],"PRADA":[119,148,204,215],"does":[120],"not":[121,132,178],"introduce":[122],"any":[123,164],"changes":[124],"highly":[127],"optimized":[128],"by":[131],"utilizing":[133],"either":[134],"designated":[135],"rows":[136],"for":[137,209],"computation":[138],"or":[139],"dual-contact":[140],"(DCCs)":[142],"implement":[144,160,173],"NOT":[145,161],"operation.":[146],"Instead,":[147],"proposes":[149],"new":[151,165],"states":[152],"bitline":[155,196],"sense":[156],"amplifier":[157],"(BLSA)":[158],"operation":[162],"additional":[166],"circuitry.":[167],"We":[168],"also":[169,184],"demonstrate":[170],"how":[171],"operations":[175,182],"only":[179],"bit-wise":[180],"logical":[181],"but":[183],"both":[185],"integer":[186,211],"(INT)":[187],"floating-point":[189],"(FP)":[190],"arithmetic":[191],"operations,":[192],"while":[193,231],"ensuring":[194],"reliable":[195],"(BL)":[197],"sensing.":[198],"Compared":[199],"state-of-the-art":[201],"architectures,":[203],"demonstrates":[205],"2.67--4.79\u00d7":[206],"higher":[207],"throughput":[208],"8-bit":[210],"multiply.":[212],"For":[213],"vector-ADD,":[214],"achieves":[216],"3.09--3.13\u00d7":[217],"speedups":[218],"over":[219],"baseline,":[221],"outperforming":[222],"other":[224],"which":[227],"show":[228],"1.04--2.07\u00d7":[229],"speedups,":[230],"maintaining":[232],"superior":[233],"reliability.":[236]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}