{"id":"https://openalex.org/W4409285482","doi":"https://doi.org/10.1145/3676536.3676764","title":"Differentiable Edge-based OPC","display_name":"Differentiable Edge-based OPC","publication_year":2024,"publication_date":"2024-10-27","ids":{"openalex":"https://openalex.org/W4409285482","doi":"https://doi.org/10.1145/3676536.3676764"},"language":"en","primary_location":{"id":"doi:10.1145/3676536.3676764","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676764","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676764","source":null,"license":"cc-by-nc-sa","license_id":"https://openalex.org/licenses/cc-by-nc-sa","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676764","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081240313","display_name":"Guojin Chen","orcid":"https://orcid.org/0000-0001-9457-9583"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Guojin Chen","raw_affiliation_strings":["The Chinese University of HongKong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of HongKong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100642435","display_name":"Haoyu Yang","orcid":"https://orcid.org/0000-0002-4709-0061"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Haoyu Yang","raw_affiliation_strings":["NVIDIA Research, Austin, USA"],"affiliations":[{"raw_affiliation_string":"NVIDIA Research, Austin, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029928585","display_name":"Haoxing Ren","orcid":"https://orcid.org/0000-0003-1028-3860"},"institutions":[{"id":"https://openalex.org/I4210127875","display_name":"Nvidia (United States)","ror":"https://ror.org/03jdj4y14","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Haoxing Mark Ren","raw_affiliation_strings":["NVIDIA Research, Austin, USA"],"affiliations":[{"raw_affiliation_string":"NVIDIA Research, Austin, USA","institution_ids":["https://openalex.org/I4210127875"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051340429","display_name":"Bei Yu","orcid":"https://orcid.org/0000-0001-6406-4810"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bei Yu","raw_affiliation_strings":["The Chinese University of HongKong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of HongKong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas, USA","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5081240313"],"corresponding_institution_ids":["https://openalex.org/I177725633"],"apc_list":null,"apc_paid":null,"fwci":0.8878,"has_fulltext":true,"cited_by_count":4,"citation_normalized_percentile":{"value":0.7576326,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10791","display_name":"Advanced Control Systems Optimization","score":0.9646999835968018,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9617000222206116,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.5094903111457825},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45885398983955383},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.136525958776474}],"concepts":[{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5094903111457825},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45885398983955383},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.136525958776474}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3676536.3676764","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676764","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676764","source":null,"license":"cc-by-nc-sa","license_id":"https://openalex.org/licenses/cc-by-nc-sa","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3676536.3676764","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676764","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676764","source":null,"license":"cc-by-nc-sa","license_id":"https://openalex.org/licenses/cc-by-nc-sa","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4409285482.pdf","grobid_xml":"https://content.openalex.org/works/W4409285482.grobid-xml"},"referenced_works_count":18,"referenced_works":["https://openalex.org/W21269541","https://openalex.org/W2011207560","https://openalex.org/W2036552973","https://openalex.org/W2056830856","https://openalex.org/W2149602086","https://openalex.org/W2751894798","https://openalex.org/W2809465272","https://openalex.org/W2911061557","https://openalex.org/W2946543926","https://openalex.org/W3002278669","https://openalex.org/W3047198287","https://openalex.org/W3111433944","https://openalex.org/W3112693398","https://openalex.org/W4200483799","https://openalex.org/W4319993468","https://openalex.org/W4386763932","https://openalex.org/W6647703725","https://openalex.org/W6799327957"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Optical":[0],"proximity":[1],"correction":[2],"(OPC)":[3],"is":[4],"crucial":[5],"for":[6,148,156],"pushing":[7],"the":[8,15,74,108,113,135,138,145],"boundaries":[9],"of":[10,18,76,141],"semiconductor":[11,158],"manufacturing":[12,125],"and":[13,38,42,54,80,144],"enabling":[14],"continued":[16],"scaling":[17],"integrated":[19],"circuits.":[20],"While":[21],"pixel-based":[22,142],"OPC,":[23],"termed":[24],"as":[25],"inverse":[26],"lithography":[27],"technology":[28],"(ILT),":[29],"has":[30],"gained":[31],"research":[32],"interest":[33],"due":[34],"to":[35,47,112,130],"its":[36],"flexibility":[37],"precision.":[39],"Its":[40],"complexity":[41],"intricate":[43],"features":[44],"can":[45],"lead":[46],"challenges":[48],"in":[49],"mask":[50,85,93,98,114],"writing,":[51],"increased":[52],"defects,":[53],"higher":[55],"costs,":[56],"hence":[57],"hindering":[58],"widespread":[59],"industrial":[60,149],"adoption.":[61],"In":[62],"this":[63],"paper,":[64],"we":[65],"propose":[66],"DiffOPC,":[67],"a":[68,84,153],"differentiable":[69],"OPC":[70,79,132,143],"framework":[71],"that":[72],"enjoys":[73],"virtue":[75],"both":[77],"edge-based":[78],"ILT.":[81],"By":[82],"employing":[83],"rule-aware":[86],"gradient-based":[87],"optimization":[88],"approach,":[89],"DiffOPC":[90],"efficiently":[91],"guides":[92],"edge":[94,120],"segment":[95],"movement":[96],"during":[97],"optimization,":[99],"minimizing":[100],"wafer":[101],"error":[102,122],"by":[103,127],"propagating":[104],"true":[105],"gradients":[106],"from":[107],"cost":[109,126],"function":[110],"back":[111],"edges.":[115],"Our":[116],"approach":[117],"achieves":[118],"lower":[119],"placement":[121],"while":[123],"reducing":[124],"half":[128],"compared":[129],"state-of-the-art":[131],"techniques,":[133],"bridging":[134],"gap":[136],"between":[137],"high":[139],"accuracy":[140],"practicality":[146],"required":[147],"adoption,":[150],"thus":[151],"offering":[152],"promising":[154],"solution":[155],"advanced":[157],"manufacturing.":[159]},"counts_by_year":[{"year":2025,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
