{"id":"https://openalex.org/W4409282664","doi":"https://doi.org/10.1145/3676536.3676716","title":"A Co-optimization Framework with Multi-layer Constraints for Manufacturability","display_name":"A Co-optimization Framework with Multi-layer Constraints for Manufacturability","publication_year":2024,"publication_date":"2024-10-27","ids":{"openalex":"https://openalex.org/W4409282664","doi":"https://doi.org/10.1145/3676536.3676716"},"language":"en","primary_location":{"id":"doi:10.1145/3676536.3676716","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676716","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676716","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676716","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5045304391","display_name":"Guohao Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guohao Chen","raw_affiliation_strings":["School of Microelectronics, Fudan University, Shanghai, China"],"raw_orcid":"https://orcid.org/0009-0008-0810-1419","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Fudan University, Shanghai, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Chang Liu","orcid":"https://orcid.org/0009-0003-6164-4731"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chang Liu","raw_affiliation_strings":["School of Microelectronics, Fudan University, Shanghai, China"],"raw_orcid":"https://orcid.org/0009-0003-6164-4731","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Fudan University, Shanghai, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066750673","display_name":"Xingyu Tong","orcid":"https://orcid.org/0000-0001-9057-9172"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xingyu Tong","raw_affiliation_strings":["School of Microelectronics, Fudan University, Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0001-9057-9172","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Fudan University, Shanghai, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002478857","display_name":"Peng Zou","orcid":"https://orcid.org/0000-0002-8345-0976"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Peng Zou","raw_affiliation_strings":["Shanghai LEDA Technology Co., Ltd., Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0002-8345-0976","affiliations":[{"raw_affiliation_string":"Shanghai LEDA Technology Co., Ltd., Shanghai, China","institution_ids":[]}]},{"author_position":"last","author":{"id":null,"display_name":"Jianli Chen","orcid":"https://orcid.org/0000-0001-6773-6248"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]},{"id":"https://openalex.org/I4210132426","display_name":"Shanghai Fudan Microelectronics (China)","ror":"https://ror.org/02vfj3j86","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210132426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianli Chen","raw_affiliation_strings":["Key Laboratory of Computational Physical Sciences(Fudan University), Ministry of Education, Shanghai, China","School of Microelectronics, Fudan University, Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0001-6773-6248","affiliations":[{"raw_affiliation_string":"Key Laboratory of Computational Physical Sciences(Fudan University), Ministry of Education, Shanghai, China","institution_ids":["https://openalex.org/I24943067"]},{"raw_affiliation_string":"School of Microelectronics, Fudan University, Shanghai, China","institution_ids":["https://openalex.org/I4210132426","https://openalex.org/I24943067"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.925753653049469},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.588842511177063},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5360451340675354},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2190660834312439},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.20447617769241333},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.15017259120941162},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.12570762634277344}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.925753653049469},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.588842511177063},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5360451340675354},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2190660834312439},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.20447617769241333},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.15017259120941162},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.12570762634277344}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3676536.3676716","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676716","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676716","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3676536.3676716","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3676536.3676716","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3676536.3676716","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"sustainable_development_goals":[{"display_name":"Decent work and economic growth","id":"https://metadata.un.org/sdg/8","score":0.5199999809265137}],"awards":[{"id":"https://openalex.org/G2484272506","display_name":null,"funder_award_id":"2021YFA1003602","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3495785756","display_name":null,"funder_award_id":"92373207","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5200715922","display_name":null,"funder_award_id":"2022YFB4400500","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G6507269736","display_name":null,"funder_award_id":"2021YFA1003602","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G8609262062","display_name":null,"funder_award_id":"2022YFB4400500","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4409282664.pdf","grobid_xml":"https://content.openalex.org/works/W4409282664.grobid-xml"},"referenced_works_count":14,"referenced_works":["https://openalex.org/W1974376306","https://openalex.org/W1985878162","https://openalex.org/W2022147648","https://openalex.org/W2067939252","https://openalex.org/W2085461947","https://openalex.org/W2107458461","https://openalex.org/W2126301723","https://openalex.org/W2343563746","https://openalex.org/W2584186471","https://openalex.org/W2899615972","https://openalex.org/W3093788071","https://openalex.org/W3100108623","https://openalex.org/W4386763712","https://openalex.org/W4386764043"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2094969048","https://openalex.org/W994558755","https://openalex.org/W3035935536","https://openalex.org/W2010746423","https://openalex.org/W2117710422","https://openalex.org/W2372119205","https://openalex.org/W1787300689"],"abstract_inverted_index":{"Adherence":[0],"to":[1,151],"design":[2,34],"rule":[3,35],"constraints,":[4],"a":[5,89,95,113,137,142],"cornerstone":[6],"principle":[7],"of":[8,192],"Design":[9],"for":[10,15,30,84,126,167],"Manufacturability":[11],"(DFM),":[12],"is":[13,124,148],"essential":[14],"ensuring":[16],"successful":[17],"fabrication":[18],"in":[19,47,60,71,116,154,202],"modern":[20],"circuit":[21],"design.":[22],"As":[23],"the":[24,39,48,55,61,72,78,106,117,132,155,171,190,204,212],"foundries":[25],"keep":[26],"introducing":[27],"more":[28,90,96],"customization":[29],"better":[31,85,208],"performance,":[32],"new":[33],"challenges":[36],"emerge":[37],"with":[38,50,195,211],"device":[40],"layers,":[41],"such":[42,87],"as":[43,88,136],"implant":[44],"layer":[45,58,128],"constraints":[46,59,67],"designs":[49],"multiple":[51],"threshold":[52],"voltages,":[53],"and":[54,94,119,140,176],"trim":[56],"poly":[57],"self-aligned":[62],"double":[63],"patterning":[64],"(SADP).":[65],"These":[66],"are":[68,82],"typically":[69],"tackled":[70],"legalization":[73,118,156,168],"stage.":[74,157],"In":[75],"addition,":[76],"during":[77],"chip":[79,92],"finishing,":[80],"fillers":[81],"inserted":[83],"manufacturability,":[86],"uniform":[91],"surface":[93],"robust":[97],"power":[98],"integrity.":[99],"However,":[100],"improper":[101],"filler":[102,120,133,184],"insertion":[103,121,134,185],"might":[104],"undermine":[105],"previous":[107],"legalized":[108],"layout.":[109],"This":[110],"paper":[111],"presents":[112],"co-optimization":[114,205],"framework":[115,206],"stage,":[122],"which":[123,147],"extensible":[125],"other":[127],"constraints.":[129],"We":[130],"model":[131],"problem":[135],"multi-branch":[138],"tree":[139],"present":[141],"dynamic":[143],"programming-based":[144],"pre-pruning":[145],"algorithm,":[146],"also":[149],"able":[150],"detect":[152],"violations":[153,193],"To":[158],"reduce":[159,189],"runtime,":[160],"we":[161],"additionally":[162],"propose":[163],"two":[164],"violation":[165,200],"detectors":[166,201],"based":[169],"on":[170],"look-up":[172],"table":[173],"(LUT)":[174],"inference":[175],"greedy":[177],"algorithm.":[178],"Experimental":[179],"results":[180],"show":[181],"that":[182],"our":[183,199],"algorithm":[186],"can":[187],"significantly":[188],"number":[191],"compared":[194,210],"state-of-the-art":[196],"work.":[197],"With":[198],"legalization,":[203],"achieves":[207],"performance":[209],"commercial":[213],"tool.":[214]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}