{"id":"https://openalex.org/W4402172774","doi":"https://doi.org/10.1145/3670474.3685950","title":"Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation","display_name":"Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation","publication_year":2024,"publication_date":"2024-09-03","ids":{"openalex":"https://openalex.org/W4402172774","doi":"https://doi.org/10.1145/3670474.3685950"},"language":"en","primary_location":{"id":"doi:10.1145/3670474.3685950","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3670474.3685950","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101304143","display_name":"Haiyang He","orcid":"https://orcid.org/0000-0002-2701-8820"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Haiyang He","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070536710","display_name":"Norman Chang","orcid":"https://orcid.org/0000-0003-2524-0935"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Norman Chang","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104022619","display_name":"Akhilesh Kumar","orcid":"https://orcid.org/0000-0003-3649-771X"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Akhilesh Kumar","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102619085","display_name":"Jie Yang","orcid":"https://orcid.org/0000-0002-5839-0166"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jie Yang","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102496765","display_name":"Wenbo Xia","orcid":null},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wenbo Xia","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053653686","display_name":"Lang Lin","orcid":"https://orcid.org/0000-0001-7432-6722"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lang Lin","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111313339","display_name":"Jessica Yen","orcid":null},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jessica Yen","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079845726","display_name":"Haoliang Jiang","orcid":null},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Haoliang Jiang","raw_affiliation_strings":["Ansys, Inc"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018561547","display_name":"Rishikesh Ranade","orcid":"https://orcid.org/0000-0002-7692-7502"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rishikesh Ranade","raw_affiliation_strings":["NVIDIA"],"affiliations":[{"raw_affiliation_string":"NVIDIA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5101304143"],"corresponding_institution_ids":["https://openalex.org/I21160419"],"apc_list":null,"apc_paid":null,"fwci":0.2813,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.54415242,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11206","display_name":"Model Reduction and Neural Networks","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3109","display_name":"Statistical and Nonlinear Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11206","display_name":"Model Reduction and Neural Networks","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/3109","display_name":"Statistical and Nonlinear Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10339","display_name":"Advanced Numerical Methods in Computational Mathematics","score":0.982699990272522,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/superposition-principle","display_name":"Superposition principle","score":0.6867724657058716},{"id":"https://openalex.org/keywords/tile","display_name":"Tile","score":0.6586387753486633},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.583191990852356},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5550609827041626},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3971538543701172},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.34630101919174194},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34018608927726746},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.306308776140213},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2919005751609802},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.258340984582901},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19719916582107544},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.16615071892738342},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10599544644355774}],"concepts":[{"id":"https://openalex.org/C27753989","wikidata":"https://www.wikidata.org/wiki/Q284885","display_name":"Superposition principle","level":2,"score":0.6867724657058716},{"id":"https://openalex.org/C2780728851","wikidata":"https://www.wikidata.org/wiki/Q468402","display_name":"Tile","level":2,"score":0.6586387753486633},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.583191990852356},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5550609827041626},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3971538543701172},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.34630101919174194},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34018608927726746},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.306308776140213},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2919005751609802},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.258340984582901},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19719916582107544},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.16615071892738342},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10599544644355774}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3670474.3685950","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3670474.3685950","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1497099257","https://openalex.org/W2100807766","https://openalex.org/W2129434903","https://openalex.org/W2160654588","https://openalex.org/W2899283552","https://openalex.org/W3153200540","https://openalex.org/W3163993681","https://openalex.org/W3214470466","https://openalex.org/W4229451260","https://openalex.org/W4285103056","https://openalex.org/W4297822234","https://openalex.org/W4386764223","https://openalex.org/W4389166780"],"related_works":["https://openalex.org/W2114959296","https://openalex.org/W38346124","https://openalex.org/W2502442966","https://openalex.org/W2138666621","https://openalex.org/W2383936314","https://openalex.org/W1992771654","https://openalex.org/W2022661278","https://openalex.org/W2777914781","https://openalex.org/W4246369972","https://openalex.org/W4244869112"],"abstract_inverted_index":{"A":[0],"large":[1,69],"on-chip":[2],"peak":[3],"temperature":[4],"and":[5,12,27,31,73,90,109,135,175,187,202],"thermal":[6,14,34,67,97,136,147,205],"gradient,":[7],"caused":[8],"by":[9],"localized":[10],"hotspots":[11],"cross-die":[13],"coupling,":[15],"can":[16,59,158,182,197],"severely":[17],"impact":[18],"transistor":[19],"performance,":[20],"stress,":[21],"aging,":[22],"electromigration":[23],"(EM),":[24],"voltage":[25],"drops,":[26],"timing.":[28],"Generating":[29],"static":[30,201],"transient":[32,203],"chip":[33,204],"profiles":[35],"with":[36],"traditional":[37],"FEM/CFD":[38],"methods":[39],"have":[40],"prohibitively":[41],"expensive":[42],"computational":[43],"requirements,":[44],"especially":[45],"for":[46,85,96,106,149,207],"three-dimensional":[47],"integrated":[48],"circuits":[49],"(3DIC).":[50],"Even":[51],"though":[52],"data":[53,76],"driven":[54],"based":[55],"deep":[56,93,191],"learning":[57,123,192],"approaches":[58],"significantly":[60,183],"improve":[61,184],"the":[62,87,102,145,161,166,185],"efficiency":[63,89,189],"of":[64,71,92,133,165,190],"obtaining":[65],"accurate":[66],"profiles,":[68],"amounts":[70],"high-quality":[72],"diverse":[74],"training":[75,188],"are":[77,139],"required.":[78],"Therefore,":[79],"there":[80],"is":[81],"an":[82],"urgent":[83],"need":[84],"improving":[86],"data/training":[88],"generalizability":[91,186],"learning-based":[94],"models":[95],"applications.":[98],"This":[99,155],"investigation":[100],"leverages":[101],"\"linear":[103],"superposition":[104],"principle\"":[105],"linear":[107],"systems":[108],"divides":[110],"a":[111,150,170],"complex":[112],"power":[113,134,153,167],"pattern":[114],"into":[115],"\"per-tile":[116],"activation\"":[117],"scenarios.":[118],"The":[119,194],"predictions":[120],"from":[121],"machine":[122],"(ML)":[124],"model":[125],"trained":[126],"on":[127],"per-tile":[128],"activation":[129],"data,":[130],"which":[131],"consists":[132],"response":[137,148],"pairs,":[138],"then":[140],"linearly":[141],"combined":[142],"to":[143,169,200],"generate":[144],"total":[146],"given":[151],"arbitrary":[152],"pattern.":[154],"novel":[156],"approach":[157,196],"substantially":[159],"reduce":[160],"infinite":[162],"design":[163,173],"space":[164],"patterns":[168],"small":[171],"finite":[172],"space,":[174],"it":[176,181],"has":[177],"been":[178],"validated":[179],"that":[180],"models.":[193],"proposed":[195],"be":[198],"applied":[199],"simulation":[206],"3DIC.":[208]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}