{"id":"https://openalex.org/W4402349370","doi":"https://doi.org/10.1145/3665314.3680473","title":"Design Approach for Die-to-Die Interfaces to Enable Energy-Efficient Chiplet Systems","display_name":"Design Approach for Die-to-Die Interfaces to Enable Energy-Efficient Chiplet Systems","publication_year":2024,"publication_date":"2024-08-05","ids":{"openalex":"https://openalex.org/W4402349370","doi":"https://doi.org/10.1145/3665314.3680473"},"language":"en","primary_location":{"id":"doi:10.1145/3665314.3680473","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3665314.3680473","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1145/3665314.3680473","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074485526","display_name":"Vikram Jain","orcid":"https://orcid.org/0000-0002-1267-1683"},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vikram Jain","raw_affiliation_strings":["University of California, Berkeley, Berkeley, CA, United States"],"raw_orcid":"https://orcid.org/0000-0002-1267-1683","affiliations":[{"raw_affiliation_string":"University of California, Berkeley, Berkeley, CA, United States","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063342536","display_name":"Wei Tang","orcid":"https://orcid.org/0000-0001-5204-9728"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Tang","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, United States"],"raw_orcid":"https://orcid.org/0000-0001-5204-9728","affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, United States","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037121757","display_name":"Zuoguo Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zuoguo Wu","raw_affiliation_strings":["Intel Corporation, Santa Clara, CA, United States"],"raw_orcid":"https://orcid.org/0009-0004-0878-963X","affiliations":[{"raw_affiliation_string":"Intel Corporation, Santa Clara, CA, United States","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5107078856","display_name":"Viansa Schmulbach","orcid":null},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Viansa Schmulbach","raw_affiliation_strings":["University of California, Berkeley, Berkeley, CA, United States"],"raw_orcid":"https://orcid.org/0009-0006-5716-2870","affiliations":[{"raw_affiliation_string":"University of California, Berkeley, Berkeley, CA, United States","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113373476","display_name":"Sophia Shao","orcid":null},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sophia Shao","raw_affiliation_strings":["University of California, Berkeley, Berkeley, CA, United States"],"raw_orcid":"https://orcid.org/0000-0003-1811-5407","affiliations":[{"raw_affiliation_string":"University of California, Berkeley, Berkeley, CA, United States","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038110244","display_name":"Zhengya Zhang","orcid":"https://orcid.org/0000-0001-5963-9018"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhengya Zhang","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, United States"],"raw_orcid":"https://orcid.org/0000-0001-5963-9018","affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, United States","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041784384","display_name":"Borivoje Nikoli\u0107","orcid":"https://orcid.org/0000-0003-2324-1715"},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Borivoje Nikolic","raw_affiliation_strings":["University of California, Berkeley, Berkeley, CA, United States"],"raw_orcid":"https://orcid.org/0000-0003-2324-1715","affiliations":[{"raw_affiliation_string":"University of California, Berkeley, Berkeley, CA, United States","institution_ids":["https://openalex.org/I95457486"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.7068,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.91481481,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9894999861717224,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9757000207901001,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.8171387910842896},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5665122866630554},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1079651415348053}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.8171387910842896},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5665122866630554},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1079651415348053}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3665314.3680473","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3665314.3680473","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3665314.3680473","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3665314.3680473","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design","raw_type":"proceedings-article"},"sustainable_development_goals":[{"score":0.8600000143051147,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"},{"id":"https://openalex.org/F4320307102","display_name":"Intel Corporation","ror":"https://ror.org/01ek73717"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1806144281","https://openalex.org/W3027968530","https://openalex.org/W3186384115","https://openalex.org/W4390284934","https://openalex.org/W4392255268"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2042913821","https://openalex.org/W2372289614","https://openalex.org/W2629813803","https://openalex.org/W2041067810","https://openalex.org/W2250518232","https://openalex.org/W3199170188","https://openalex.org/W2360137025","https://openalex.org/W2362738566"],"abstract_inverted_index":{"Heterogeneous":[0],"chiplet":[1,24,128,138,188,209],"integration":[2,129,139],"and":[3,39,51,74,78,115,157,206],"advanced":[4],"packaging":[5,40,158],"have":[6,41],"given":[7],"a":[8,16,43,62,67,121,168,192],"new":[9],"lease":[10],"to":[11,167,173,185],"scaling":[12],"of":[13,22,31,58,91,98,105,152,197],"compute":[14],"in":[15,95],"post-Moore":[17],"era.":[18],"A":[19,132],"critical":[20],"aspect":[21],"designing":[23],"systems":[25,210],"is":[26,140,203],"die-to-die":[27,54,99],"interfaces":[28],"for":[29,69,137,211],"aggregation":[30],"smaller":[32],"disaggregated":[33],"chiplets.":[34],"In":[35,85],"recent":[36,93,134],"years,":[37],"interconnects":[38],"made":[42],"huge":[44],"leap":[45],"forward,":[46],"thereby,":[47],"enabling":[48,208],"high":[49,116],"bandwidth":[50],"energy-efficient":[52,79,212],"parallel":[53],"(D2D)":[55],"interfaces.":[56,100],"Instead":[57],"bespoke":[59],"solutions,":[60],"building":[61],"standardized":[63],"D2D":[64,199],"interface":[65],"provides":[66],"mechanism":[68],"interoperability":[70],"between":[71],"heterogeneous":[72],"chiplets":[73],"facilitates":[75],"low":[76],"power":[77,170],"design":[80],"by":[81,120,190],"prescribing":[82],"implementation":[83],"strategy.":[84],"this":[86],"paper,":[87],"we":[88,111,178],"discuss":[89,148,179],"some":[90],"the":[92,96,141,149,180,187,198],"efforts":[94],"standardization":[97],"Starting":[101],"with":[102],"an":[103,126,183],"overview":[104],"Advanced":[106],"Interface":[107],"Bus":[108],"(AIB)":[109],"PHY,":[110],"emphasize":[112],"its":[113,155],"simplicity":[114],"energy":[117],"efficiency.":[118],"Followed":[119],"case":[122],"study":[123],"that":[124,165],"demonstrates":[125],"effective":[127],"employing":[130],"AIB.":[131],"more":[133],"open":[135],"standard":[136],"Universal":[142],"Chiplet":[143],"Interconnect":[144],"Express":[145],"(UCIe).":[146],"We":[147],"key":[150],"aspects":[151],"UCIe,":[153],"including":[154],"electrical":[156],"characteristics,":[159],"as":[160,162],"well":[161],"low-power":[163],"features":[164],"lead":[166],"10x":[169],"reduction":[171],"compared":[172],"typical":[174],"off-package":[175],"I/O.":[176],"Finally,":[177],"UCIe-lite":[181],"controller,":[182],"effort":[184],"democratize":[186],"infrastructure":[189],"providing":[191],"simplified":[193],"open-source":[194],"RTL":[195],"generator":[196,202],"interface.":[200],"The":[201],"highly":[204],"parameterizable":[205],"lightweight,":[207],"applications.":[213]},"counts_by_year":[{"year":2026,"cited_by_count":4},{"year":2025,"cited_by_count":2}],"updated_date":"2026-07-31T08:31:51.225901","created_date":"2025-10-10T00:00:00"}