{"id":"https://openalex.org/W4408164092","doi":"https://doi.org/10.1145/3658617.3697754","title":"Efficient ML-Based Transient Thermal Prediction for 3D-ICs","display_name":"Efficient ML-Based Transient Thermal Prediction for 3D-ICs","publication_year":2025,"publication_date":"2025-01-20","ids":{"openalex":"https://openalex.org/W4408164092","doi":"https://doi.org/10.1145/3658617.3697754"},"language":"en","primary_location":{"id":"doi:10.1145/3658617.3697754","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3658617.3697754","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 30th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Yun-Feng Yang","orcid":"https://orcid.org/0009-0003-4334-9050"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yun-Feng Yang","raw_affiliation_strings":["National Taiwan Univ., Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0009-0003-4334-9050","affiliations":[{"raw_affiliation_string":"National Taiwan Univ., Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Wei-Shen Wang","orcid":"https://orcid.org/0009-0007-8114-4223"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wei-Shen Wang","raw_affiliation_strings":["National Taiwan Univ., Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0009-0007-8114-4223","affiliations":[{"raw_affiliation_string":"National Taiwan Univ., Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109730735","display_name":"Yung-Jen Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yung-Jen Lee","raw_affiliation_strings":["National Taiwan Univ., Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0009-0005-2983-023X","affiliations":[{"raw_affiliation_string":"National Taiwan Univ., Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017361488","display_name":"James Chien-Mo Li","orcid":"https://orcid.org/0000-0002-4393-5186"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"James Chien-Mo Li","raw_affiliation_strings":["National Taiwan Univ., Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-4393-5186","affiliations":[{"raw_affiliation_string":"National Taiwan Univ., Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070536710","display_name":"Norman Chang","orcid":"https://orcid.org/0000-0003-2524-0935"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Norman Chang","raw_affiliation_strings":["Ansys, San Jose, USA"],"raw_orcid":"https://orcid.org/0000-0003-2524-0935","affiliations":[{"raw_affiliation_string":"Ansys, San Jose, USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104022619","display_name":"Akhilesh Kumar","orcid":"https://orcid.org/0000-0003-3649-771X"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Akhilesh Kumar","raw_affiliation_strings":["Ansys, San Jose, USA"],"raw_orcid":"https://orcid.org/0000-0003-3649-771X","affiliations":[{"raw_affiliation_string":"Ansys, San Jose, USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025074294","display_name":"Ying\u2013Shiun Li","orcid":null},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ying-Shiun Li","raw_affiliation_strings":["Ansys, San Jose, USA"],"raw_orcid":"https://orcid.org/0009-0000-3793-3072","affiliations":[{"raw_affiliation_string":"Ansys, San Jose, USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111313339","display_name":"Jessica Yen","orcid":null},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jessica Yen","raw_affiliation_strings":["Ansys, San Jose, USA"],"raw_orcid":"https://orcid.org/0009-0001-8469-1720","affiliations":[{"raw_affiliation_string":"Ansys, San Jose, USA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5053653686","display_name":"Lang Lin","orcid":"https://orcid.org/0000-0001-7432-6722"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lang Lin","raw_affiliation_strings":["Ansys, San Jose, USA"],"raw_orcid":"https://orcid.org/0000-0001-7432-6722","affiliations":[{"raw_affiliation_string":"Ansys, San Jose, USA","institution_ids":["https://openalex.org/I21160419"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"628","last_page":"634"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.732491135597229},{"id":"https://openalex.org/keywords/transient-analysis","display_name":"Transient analysis","score":0.5976048707962036},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48453396558761597},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.47537389397621155},{"id":"https://openalex.org/keywords/transient-response","display_name":"Transient response","score":0.23123645782470703},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17023345828056335},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.16018840670585632},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10106498003005981},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08738058805465698},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.07630616426467896}],"concepts":[{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.732491135597229},{"id":"https://openalex.org/C2989121073","wikidata":"https://www.wikidata.org/wiki/Q1309019","display_name":"Transient analysis","level":3,"score":0.5976048707962036},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48453396558761597},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.47537389397621155},{"id":"https://openalex.org/C85761212","wikidata":"https://www.wikidata.org/wiki/Q1974593","display_name":"Transient response","level":2,"score":0.23123645782470703},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17023345828056335},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16018840670585632},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10106498003005981},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08738058805465698},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07630616426467896}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3658617.3697754","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3658617.3697754","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 30th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2015102462","https://openalex.org/W2025110944","https://openalex.org/W2295598076","https://openalex.org/W2900015380","https://openalex.org/W2942961753","https://openalex.org/W4229451260","https://openalex.org/W4297983972","https://openalex.org/W4318325609","https://openalex.org/W4382052367","https://openalex.org/W4386764223","https://openalex.org/W4390117215"],"related_works":["https://openalex.org/W2758798772","https://openalex.org/W2081338125","https://openalex.org/W4406350055","https://openalex.org/W4239924455","https://openalex.org/W2001630809","https://openalex.org/W4244925124","https://openalex.org/W2377879397","https://openalex.org/W1577327694","https://openalex.org/W2887517211","https://openalex.org/W1909312109"],"abstract_inverted_index":{"Thermal":[0],"issues":[1],"of":[2,33,99],"3D-ICs":[3],"have":[4],"become":[5],"increasingly":[6],"severe":[7],"in":[8],"recent":[9],"years.":[10],"Thus,":[11],"thermal":[12,18,26,44,62,159,166],"simulation":[13,27],"is":[14,46,128,134],"needed":[15],"to":[16,50,110,147,164],"ensure":[17,165],"safety":[19],"during":[20],"the":[21,52,70,79,87,120,125,131,138],"design":[22],"stage.":[23],"However,":[24],"performing":[25],"iteratively":[28],"requires":[29],"a":[30,36,38,47,60,143,148],"significant":[31],"amount":[32],"time.":[34,54],"As":[35],"result,":[37],"fast":[39,61],"and":[40,84,103,113,130,162],"accurate":[41],"method":[42,64],"for":[43,78,86,124],"prediction":[45,63,93,139],"promising":[48],"alternative":[49],"improve":[51],"turnaround":[53],"In":[55,69,117,137],"this":[56],"paper,":[57],"we":[58,73,95,141],"propose":[59],"using":[65],"machine":[66],"learning":[67],"models.":[68],"training":[71],"phase,":[72,140],"employ":[74],"two":[75,97],"models:":[76],"one":[77],"initial":[80],"three":[81],"time":[82,89],"steps":[83],"another":[85],"subsequent":[88],"steps.":[90],"To":[91],"enhance":[92],"accuracy,":[94],"introduce":[96],"types":[98],"features:":[100],"spaced-windowed":[101],"features":[102,107],"time-decayed":[104],"features.":[105],"These":[106],"help":[108],"us":[109],"capture":[111],"spatial":[112],"temporal":[114],"information":[115],"effectively.":[116],"our":[118,152],"experiment,":[119],"mean":[121],"absolute":[122],"error":[123,133],"predicted":[126],"temperature":[127],"1.12\u00b0C,":[129],"maximum":[132],"7.27":[135],"\u00b0C.":[136],"achieve":[142],"116X":[144],"speed-up":[145],"compared":[146],"commercial":[149],"tool.":[150],"With":[151],"proposed":[153],"method,":[154],"users":[155],"can":[156],"predict":[157],"transient":[158],"profiles":[160],"quickly":[161],"accurately":[163],"safety.":[167]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}