{"id":"https://openalex.org/W4403334032","doi":"https://doi.org/10.1145/3654777.3676398","title":"E-Joint: Fabrication of Large-Scale Interactive Objects Assembled by 3D Printed Conductive Parts with Copper Plated Joints","display_name":"E-Joint: Fabrication of Large-Scale Interactive Objects Assembled by 3D Printed Conductive Parts with Copper Plated Joints","publication_year":2024,"publication_date":"2024-10-11","ids":{"openalex":"https://openalex.org/W4403334032","doi":"https://doi.org/10.1145/3654777.3676398"},"language":"en","primary_location":{"id":"doi:10.1145/3654777.3676398","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3654777.3676398","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 37th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087766268","display_name":"Xiaolong Li","orcid":"https://orcid.org/0009-0002-3794-5895"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiaolong Li","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056945835","display_name":"Cheng Yao","orcid":"https://orcid.org/0000-0001-6572-0242"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cheng Yao","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075357324","display_name":"Shang Shi","orcid":"https://orcid.org/0009-0008-2880-5069"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shang Shi","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020927932","display_name":"Shuyue Feng","orcid":"https://orcid.org/0000-0002-6720-5356"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]},{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Shuyue Feng","raw_affiliation_strings":["Zhejiang University, China and Massachusetts Institute of Technology, USA"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007","https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034639126","display_name":"Yujie Zhou","orcid":"https://orcid.org/0009-0008-6316-6346"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yujie Zhou","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102842916","display_name":"Haoye Dong","orcid":"https://orcid.org/0009-0008-7010-4565"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haoye Dong","raw_affiliation_strings":["Zhejiang university, China and Zhejiang university, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang university, China and Zhejiang university, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050168722","display_name":"Shichao Huang","orcid":"https://orcid.org/0009-0001-0473-8024"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shichao Huang","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083526834","display_name":"Xueyan Cai","orcid":"https://orcid.org/0009-0003-0348-4944"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xueyan Cai","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060086185","display_name":"Kecheng Jin","orcid":"https://orcid.org/0009-0006-7330-2087"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kecheng Jin","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033138817","display_name":"Fangtian Ying","orcid":"https://orcid.org/0000-0001-9047-0257"},"institutions":[{"id":"https://openalex.org/I111950717","display_name":"Macau University of Science and Technology","ror":"https://ror.org/03jqs2n27","country_code":"MO","type":"education","lineage":["https://openalex.org/I111950717","https://openalex.org/I4391767947"]}],"countries":["MO"],"is_corresponding":false,"raw_author_name":"Fangtian Ying","raw_affiliation_strings":["MACAU University of Science and Technology, China and MACAU University of Science and Technology, China"],"affiliations":[{"raw_affiliation_string":"MACAU University of Science and Technology, China and MACAU University of Science and Technology, China","institution_ids":["https://openalex.org/I111950717"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017439867","display_name":"Guanyun Wang","orcid":"https://orcid.org/0000-0002-7904-1504"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guanyun Wang","raw_affiliation_strings":["Zhejiang University, China and Zhejiang University, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University, China and Zhejiang University, China","institution_ids":["https://openalex.org/I76130692"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5087766268"],"corresponding_institution_ids":["https://openalex.org/I76130692"],"apc_list":null,"apc_paid":null,"fwci":0.214,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.51238054,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"18"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.7936998009681702},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7928576469421387},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.6466604471206665},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.5773249864578247},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.5457824468612671},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.491778165102005},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.4648949205875397},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4354096055030823},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.4332907795906067},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3530700206756592},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29000064730644226},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.24756190180778503},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.23871895670890808},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.19606086611747742},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.16996726393699646},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08008521795272827}],"concepts":[{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.7936998009681702},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7928576469421387},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.6466604471206665},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.5773249864578247},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.5457824468612671},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.491778165102005},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.4648949205875397},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4354096055030823},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.4332907795906067},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3530700206756592},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29000064730644226},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.24756190180778503},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23871895670890808},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.19606086611747742},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.16996726393699646},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08008521795272827},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3654777.3676398","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3654777.3676398","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 37th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":65,"referenced_works":["https://openalex.org/W2020579277","https://openalex.org/W2025411414","https://openalex.org/W2054044780","https://openalex.org/W2060508964","https://openalex.org/W2070028568","https://openalex.org/W2144575742","https://openalex.org/W2180120384","https://openalex.org/W2197150605","https://openalex.org/W2299673904","https://openalex.org/W2464320027","https://openalex.org/W2535425534","https://openalex.org/W2570279479","https://openalex.org/W2599924551","https://openalex.org/W2611783239","https://openalex.org/W2762149733","https://openalex.org/W2771160928","https://openalex.org/W2774657263","https://openalex.org/W2783831346","https://openalex.org/W2792703040","https://openalex.org/W2792890909","https://openalex.org/W2796038088","https://openalex.org/W2796259725","https://openalex.org/W2802485172","https://openalex.org/W2807854283","https://openalex.org/W2896631696","https://openalex.org/W2923403274","https://openalex.org/W2927787354","https://openalex.org/W2941350334","https://openalex.org/W2942288414","https://openalex.org/W2942318203","https://openalex.org/W2945275962","https://openalex.org/W2962947588","https://openalex.org/W2971887332","https://openalex.org/W2980885653","https://openalex.org/W3029740816","https://openalex.org/W3029978778","https://openalex.org/W3065991621","https://openalex.org/W3094897256","https://openalex.org/W3100353733","https://openalex.org/W3111690879","https://openalex.org/W3117426587","https://openalex.org/W3159598808","https://openalex.org/W3161065906","https://openalex.org/W3168016348","https://openalex.org/W3174701312","https://openalex.org/W3186949432","https://openalex.org/W3206866304","https://openalex.org/W3207363374","https://openalex.org/W3207372532","https://openalex.org/W4200437016","https://openalex.org/W4211039195","https://openalex.org/W4225004558","https://openalex.org/W4225096941","https://openalex.org/W4225110319","https://openalex.org/W4233331806","https://openalex.org/W4292421676","https://openalex.org/W4310904552","https://openalex.org/W4313588250","https://openalex.org/W4366547429","https://openalex.org/W4366547431","https://openalex.org/W4366547763","https://openalex.org/W4366550344","https://openalex.org/W4378710464","https://openalex.org/W4379054628","https://openalex.org/W4393300607"],"related_works":["https://openalex.org/W1955801659","https://openalex.org/W3036311796","https://openalex.org/W4367665844","https://openalex.org/W3004274744","https://openalex.org/W4285543619","https://openalex.org/W4319589397","https://openalex.org/W2582005554","https://openalex.org/W3131618301","https://openalex.org/W3158363272","https://openalex.org/W3033345549"],"abstract_inverted_index":{"The":[0,77],"advent":[1],"of":[2,28,37,44,114,128],"conductive":[3,39,48],"thermoplastic":[4],"filaments":[5],"and":[6,32,67,80,107,112,135],"multi-material":[7],"3D":[8,17,30,62],"printing":[9],"has":[10],"made":[11],"it":[12],"feasible":[13],"to":[14,24,139],"create":[15],"interactive":[16,49,133],"printed":[18,63],"objects.":[19],"Yet,":[20],"challenges":[21],"arise":[22],"due":[23],"the":[25,33,42,105,109,126,137],"volume":[26],"constraints":[27],"desktop":[29],"printers":[31],"high":[34],"resistive":[35],"characteristics":[36],"current":[38],"materials,":[40],"making":[41,131],"fabrication":[43,59],"large-scale":[45,132],"or":[46],"highly":[47],"objects":[50,64,134],"can":[51],"be":[52],"daunting.":[53],"We":[54,97],"propose":[55],"E-Joint,":[56],"a":[57,73,140],"novel":[58],"pipeline":[60],"for":[61,94,144],"utilizing":[65],"mortise":[66],"tenon":[68],"joint":[69,81,102],"structures":[70,82,103],"combined":[71],"with":[72,88,121],"copper":[74],"plating":[75],"process.":[76],"segmented":[78],"pieces":[79],"are":[83],"customized":[84],"in":[85,104,130],"software":[86],"along":[87],"integrated":[89,142],"circuits.":[90],"Then":[91],"electroplate":[92],"them":[93],"enhanced":[95],"conductivity.":[96],"designed":[98],"four":[99],"distinct":[100],"electrified":[101],"experiment":[106],"evaluated":[108],"practical":[110],"feasibility":[111],"effectiveness":[113],"fabricating":[115],"pipes.":[116],"By":[117],"constructing":[118],"three":[119],"applications":[120],"those":[122],"structures,":[123],"we":[124],"verified":[125],"usability":[127],"E-Joint":[129],"showed":[136],"path":[138],"more":[141],"future":[143],"manufacturing.":[145]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-03-09T08:58:05.943551","created_date":"2025-10-10T00:00:00"}