{"id":"https://openalex.org/W4399418629","doi":"https://doi.org/10.1145/3651671.3651722","title":"Defect detection for CCGA solder column based on machine vision","display_name":"Defect detection for CCGA solder column based on machine vision","publication_year":2024,"publication_date":"2024-02-02","ids":{"openalex":"https://openalex.org/W4399418629","doi":"https://doi.org/10.1145/3651671.3651722"},"language":"en","primary_location":{"id":"doi:10.1145/3651671.3651722","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3651671.3651722","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 16th International Conference on Machine Learning and Computing","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062453611","display_name":"Q. Hou","orcid":"https://orcid.org/0009-0002-6715-3661"},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Qili Hou","raw_affiliation_strings":["The 38th Research Institute of China Electronics Technology Group Corporation, China"],"raw_orcid":"https://orcid.org/0009-0002-6715-3661","affiliations":[{"raw_affiliation_string":"The 38th Research Institute of China Electronics Technology Group Corporation, China","institution_ids":["https://openalex.org/I2800372957"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016996154","display_name":"Yang Wang","orcid":"https://orcid.org/0009-0007-3328-722X"},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Wang","raw_affiliation_strings":["The 38th Research Institute of China Electronics Technology Group Corporation, China"],"raw_orcid":"https://orcid.org/0009-0007-3328-722X","affiliations":[{"raw_affiliation_string":"The 38th Research Institute of China Electronics Technology Group Corporation, China","institution_ids":["https://openalex.org/I2800372957"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013980496","display_name":"B Chen","orcid":"https://orcid.org/0009-0001-7221-8987"},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Banghua Chen","raw_affiliation_strings":["The 38th Research Institute of China Electronics Technology Group Corporation, China"],"raw_orcid":"https://orcid.org/0009-0001-7221-8987","affiliations":[{"raw_affiliation_string":"The 38th Research Institute of China Electronics Technology Group Corporation, China","institution_ids":["https://openalex.org/I2800372957"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063667989","display_name":"Song Xu","orcid":"https://orcid.org/0009-0006-2836-7412"},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Song Xu","raw_affiliation_strings":["The 38th Research Institute of China Electronics Technology Group Corporation, China"],"raw_orcid":"https://orcid.org/0009-0006-2836-7412","affiliations":[{"raw_affiliation_string":"The 38th Research Institute of China Electronics Technology Group Corporation, China","institution_ids":["https://openalex.org/I2800372957"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103124120","display_name":"Lihong Yang","orcid":"https://orcid.org/0009-0003-6927-5395"},"institutions":[{"id":"https://openalex.org/I2800372957","display_name":"China Electronics Technology Group Corporation","ror":"https://ror.org/0098hst83","country_code":"CN","type":"company","lineage":["https://openalex.org/I2800372957"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lihong Yang","raw_affiliation_strings":["The 38th Research Institute of China Electronics Technology Group Corporation, China"],"raw_orcid":"https://orcid.org/0009-0003-6927-5395","affiliations":[{"raw_affiliation_string":"The 38th Research Institute of China Electronics Technology Group Corporation, China","institution_ids":["https://openalex.org/I2800372957"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5062453611"],"corresponding_institution_ids":["https://openalex.org/I2800372957"],"apc_list":null,"apc_paid":null,"fwci":0.3331,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.59644962,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"264","last_page":"270"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9901999831199646,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9650999903678894,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.6917088627815247},{"id":"https://openalex.org/keywords/factory","display_name":"Factory (object-oriented programming)","score":0.6525552272796631},{"id":"https://openalex.org/keywords/column","display_name":"Column (typography)","score":0.5988133549690247},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5371385812759399},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5060147643089294},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.43855953216552734},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.4295658469200134},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3029840886592865},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08749741315841675}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6917088627815247},{"id":"https://openalex.org/C40149104","wikidata":"https://www.wikidata.org/wiki/Q5620977","display_name":"Factory (object-oriented programming)","level":2,"score":0.6525552272796631},{"id":"https://openalex.org/C2780551164","wikidata":"https://www.wikidata.org/wiki/Q2306599","display_name":"Column (typography)","level":3,"score":0.5988133549690247},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5371385812759399},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5060147643089294},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.43855953216552734},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.4295658469200134},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3029840886592865},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08749741315841675},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3651671.3651722","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3651671.3651722","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 16th International Conference on Machine Learning and Computing","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W3022559085","https://openalex.org/W3022747990","https://openalex.org/W3105505907","https://openalex.org/W3157386224","https://openalex.org/W4294093755"],"related_works":["https://openalex.org/W2367566533","https://openalex.org/W2187937315","https://openalex.org/W1983256527","https://openalex.org/W2297830036","https://openalex.org/W2113862045","https://openalex.org/W2384038313","https://openalex.org/W2378851622","https://openalex.org/W2349280512","https://openalex.org/W2358895457","https://openalex.org/W1869907491"],"abstract_inverted_index":{"With":[0],"the":[1,42,54,88,123,131,148],"characteristics":[2],"of":[3,70,73,150],"high":[4],"I/O":[5],"packaging":[6,17],"density":[7],"and":[8,53,80,90,112,130],"excellent":[9],"electrothermal":[10],"performance,":[11],"ceramic":[12],"column":[13],"grid":[14],"array":[15],"(CCGA)":[16],"has":[18,49,83,101,126],"been":[19,84,102,116],"widely":[20],"used":[21],"in":[22,143],"highly":[23],"reliable":[24],"applications":[25],"such":[26],"as":[27],"aerospace.":[28],"For":[29],"CCGA":[30,95,155],"solder":[31,96,156],"column,":[32],"defect":[33,92,152],"detection":[34,47,51,93,132,138,153],"needs":[35,149],"to":[36,86],"be":[37],"applied":[38],"before":[39],"it":[40],"leaves":[41],"factory.":[43],"The":[44,98,118,140],"traditional":[45],"manual":[46,137],"method":[48],"low":[50],"efficiency":[52],"detect":[55],"accuracy":[56,133],"is":[57,134],"greatly":[58],"influenced":[59],"by":[60],"human":[61],"subjective":[62],"factors.":[63],"Aiming":[64],"at":[65],"this":[66,144],"problem,":[67],"a":[68],"set":[69],"algorithm":[71,100,125,141],"consists":[72],"digital":[74],"image":[75],"processing":[76],"method,":[77],"Yolov3":[78],"network":[79,82],"U-Net":[81],"combined":[85],"realize":[87],"surface":[89],"inner":[91],"for":[94,154],"column.":[97,157],"whole":[99,124],"embedded":[103],"into":[104],"industrial":[105],"software":[106],"system":[107],"based":[108],"on":[109],"Qt":[110],"environment":[111],"field":[113],"experiments":[114],"have":[115],"applied.":[117],"experiment":[119],"results":[120],"show":[121],"that":[122],"good":[127],"real-time":[128],"performance":[129],"consistent":[135],"with":[136],"accuracy.":[139],"proposed":[142],"paper":[145],"can":[146],"meet":[147],"online":[151]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}