{"id":"https://openalex.org/W4392678671","doi":"https://doi.org/10.1145/3626184.3633315","title":"FuILT: Full Chip ILT System With Boundary Healing","display_name":"FuILT: Full Chip ILT System With Boundary Healing","publication_year":2024,"publication_date":"2024-03-12","ids":{"openalex":"https://openalex.org/W4392678671","doi":"https://doi.org/10.1145/3626184.3633315"},"language":"en","primary_location":{"id":"doi:10.1145/3626184.3633315","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3626184.3633315","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3626184.3633315","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3626184.3633315","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100602012","display_name":"Shuo Yin","orcid":"https://orcid.org/0000-0001-7893-8814"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Shuo Yin","raw_affiliation_strings":["The Chinese University of Hong Kong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of Hong Kong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013503446","display_name":"Wenqian Zhao","orcid":"https://orcid.org/0000-0001-9501-9254"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Wenqian Zhao","raw_affiliation_strings":["The Chinese University of Hong Kong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of Hong Kong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088719870","display_name":"Li Xie","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Li Xie","raw_affiliation_strings":["Shenzhen GWX Technology Co., Ltd., Shenzhen, China"],"affiliations":[{"raw_affiliation_string":"Shenzhen GWX Technology Co., Ltd., Shenzhen, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073086890","display_name":"H.H. Chen","orcid":"https://orcid.org/0009-0002-7090-7962"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hong Chen","raw_affiliation_strings":["Shenzhen GWX Technology Co., Ltd., Shenzhen, China"],"affiliations":[{"raw_affiliation_string":"Shenzhen GWX Technology Co., Ltd., Shenzhen, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071995111","display_name":"Yuzhe Ma","orcid":"https://orcid.org/0000-0002-3612-4182"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yuzhe Ma","raw_affiliation_strings":["Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China"],"affiliations":[{"raw_affiliation_string":"Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062800747","display_name":"Tsung-Yi Ho","orcid":"https://orcid.org/0000-0001-7348-5625"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Tsung-Yi Ho","raw_affiliation_strings":["The Chinese University of Hong Kong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of Hong Kong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051340429","display_name":"Bei Yu","orcid":"https://orcid.org/0000-0001-6406-4810"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Bei Yu","raw_affiliation_strings":["The Chinese University of Hong Kong, Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of Hong Kong, Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5100602012"],"corresponding_institution_ids":["https://openalex.org/I177725633"],"apc_list":null,"apc_paid":null,"fwci":1.8482,"has_fulltext":true,"cited_by_count":9,"citation_normalized_percentile":{"value":0.85002175,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"13","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7135023474693298},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6796122193336487},{"id":"https://openalex.org/keywords/workload","display_name":"Workload","score":0.6253397464752197},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.47894221544265747},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.459425687789917},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.4535825848579407},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.4462149739265442},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4268737733364105},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.35317501425743103},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.3362765908241272},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15844681859016418},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11038720607757568}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7135023474693298},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6796122193336487},{"id":"https://openalex.org/C2778476105","wikidata":"https://www.wikidata.org/wiki/Q628539","display_name":"Workload","level":2,"score":0.6253397464752197},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.47894221544265747},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.459425687789917},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.4535825848579407},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.4462149739265442},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4268737733364105},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.35317501425743103},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.3362765908241272},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15844681859016418},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11038720607757568},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/3626184.3633315","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3626184.3633315","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3626184.3633315","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 International Symposium on Physical Design","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-138293","is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-138293","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"}],"best_oa_location":{"id":"doi:10.1145/3626184.3633315","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3626184.3633315","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3626184.3633315","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2024 International Symposium on Physical Design","raw_type":"proceedings-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.6200000047683716,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322942","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4392678671.pdf","grobid_xml":"https://content.openalex.org/works/W4392678671.grobid-xml"},"referenced_works_count":23,"referenced_works":["https://openalex.org/W21269541","https://openalex.org/W1514655958","https://openalex.org/W1839775469","https://openalex.org/W1999879018","https://openalex.org/W2038980326","https://openalex.org/W2056830856","https://openalex.org/W2297117935","https://openalex.org/W2344299637","https://openalex.org/W2809465272","https://openalex.org/W3013607396","https://openalex.org/W3047198287","https://openalex.org/W3091844009","https://openalex.org/W3111433944","https://openalex.org/W3112693398","https://openalex.org/W3128330332","https://openalex.org/W3198572068","https://openalex.org/W4200483799","https://openalex.org/W4221149916","https://openalex.org/W4312121124","https://openalex.org/W4318685681","https://openalex.org/W6643878155","https://openalex.org/W6679134511","https://openalex.org/W6799327957"],"related_works":["https://openalex.org/W2000785801","https://openalex.org/W986318368","https://openalex.org/W2384410913","https://openalex.org/W2352878646","https://openalex.org/W2004734601","https://openalex.org/W2130149817","https://openalex.org/W2990194547","https://openalex.org/W1480123525","https://openalex.org/W2620865396","https://openalex.org/W2414054180"],"abstract_inverted_index":{"Mask":[0],"optimization":[1],"in":[2,31,70],"lithography":[3],"is":[4,20,164],"becoming":[5],"increasingly":[6],"impor-":[7],"tant":[8],"as":[9],"the":[10,23,32,46,52,108,113,146],"technology":[11],"node":[12],"size":[13],"shrinks":[14],"down.":[15],"Inverse":[16],"Lithography":[17],"Technology":[18],"(ILT)":[19],"one":[21],"of":[22,48,75],"most":[24,64],"performant":[25],"and":[26,43,60,139,167],"robust":[27],"solutions":[28],"widely":[29],"used":[30],"industry,":[33],"yet":[34],"it":[35],"still":[36,68],"suffers":[37],"from":[38,158],"heavy":[39],"time":[40],"con-":[41],"sumption":[42],"complexity.":[44],"As":[45],"number":[47],"transistors":[49],"scales":[50],"up,":[51],"industry":[53],"currently":[54],"focuses":[55],"more":[56],"on":[57,155],"efficiency":[58,128],"improvement":[59],"workload":[61,122],"distribution.":[62],"Meanwhile,":[63],"recent":[65],"publications":[66],"are":[67,80],"tangled":[69],"local":[71],"pattern":[72],"restoration":[73],"regardless":[74],"real":[76,87,159],"manufacturing":[77],"conditions.":[78],"We":[79],"trying":[81],"to":[82,85,111,125,144],"extend":[83],"academia":[84],"some":[86],"industrial":[88],"bottlenecks":[89],"with":[90,107,129],"FuILT,":[91],"a":[92,103,121,136,140],"practical":[93],"full-chip":[94,114],"ILT-based":[95],"mask":[96],"opti-":[97],"mization":[98],"flow.":[99],"Firstly,":[100],"we":[101,119,134],"build":[102],"multi-level":[104,141],"partitioning":[105],"strategy":[106,143],"divide-and-conquer":[109],"mindset":[110],"tackle":[112],"ILT":[115],"prob-":[116],"lem.":[117],"Secondly,":[118],"implement":[120],"distribution":[123],"framework":[124],"maintain":[126],"hardware":[127],"scalable":[130],"multi-GPU":[131],"parallelism.":[132],"Thirdly,":[133],"propose":[135],"gradient-fusion":[137],"technique":[138],"healing":[142],"fix":[145],"boundary":[147],"error":[148],"at":[149],"different":[150,156],"levels.":[151],"Our":[152],"experimental":[153],"results":[154],"layers":[157],"designs":[160],"show":[161],"that":[162],"FuILT":[163],"both":[165],"effective":[166],"generalizable.":[168]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":2}],"updated_date":"2026-04-09T08:11:56.329763","created_date":"2025-10-10T00:00:00"}