{"id":"https://openalex.org/W4386058016","doi":"https://doi.org/10.1145/3603955.3604028","title":"Resolution of Gross Voids Rejection on Gallium Nitride Products: An Application of Six Sigma DMAIC Approach","display_name":"Resolution of Gross Voids Rejection on Gallium Nitride Products: An Application of Six Sigma DMAIC Approach","publication_year":2023,"publication_date":"2023-04-27","ids":{"openalex":"https://openalex.org/W4386058016","doi":"https://doi.org/10.1145/3603955.3604028"},"language":"en","primary_location":{"id":"doi:10.1145/3603955.3604028","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3603955.3604028","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 5th International Conference on Management Science and Industrial Engineering","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5092809395","display_name":"Marilou B. Agapay","orcid":"https://orcid.org/0009-0004-8588-0736"},"institutions":[{"id":"https://openalex.org/I137967721","display_name":"Map\u00faa University","ror":"https://ror.org/040rd2b57","country_code":"PH","type":"facility","lineage":["https://openalex.org/I137967721"]}],"countries":["PH"],"is_corresponding":false,"raw_author_name":"Marilou B. Agapay","raw_affiliation_strings":["School of Graduate Studies, Mapua University, Philippines"],"raw_orcid":"https://orcid.org/0009-0004-8588-0736","affiliations":[{"raw_affiliation_string":"School of Graduate Studies, Mapua University, Philippines","institution_ids":["https://openalex.org/I137967721"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5060696852","display_name":"Josephine D. German","orcid":"https://orcid.org/0000-0002-2073-2300"},"institutions":[{"id":"https://openalex.org/I137967721","display_name":"Map\u00faa University","ror":"https://ror.org/040rd2b57","country_code":"PH","type":"facility","lineage":["https://openalex.org/I137967721"]}],"countries":["PH"],"is_corresponding":false,"raw_author_name":"Josephine D. German","raw_affiliation_strings":["School of Industrial Engineering and Engineering Management, Mapua University, Philippines"],"raw_orcid":"https://orcid.org/0000-0002-2073-2300","affiliations":[{"raw_affiliation_string":"School of Industrial Engineering and Engineering Management, Mapua University, Philippines","institution_ids":["https://openalex.org/I137967721"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I137967721"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"282","last_page":"290"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dmaic","display_name":"DMAIC","score":0.9429568648338318},{"id":"https://openalex.org/keywords/six-sigma","display_name":"Six Sigma","score":0.9001457691192627},{"id":"https://openalex.org/keywords/baseline","display_name":"Baseline (sea)","score":0.5631991624832153},{"id":"https://openalex.org/keywords/sigma","display_name":"Sigma","score":0.5190016031265259},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.44354817271232605},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4122484624385834},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3634348511695862},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.32355499267578125},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29367780685424805},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09077015519142151}],"concepts":[{"id":"https://openalex.org/C205400985","wikidata":"https://www.wikidata.org/wiki/Q380179","display_name":"DMAIC","level":4,"score":0.9429568648338318},{"id":"https://openalex.org/C23119410","wikidata":"https://www.wikidata.org/wiki/Q236908","display_name":"Six Sigma","level":3,"score":0.9001457691192627},{"id":"https://openalex.org/C12725497","wikidata":"https://www.wikidata.org/wiki/Q810247","display_name":"Baseline (sea)","level":2,"score":0.5631991624832153},{"id":"https://openalex.org/C2778049214","wikidata":"https://www.wikidata.org/wiki/Q7512234","display_name":"Sigma","level":2,"score":0.5190016031265259},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.44354817271232605},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4122484624385834},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3634348511695862},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.32355499267578125},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29367780685424805},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09077015519142151},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C137335462","wikidata":"https://www.wikidata.org/wiki/Q380772","display_name":"Lean manufacturing","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3603955.3604028","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3603955.3604028","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 5th International Conference on Management Science and Industrial Engineering","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W2026797446","https://openalex.org/W2075913067","https://openalex.org/W2159725793","https://openalex.org/W2160129109","https://openalex.org/W2184654038","https://openalex.org/W2338681681","https://openalex.org/W2425546849","https://openalex.org/W2496535594","https://openalex.org/W2761330267","https://openalex.org/W2800425782","https://openalex.org/W2907372919","https://openalex.org/W3004802479","https://openalex.org/W3030179160","https://openalex.org/W3131534329","https://openalex.org/W3133795415","https://openalex.org/W3153243162","https://openalex.org/W4220952049"],"related_works":["https://openalex.org/W1584919102","https://openalex.org/W1987379064","https://openalex.org/W2046319294","https://openalex.org/W2259171508","https://openalex.org/W4243556880","https://openalex.org/W2757064773","https://openalex.org/W1969848021","https://openalex.org/W2075656146","https://openalex.org/W1964627399","https://openalex.org/W2801437856"],"abstract_inverted_index":{"Resolution":[0],"of":[1,53,85,151],"gross":[2],"rejection":[3],"related":[4],"to":[5,32,39,72,90,111,127,159,171],"voids":[6,51,79,83,125,177],"issue":[7],"in":[8,70,181],"between":[9],"die":[10],"attach":[11,144],"interface":[12],"encountered":[13],"on":[14,36,176],"newly":[15],"released":[16,146],"Gallium":[17],"nitride":[18],"(GaN)":[19],"products":[20,168],"became":[21],"the":[22,26,33,62,75,139],"top":[23],"priority":[24],"for":[25,156,169],"manufacturing":[27],"company":[28],"under":[29,105],"study":[30],"due":[31,38,126],"huge":[34],"impact":[35],"cost":[37],"yield":[40,179,187],"loss":[41],"at":[42],"30%,":[43],"missed":[44],"delivery":[45],"and":[46,97,108,134],"low":[47],"quality":[48],"since":[49],"baseline":[50,186],"requirement":[52],"less":[54,86],"than":[55,87,183],"1%":[56,91],"was":[57,68,78,109,135],"not":[58,80],"met.":[59],"With":[60],"this,":[61],"Six":[63,100],"Sigma":[64,101],"DMAIC":[65,102],"problem-solving":[66],"method":[67],"utilized":[69],"order":[71],"structurally":[73],"address":[74],"problem":[76],"which":[77,120],"meeting":[81],"single":[82],"criteria":[84],"or":[88,117,129],"equal":[89],"with":[92,114],"Define,":[93],"Measure,":[94],"Analyze,":[95],"Control,":[96],"Improve":[98],"phases.":[99],"team":[103],"worked":[104],"time":[106],"pressure":[107],"able":[110],"come":[112],"up":[113],"critical":[115,118],"X":[116],"cause":[119],"is":[121],"trapped":[122],"air":[123],"causing":[124],"canal":[128],"valley":[130],"formed":[131],"during":[132],"dispensing":[133],"addressed":[136],"by":[137,165],"improving":[138],"dispense":[140],"feed":[141],"rate.":[142],"Die":[143],"parameters":[145],"using":[147],"fractional":[148],"factorial":[149],"design":[150],"experiment":[152],"(DoE)":[153],"were":[154,192],"validated":[155],"documentation":[157],"purposes":[158],"be":[160],"used":[161],"as":[162],"a":[163],"reference":[164],"other":[166],"new":[167],"release":[170],"prevent":[172],"similar":[173],"issues.":[174],"Validation":[175],"screening":[178],"resulted":[180],"higher":[182],"99%":[184],"attaining":[185],"proving":[188],"that":[189],"actions":[190],"implemented":[191],"effective.":[193]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}