{"id":"https://openalex.org/W4386156273","doi":"https://doi.org/10.1145/3579028","title":"Proceedings of the 27th ACM International Systems and Software Product Line Conference - Volume B","display_name":"Proceedings of the 27th ACM International Systems and Software Product Line Conference - Volume B","publication_year":2023,"publication_date":"2023-08-25","ids":{"openalex":"https://openalex.org/W4386156273","doi":"https://doi.org/10.1145/3579028"},"language":"en","primary_location":{"id":"doi:10.1145/3579028","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1145/3579028","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":null,"raw_type":"proceedings"},"type":"paratext","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":null,"any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Arcaini P.","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Arcaini P.","raw_affiliation_strings":["LIRMM, Univ Montpellier, CNRS Montpellier, France"],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"ter Beek M.H.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"ter Beek M.H.","raw_affiliation_strings":["LIRMM, Univ Montpellier, CNRS Montpellier, France"],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Perrouin G.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Perrouin G.","raw_affiliation_strings":["AIDA, Cirad Montpellier, France"],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Reinhartz-Berger I.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Reinhartz-Berger I.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Machado I.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Machado I.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Vergilio S.R.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Vergilio S.R.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Rabiser R.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rabiser R.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Yue T.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yue T.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Devroey X.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Devroey X.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":null,"display_name":"Pinto M.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Pinto M.","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"last","author":{"id":null,"display_name":"Washizaki H.","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Washizaki H.","raw_affiliation_strings":[],"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":11,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":true,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10639","display_name":"Advanced Software Engineering Methodologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10639","display_name":"Advanced Software Engineering Methodologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10679","display_name":"Service-Oriented Architecture and Web Services","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/1710","display_name":"Information Systems"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12127","display_name":"Software System Performance and Reliability","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.759861171245575},{"id":"https://openalex.org/keywords/software-product-line","display_name":"Software product line","score":0.7195495367050171},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.6596366167068481},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6566135287284851},{"id":"https://openalex.org/keywords/product-line","display_name":"Product line","score":0.6199796199798584},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5368244051933289},{"id":"https://openalex.org/keywords/line","display_name":"Line (geometry)","score":0.5324044823646545},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.4601685404777527},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.24560943245887756},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.216533362865448},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.1966933012008667},{"id":"https://openalex.org/keywords/software-development","display_name":"Software development","score":0.18595236539840698}],"concepts":[{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.759861171245575},{"id":"https://openalex.org/C2778177629","wikidata":"https://www.wikidata.org/wiki/Q2111823","display_name":"Software product line","level":4,"score":0.7195495367050171},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.6596366167068481},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6566135287284851},{"id":"https://openalex.org/C2988046880","wikidata":"https://www.wikidata.org/wiki/Q3084961","display_name":"Product line","level":2,"score":0.6199796199798584},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5368244051933289},{"id":"https://openalex.org/C198352243","wikidata":"https://www.wikidata.org/wiki/Q37105","display_name":"Line (geometry)","level":2,"score":0.5324044823646545},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.4601685404777527},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.24560943245887756},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.216533362865448},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.1966933012008667},{"id":"https://openalex.org/C529173508","wikidata":"https://www.wikidata.org/wiki/Q638608","display_name":"Software development","level":3,"score":0.18595236539840698},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/3579028","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1145/3579028","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":null,"raw_type":"proceedings"},{"id":"pmh:oai:dnet:people______::e7b628274b52aca84facb8a529ea38b9","is_oa":true,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S7407055261","display_name":"ISTI Open Portal","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Book"},{"id":"pmh:oai:it.cnr:prodotti:485806","is_oa":true,"landing_page_url":"http://www.cnr.it/prodotto/i/485806","pdf_url":null,"source":{"id":"https://openalex.org/S7407055101","display_name":"CNR ExploRA","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"info:cnr-pdr/source/autori:Arcaini P.; ter Beek M.H.; Perrouin G.; Reinhartz-Berger I.; Machado I.; Vergilio S.R.; Rabiser R.; Yue T.; Devroey X.; Pinto M.; Washizaki H./titolo:27th ACM International Systems and Software Product Line Conference (SPLC 2023). Proceedings - Volume B/editore:\n    \n    \n    \n    \n    \n   /anno:2023","raw_type":"Curatela di atti di convegno (conference proceedings)"}],"best_oa_location":{"id":"pmh:oai:dnet:people______::e7b628274b52aca84facb8a529ea38b9","is_oa":true,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S7407055261","display_name":"ISTI Open Portal","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Book"},"sustainable_development_goals":[{"score":0.7099999785423279,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[{"id":"https://openalex.org/G432593040","display_name":null,"funder_award_id":"ANR-21-CE23-0023","funder_id":"https://openalex.org/F4320320883","funder_display_name":"Agence Nationale de la Recherche"},{"id":"https://openalex.org/G6851345361","display_name":null,"funder_award_id":"Grant","funder_id":"https://openalex.org/F4320320883","funder_display_name":"Agence Nationale de la Recherche"}],"funders":[{"id":"https://openalex.org/F4320320883","display_name":"Agence Nationale de la Recherche","ror":"https://ror.org/00rbzpz17"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1575920186","https://openalex.org/W1591870353","https://openalex.org/W1790062403","https://openalex.org/W1980045446","https://openalex.org/W2041313536","https://openalex.org/W2046893664","https://openalex.org/W2048064553","https://openalex.org/W2048399333","https://openalex.org/W2049562935","https://openalex.org/W2157771728","https://openalex.org/W2158127877","https://openalex.org/W2169850657","https://openalex.org/W2477378326","https://openalex.org/W2526174560","https://openalex.org/W2574253606","https://openalex.org/W2751553114","https://openalex.org/W2910957907","https://openalex.org/W2955102232","https://openalex.org/W4255318870","https://openalex.org/W4281784572","https://openalex.org/W4309693009","https://openalex.org/W4312282046"],"related_works":["https://openalex.org/W4253469356","https://openalex.org/W4386156273","https://openalex.org/W4236879149","https://openalex.org/W1570914908","https://openalex.org/W3136844949","https://openalex.org/W2160719074","https://openalex.org/W2099023631","https://openalex.org/W2093033840","https://openalex.org/W4245586684","https://openalex.org/W2355556461"],"abstract_inverted_index":{"Welcome":[0],"to":[1,15,38,105],"SPLC'23,":[2],"the":[3,16,20,45,72,75],"27th":[4],"ACM":[5],"International":[6],"Systems":[7],"and":[8,32,40,48,69,90],"Software":[9],"Product":[10],"Line":[11],"Conference.":[12],"Looking":[13],"back":[14],"previous":[17],"SPLC":[18],"issues,":[19],"conference":[21],"has":[22],"been":[23],"established":[24],"as":[25,63,82],"a":[26,64],"thriving":[27],"ground":[28],"for":[29],"practitioners,":[30],"researchers,":[31],"educators":[33],"working":[34],"in":[35,77,99],"areas":[36],"related":[37],"systems":[39],"software":[41,54,78],"product":[42,79],"lines.":[43],"With":[44],"increasing":[46],"size":[47],"complexity":[49],"of":[50,74],"software,":[51],"efficiently":[52],"supporting":[53],"processes":[55],"becomes":[56],"an":[57],"extremely":[58],"important":[59],"task.":[60],"SPLC'23":[61,93],"acted":[62],"venue":[65],"fostering":[66],"knowledge":[67],"exchange":[68],"learning":[70],"about":[71],"state":[73],"art":[76],"lines":[80],"aswell":[81],"newpractices,":[83],"trends,":[84],"innovations,":[85],"insights":[86],"from":[87,102],"industrial":[88],"applications,":[89],"new":[91],"challenges.":[92],"was":[94],"held":[95],"at":[96],"Hitotsubashi":[97],"Hall":[98],"Tokyo,":[100],"Japan,":[101],"August":[103],"28":[104],"September":[106],"1,":[107],"2023.":[108]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-04-12T07:58:50.170612","created_date":"2023-08-26T00:00:00"}