{"id":"https://openalex.org/W4353031946","doi":"https://doi.org/10.1145/3569052.3578922","title":"Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution","display_name":"Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution","publication_year":2023,"publication_date":"2023-03-22","ids":{"openalex":"https://openalex.org/W4353031946","doi":"https://doi.org/10.1145/3569052.3578922"},"language":"en","primary_location":{"id":"doi:10.1145/3569052.3578922","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1145/3569052.3578922","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2023 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"http://dx.doi.org/10.1145/3569052.3578922","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036199179","display_name":"Armen Kteyan","orcid":"https://orcid.org/0000-0002-8743-0155"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Armen Kteyan","raw_affiliation_strings":["Siemens EDA, Yerevan, Armenia"],"raw_orcid":"https://orcid.org/0000-0002-8743-0155","affiliations":[{"raw_affiliation_string":"Siemens EDA, Yerevan, Armenia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021627904","display_name":"Valeriy Sukharev","orcid":"https://orcid.org/0000-0002-5647-0584"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Valeriy Sukharev","raw_affiliation_strings":["Siemens EDA, Fremont, CA, USA"],"raw_orcid":"https://orcid.org/0000-0002-5647-0584","affiliations":[{"raw_affiliation_string":"Siemens EDA, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024501337","display_name":"Alexander Volkov","orcid":"https://orcid.org/0000-0001-5936-7382"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alexander Volkov","raw_affiliation_strings":["Siemens EDA, Fremont, CA, USA"],"raw_orcid":"https://orcid.org/0000-0001-5936-7382","affiliations":[{"raw_affiliation_string":"Siemens EDA, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089574594","display_name":"Jun-Ho Choy","orcid":"https://orcid.org/0000-0002-8977-5720"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jun Ho Choy","raw_affiliation_strings":["Siemens EDA, Fremont, CA, USA"],"raw_orcid":"https://orcid.org/0000-0002-8977-5720","affiliations":[{"raw_affiliation_string":"Siemens EDA, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089881278","display_name":"Farid N. Najm","orcid":"https://orcid.org/0000-0001-5393-7794"},"institutions":[{"id":"https://openalex.org/I185261750","display_name":"University of Toronto","ror":"https://ror.org/03dbr7087","country_code":"CA","type":"education","lineage":["https://openalex.org/I185261750"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Farid N. Najm","raw_affiliation_strings":["University of Toronto, Tonto, ON, Canada"],"raw_orcid":"https://orcid.org/0000-0001-5393-7794","affiliations":[{"raw_affiliation_string":"University of Toronto, Tonto, ON, Canada","institution_ids":["https://openalex.org/I185261750"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043671149","display_name":"Yong Hyeon Yi","orcid":"https://orcid.org/0000-0001-6834-000X"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yong Hyeon Yi","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN, USA"],"raw_orcid":"https://orcid.org/0000-0001-6834-000X","affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN, USA","institution_ids":["https://openalex.org/I130238516"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043025421","display_name":"Chris H. Kim","orcid":"https://orcid.org/0000-0002-4194-1347"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chris H. Kim","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN, USA"],"raw_orcid":"https://orcid.org/0000-0002-4194-1347","affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN, USA","institution_ids":["https://openalex.org/I130238516"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036400103","display_name":"S. Moreau","orcid":"https://orcid.org/0000-0001-6104-2050"},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Stephane Moreau","raw_affiliation_strings":["CEA LETI, Grenoble, France"],"raw_orcid":"https://orcid.org/0000-0001-6104-2050","affiliations":[{"raw_affiliation_string":"CEA LETI, Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":6.1894,"has_fulltext":true,"cited_by_count":5,"citation_normalized_percentile":{"value":0.96609577,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"124","last_page":"132"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9055839776992798},{"id":"https://openalex.org/keywords/resistor","display_name":"Resistor","score":0.6822260618209839},{"id":"https://openalex.org/keywords/voltage-drop","display_name":"Voltage drop","score":0.655288815498352},{"id":"https://openalex.org/keywords/void","display_name":"Void (composites)","score":0.6152711510658264},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6088036894798279},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.5647446513175964},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5431342720985413},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.5420989990234375},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.5268512964248657},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.5263432264328003},{"id":"https://openalex.org/keywords/power-network-design","display_name":"Power network design","score":0.4346708059310913},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4253702461719513},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.41233396530151367},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.411959171295166},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.37200087308883667},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33061933517456055},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20682460069656372},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15374821424484253},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.13613125681877136},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.1314276158809662},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.11653918027877808},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09368833899497986},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.08759462833404541}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9055839776992798},{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.6822260618209839},{"id":"https://openalex.org/C82178898","wikidata":"https://www.wikidata.org/wiki/Q166839","display_name":"Voltage drop","level":3,"score":0.655288815498352},{"id":"https://openalex.org/C2779772531","wikidata":"https://www.wikidata.org/wiki/Q19689164","display_name":"Void (composites)","level":2,"score":0.6152711510658264},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6088036894798279},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.5647446513175964},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5431342720985413},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.5420989990234375},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.5268512964248657},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.5263432264328003},{"id":"https://openalex.org/C164565468","wikidata":"https://www.wikidata.org/wiki/Q7236535","display_name":"Power network design","level":3,"score":0.4346708059310913},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4253702461719513},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.41233396530151367},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.411959171295166},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.37200087308883667},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33061933517456055},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20682460069656372},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15374821424484253},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13613125681877136},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.1314276158809662},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.11653918027877808},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09368833899497986},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08759462833404541},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/3569052.3578922","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1145/3569052.3578922","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2023 International Symposium on Physical Design","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:cea-04088213v1","is_oa":true,"landing_page_url":"https://cea.hal.science/cea-04088213","pdf_url":"https://cea.hal.science/cea-04088213v1/file/EM_ISPD_2023.pdf","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"https://dl.acm.org/doi/proceedings/10.1145/3569052","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:HAL:cea-04521889v1","is_oa":true,"landing_page_url":"https://cea.hal.science/cea-04521889","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3569052.3578922","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"ISPD '23: International Symposium on Physical Design, Mar 2023, Virtual Event, United States. pp.124-132, ⟨10.1145/3569052.3578922⟩","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":{"id":"doi:10.1145/3569052.3578922","is_oa":true,"landing_page_url":"http://dx.doi.org/10.1145/3569052.3578922","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2023 International Symposium on Physical Design","raw_type":"proceedings-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G7398482525","display_name":"NANOELEC","funder_award_id":"ANR-10-AIRT-0005","funder_id":"https://openalex.org/F4320320883","funder_display_name":"Agence Nationale de la Recherche"}],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"},{"id":"https://openalex.org/F4320320883","display_name":"Agence Nationale de la Recherche","ror":"https://ror.org/00rbzpz17"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2034510649","https://openalex.org/W2081786181","https://openalex.org/W2293477573","https://openalex.org/W2587645287","https://openalex.org/W2991538121","https://openalex.org/W2997514656","https://openalex.org/W3175585576","https://openalex.org/W4206741961","https://openalex.org/W4225322388","https://openalex.org/W4251821671"],"related_works":["https://openalex.org/W2471306711","https://openalex.org/W2048644706","https://openalex.org/W2036378986","https://openalex.org/W2536001652","https://openalex.org/W2261565770","https://openalex.org/W2547818291","https://openalex.org/W1990187088","https://openalex.org/W1980919623","https://openalex.org/W2049675513","https://openalex.org/W2108172432"],"abstract_inverted_index":{"A":[0,75],"recently":[1],"proposed":[2],"methodology":[3],"for":[4,35,45,166],"electromigration":[5],"(EM)":[6],"assessment":[7],"in":[8,30,51,70,101,105,108,123,177,183,190,196,201,206],"on-chip":[9],"power/ground":[10],"grid":[11,32,73,103,138],"of":[12,20,47,60,67,87,112,126,147,180],"integrated":[13],"circuits":[14],"has":[15],"been":[16],"validated":[17],"by":[18,97],"means":[19],"measurements,":[21],"performed":[22],"on":[23],"dedicated":[24],"test":[25,77,137],"grids.":[26],"IR":[27],"drop":[28],"degradation":[29],"the":[31,37,61,71,94,113,133],"is":[33],"used":[34],"defining":[36],"EM":[38],"failure":[39],"criteria.":[40],"Physics-based":[41],"models":[42,96],"are":[43],"involved":[44],"simulation":[46],"EM-induced":[48,181],"stress":[49],"evolution":[50,100,189],"interconnect":[52],"structures,":[53],"void":[54],"formation":[55],"and":[56,64,85,107,115,128,151,154,193,203],"evolution,":[57],"resistance":[58],"increase":[59],"voided":[62],"segments,":[63],"consequent":[65],"re-distribution":[66],"electric":[68],"current":[69,174],"redundant":[72],"paths.":[74],"grid-like":[76],"structure,":[78],"fabricated":[79,140],"with":[80,141,160],"a":[81,142,186],"65":[82],"nm":[83,144],"technology":[84],"consisting":[86],"two":[88],"metal":[89,149],"layers,":[90,150],"allowed":[91],"to":[92,158],"calibrate":[93],"voiding":[95],"tracking":[98],"voltage":[99,188],"all":[102],"nodes":[104],"experiment":[106],"simulation.":[109],"Good":[110],"fit":[111],"measured":[114],"simulated":[116],"time-to-failure":[117],"(TTF)":[118],"probability":[119],"distribution":[120,131],"was":[121,139],"obtained":[122],"both":[124],"cases":[125],"uniform":[127],"non-uniform":[129],"temperature":[130],"across":[132],"grid.":[134],"The":[135,172],"second":[136],"28":[143],"technology,":[145],"consisted":[146],"4":[148],"contained":[152],"power":[153,191],"ground":[155,197],"nets":[156],"connected":[157],"\"quasi-cells\"":[159],"poly-resistors,":[161],"which":[162],"were":[163,199],"specially":[164],"designed":[165],"operating":[167],"at":[168],"elevated":[169],"temperatures":[170],"~350\u00b0C.":[171],"existing":[173],"distributions":[175],"resulted":[176],"different":[178],"behavior":[179],"failures":[182],"these":[184],"nets:":[185],"gradual":[187],"net,":[192],"sharp":[194],"changes":[195],"net":[198],"observed":[200],"experiment,":[202],"successfully":[204],"reproduced":[205],"simulations.":[207]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3}],"updated_date":"2026-08-06T08:24:18.245995","created_date":"2025-10-10T00:00:00"}