{"id":"https://openalex.org/W4353031964","doi":"https://doi.org/10.1145/3569052.3578908","title":"Advanced Design Methodologies for Directed Self-Assembly","display_name":"Advanced Design Methodologies for Directed Self-Assembly","publication_year":2023,"publication_date":"2023-03-22","ids":{"openalex":"https://openalex.org/W4353031964","doi":"https://doi.org/10.1145/3569052.3578908"},"language":"en","primary_location":{"id":"doi:10.1145/3569052.3578908","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3569052.3578908","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2023 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065439030","display_name":"Shao\u2010Yun Fang","orcid":"https://orcid.org/0000-0001-6675-2676"},"institutions":[{"id":"https://openalex.org/I154864474","display_name":"National Taiwan University of Science and Technology","ror":"https://ror.org/00q09pe49","country_code":"TW","type":"education","lineage":["https://openalex.org/I154864474"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Shao-Yun Fang","raw_affiliation_strings":["National Taiwan University of Science and Technology, Taipei, Taiwan Roc"],"raw_orcid":"https://orcid.org/0000-0001-6675-2676","affiliations":[{"raw_affiliation_string":"National Taiwan University of Science and Technology, Taipei, Taiwan Roc","institution_ids":["https://openalex.org/I154864474"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5065439030"],"corresponding_institution_ids":["https://openalex.org/I154864474"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"105","last_page":"105"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.8913198709487915},{"id":"https://openalex.org/keywords/template","display_name":"Template","score":0.7067779302597046},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6017050743103027},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.496582567691803},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4779125154018402},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.44186657667160034},{"id":"https://openalex.org/keywords/lamellar-structure","display_name":"Lamellar structure","score":0.4376979470252991},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4260445237159729},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4215022921562195},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3766249418258667},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3499661087989807},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2968369722366333},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12843948602676392}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.8913198709487915},{"id":"https://openalex.org/C82714645","wikidata":"https://www.wikidata.org/wiki/Q438331","display_name":"Template","level":2,"score":0.7067779302597046},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6017050743103027},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.496582567691803},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4779125154018402},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.44186657667160034},{"id":"https://openalex.org/C77851909","wikidata":"https://www.wikidata.org/wiki/Q6481705","display_name":"Lamellar structure","level":2,"score":0.4376979470252991},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4260445237159729},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4215022921562195},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3766249418258667},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3499661087989807},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2968369722366333},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12843948602676392},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3569052.3578908","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3569052.3578908","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2023 International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5199999809265137}],"awards":[{"id":"https://openalex.org/G830142704","display_name":null,"funder_award_id":"110-2223-E-011-002-MY3","funder_id":"https://openalex.org/F4320331164","funder_display_name":"National Science and Technology Council"}],"funders":[{"id":"https://openalex.org/F4320331164","display_name":"National Science and Technology Council","ror":"https://ror.org/00wnb9798"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2094969048","https://openalex.org/W994558755","https://openalex.org/W3035935536","https://openalex.org/W2010746423","https://openalex.org/W2372119205","https://openalex.org/W2117710422","https://openalex.org/W2157255030","https://openalex.org/W2360355889","https://openalex.org/W1909614652","https://openalex.org/W2753737674"],"abstract_inverted_index":{"Directed":[0],"self-assembly":[1],"(DSA),":[2],"which":[3,58],"uses":[4],"the":[5,24,33,37,55,83,87,91,95,110,127,131,141,150,175],"segregation":[6],"nature":[7],"after":[8],"an":[9,41],"annealing":[10],"process":[11],"of":[12,23,36,54,112,177],"block":[13],"co-polymer":[14],"(BCP)":[15],"to":[16,32,62,75,102,120,169],"generate":[17,103],"tiny":[18],"feature":[19],"shapes,":[20],"becomes":[21],"one":[22,53],"most":[25],"promising":[26],"next":[27],"generation":[28],"lithography":[29],"technologies.":[30],"According":[31],"different":[34,118,121],"proportions":[35],"two":[38,56,96],"monomers":[39],"in":[40,106,180],"adopted":[42],"BCP,":[43],"either":[44],"cylinders":[45],"or":[46],"lamellae":[47],"can":[48,99],"be":[49,100],"generated":[50,92],"by":[51],"removing":[52],"monomers,":[57],"are":[59,73,116,147,153,166],"respectively":[60,154],"referred":[61],"as":[63],"cylindrical":[64,157],"DSA":[65,97,142,158,179],"and":[66,149,159,174],"lamellar":[67,160],"DSA.":[68,161],"In":[69],"addition,":[70],"guiding":[71,114,132],"templates":[72,115],"required":[74],"produce":[76],"trenches":[77],"before":[78],"filling":[79],"BCP":[80],"such":[81],"that":[82],"additional":[84],"forces":[85],"from":[86],"trench":[88],"walls":[89],"regulate":[90],"cylinders/lamellae.":[93],"Both":[94],"technologies":[98],"used":[101],"contact/via":[104,137,172],"patterns":[105],"circuit":[107],"layouts,":[108],"while":[109],"practices":[111],"designing":[113],"quite":[117],"due":[119],"manufacturing":[122],"principles.":[123],"This":[124],"paper":[125],"reviews":[126],"existing":[128],"studies":[129],"on":[130],"template":[133],"design":[134,145,151],"problem":[135],"for":[136,156],"hole":[138],"fabrication":[139],"with":[140],"technology.":[143],"The":[144],"constraints":[146],"differentiated":[148],"methodologies":[152],"introduced":[155],"Possible":[162],"future":[163],"research":[164],"directions":[165],"finally":[167],"suggested":[168],"further":[170],"enhance":[171],"manufacturability":[173],"feasibility":[176],"adopting":[178],"semiconductor":[181],"manufacturing.":[182]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}