{"id":"https://openalex.org/W4304147710","doi":"https://doi.org/10.1145/3567424","title":"A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis","display_name":"A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis","publication_year":2022,"publication_date":"2022-10-10","ids":{"openalex":"https://openalex.org/W4304147710","doi":"https://doi.org/10.1145/3567424"},"language":"en","primary_location":{"id":"doi:10.1145/3567424","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3567424","pdf_url":null,"source":{"id":"https://openalex.org/S105046310","display_name":"ACM Transactions on Design Automation of Electronic Systems","issn_l":"1084-4309","issn":["1084-4309","1557-7309"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Transactions on Design Automation of Electronic Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052750765","display_name":"Tianshu Hou","orcid":"https://orcid.org/0000-0001-5349-1825"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Tianshu Hou","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075845993","display_name":"Peining Zhen","orcid":"https://orcid.org/0000-0002-8439-876X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peining Zhen","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101909885","display_name":"Zhigang Ji","orcid":"https://orcid.org/0000-0001-9741-539X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhigang Ji","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030264455","display_name":"Hai\u2010Bao Chen","orcid":"https://orcid.org/0000-0001-7046-3455"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hai-Bao Chen","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5052750765"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":0.4242,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.50770759,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"28","issue":"4","first_page":"1","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.980400025844574,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.8265545964241028},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7920358777046204},{"id":"https://openalex.org/keywords/partial-differential-equation","display_name":"Partial differential equation","score":0.5164220929145813},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.504158616065979},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.4288051128387451},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.41663020849227905},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.40077823400497437},{"id":"https://openalex.org/keywords/mathematical-optimization","display_name":"Mathematical optimization","score":0.342646062374115},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.12462657690048218},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.11644250154495239}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.8265545964241028},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7920358777046204},{"id":"https://openalex.org/C93779851","wikidata":"https://www.wikidata.org/wiki/Q271977","display_name":"Partial differential equation","level":2,"score":0.5164220929145813},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.504158616065979},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.4288051128387451},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.41663020849227905},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.40077823400497437},{"id":"https://openalex.org/C126255220","wikidata":"https://www.wikidata.org/wiki/Q141495","display_name":"Mathematical optimization","level":1,"score":0.342646062374115},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.12462657690048218},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.11644250154495239},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3567424","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3567424","pdf_url":null,"source":{"id":"https://openalex.org/S105046310","display_name":"ACM Transactions on Design Automation of Electronic Systems","issn_l":"1084-4309","issn":["1084-4309","1557-7309"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Transactions on Design Automation of Electronic Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5199999809265137,"id":"https://metadata.un.org/sdg/8","display_name":"Decent work and economic growth"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W183171129","https://openalex.org/W2007719944","https://openalex.org/W2012624027","https://openalex.org/W2030762303","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2088296464","https://openalex.org/W2104562227","https://openalex.org/W2114178877","https://openalex.org/W2137983211","https://openalex.org/W2150608324","https://openalex.org/W2158985775","https://openalex.org/W2194775991","https://openalex.org/W2293477573","https://openalex.org/W2342660339","https://openalex.org/W2343272038","https://openalex.org/W2587645287","https://openalex.org/W2616028256","https://openalex.org/W2899283552","https://openalex.org/W2964110066","https://openalex.org/W2975937460","https://openalex.org/W3011683599","https://openalex.org/W3025958956","https://openalex.org/W3034235312","https://openalex.org/W3092923133","https://openalex.org/W3149694916","https://openalex.org/W3185777597","https://openalex.org/W3197421817","https://openalex.org/W3213035978","https://openalex.org/W4221141260","https://openalex.org/W4285018543"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2381557379","https://openalex.org/W94455562"],"abstract_inverted_index":{"The":[0,54,93],"electromigration-induced":[1],"reliability":[2,52],"issues":[3],"(EM)":[4],"in":[5],"very":[6],"large":[7],"scale":[8],"integration":[9],"(VLSI)":[10],"circuits":[11],"have":[12],"attracted":[13],"continuous":[14],"attention":[15],"due":[16],"to":[17,24,48,64],"technology":[18,31],"scaling.":[19],"Traditional":[20],"EM":[21,46,51,90,104],"methods":[22],"lead":[23],"inaccurate":[25],"results":[26,119],"incompatible":[27],"with":[28,127],"the":[29,50,66,74,89,103,112,122],"advanced":[30],"nodes.":[32],"In":[33],"this":[34],"article,":[35],"we":[36],"propose":[37],"a":[38,96],"learning-based":[39],"model":[40,124],"by":[41,121,130],"enforcing":[42],"physical":[43],"constraints":[44],"of":[45,88,114],"kinetics":[47],"solve":[49],"problem.":[53],"method":[55],"aims":[56],"at":[57],"solving":[58],"stress-based":[59],"partial":[60],"differential":[61],"equations":[62],"(PDEs)":[63],"obtain":[65],"hydrostatic":[67],"stress":[68],"evolution":[69],"on":[70,82],"interconnect":[71],"trees":[72],"during":[73],"void":[75],"nucleation":[76],"phase,":[77],"considering":[78],"varying":[79],"atom":[80],"diffusivity":[81],"each":[83],"segment,":[84],"which":[85],"is":[86],"one":[87],"random":[91],"characteristics.":[92],"approach":[94],"proposes":[95],"crafted":[97],"neural":[98],"network-based":[99],"framework":[100],"customized":[101],"for":[102],"phenomenon":[105],"and":[106,136],"provides":[107],"mesh-free":[108],"solutions":[109,128],"benefiting":[110],"from":[111],"employment":[113],"automatic":[115],"differentiation":[116],"(AD).":[117],"Experimental":[118],"obtained":[120,129],"proposed":[123],"are":[125],"compared":[126],"competing":[131],"methods,":[132],"showing":[133],"satisfactory":[134],"accuracy":[135],"computational":[137],"savings.":[138]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}