{"id":"https://openalex.org/W4318686666","doi":"https://doi.org/10.1145/3566097.3568362","title":"Data-Driven Approaches for Process Simulation and Optical Proximity Correction","display_name":"Data-Driven Approaches for Process Simulation and Optical Proximity Correction","publication_year":2023,"publication_date":"2023-01-16","ids":{"openalex":"https://openalex.org/W4318686666","doi":"https://doi.org/10.1145/3566097.3568362"},"language":"en","primary_location":{"id":"doi:10.1145/3566097.3568362","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3566097.3568362","pdf_url":null,"source":{"id":"https://openalex.org/S4363608968","display_name":"Proceedings of the 28th Asia and South Pacific Design Automation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 28th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089025176","display_name":"Hao-Chiang Shao","orcid":"https://orcid.org/0000-0002-3749-234X"},"institutions":[{"id":"https://openalex.org/I162838928","display_name":"National Chung Hsing University","ror":"https://ror.org/05vn3ca78","country_code":"TW","type":"education","lineage":["https://openalex.org/I162838928"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Hao-Chiang Shao","raw_affiliation_strings":["National Chung Hsing University, Taichung, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Chung Hsing University, Taichung, Taiwan","institution_ids":["https://openalex.org/I162838928"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051264473","display_name":"Chia\u2010Wen Lin","orcid":"https://orcid.org/0000-0002-9097-2318"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Wen Lin","raw_affiliation_strings":["National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5065439030","display_name":"Shao\u2010Yun Fang","orcid":"https://orcid.org/0000-0001-6675-2676"},"institutions":[{"id":"https://openalex.org/I154864474","display_name":"National Taiwan University of Science and Technology","ror":"https://ror.org/00q09pe49","country_code":"TW","type":"education","lineage":["https://openalex.org/I154864474"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shao-Yun Fang","raw_affiliation_strings":["National Taiwan University of Science and Technology, Taipei, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Taiwan University of Science and Technology, Taipei, Taiwan","institution_ids":["https://openalex.org/I154864474"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5089025176"],"corresponding_institution_ids":["https://openalex.org/I162838928"],"apc_list":null,"apc_paid":null,"fwci":0.5093,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.58783008,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"721","last_page":"726"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9889000058174133,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"Optical proximity correction","score":0.8373950719833374},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.7966675162315369},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7148383855819702},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6666494011878967},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6481451988220215},{"id":"https://openalex.org/keywords/process-window","display_name":"Process window","score":0.5184866786003113},{"id":"https://openalex.org/keywords/reticle","display_name":"Reticle","score":0.5138319134712219},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.4700293242931366},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.44335657358169556},{"id":"https://openalex.org/keywords/inference","display_name":"Inference","score":0.41562020778656006},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.3999924659729004},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33428823947906494},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3214123845100403},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1762067973613739},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.11343532800674438},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09528496861457825}],"concepts":[{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.8373950719833374},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.7966675162315369},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7148383855819702},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6666494011878967},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6481451988220215},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.5184866786003113},{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.5138319134712219},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.4700293242931366},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.44335657358169556},{"id":"https://openalex.org/C2776214188","wikidata":"https://www.wikidata.org/wiki/Q408386","display_name":"Inference","level":2,"score":0.41562020778656006},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.3999924659729004},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33428823947906494},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3214123845100403},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1762067973613739},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.11343532800674438},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09528496861457825},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3566097.3568362","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3566097.3568362","pdf_url":null,"source":{"id":"https://openalex.org/S4363608968","display_name":"Proceedings of the 28th Asia and South Pacific Design Automation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 28th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5299999713897705,"display_name":"Industry, innovation and infrastructure"}],"awards":[{"id":"https://openalex.org/G830142704","display_name":null,"funder_award_id":"110-2223-E-011-002-MY3","funder_id":"https://openalex.org/F4320331164","funder_display_name":"National Science and Technology Council"}],"funders":[{"id":"https://openalex.org/F4320331164","display_name":"National Science and Technology Council","ror":"https://ror.org/00wnb9798"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W2056830856","https://openalex.org/W2125389028","https://openalex.org/W2329157012","https://openalex.org/W2605287558","https://openalex.org/W2736295327","https://openalex.org/W2789968518","https://openalex.org/W2809465272","https://openalex.org/W2909499127","https://openalex.org/W2910093824","https://openalex.org/W2911061557","https://openalex.org/W2971516606","https://openalex.org/W2974976722","https://openalex.org/W3006089892","https://openalex.org/W3027658987","https://openalex.org/W3047198287","https://openalex.org/W3112693398","https://openalex.org/W3203959872","https://openalex.org/W4221152578","https://openalex.org/W6678815747","https://openalex.org/W6734166525"],"related_works":["https://openalex.org/W2068691156","https://openalex.org/W2346707445","https://openalex.org/W1976886430","https://openalex.org/W2409660592","https://openalex.org/W2072472266","https://openalex.org/W2558069187","https://openalex.org/W1975029072","https://openalex.org/W1997494202","https://openalex.org/W2011070064","https://openalex.org/W2138948620"],"abstract_inverted_index":{"With":[0],"continuous":[1],"shrinking":[2],"of":[3,68,136,165],"process":[4,35,48,87,126],"nodes,":[5],"semiconductor":[6],"manufacturing":[7],"encounters":[8],"more":[9,11,120,122],"and":[10,18,41,72,121,155],"serious":[12],"inconsistency":[13],"between":[14],"designed":[15],"layout":[16,26],"patterns":[17],"resulted":[19],"wafer":[20],"images.":[21],"Conventionally,":[22],"examining":[23],"how":[24],"a":[25,118],"pattern":[27],"can":[28],"deviate":[29],"from":[30,52],"its":[31],"original":[32],"after":[33],"complicated":[34],"steps,":[36],"such":[37],"as":[38],"optical":[39,78],"lithography":[40,110],"subsequent":[42],"etching,":[43],"relies":[44],"on":[45,125],"computationally":[46],"expensive":[47],"simulation,":[49],"which":[50],"suffers":[51],"incredibly":[53],"long":[54],"runtime":[55],"for":[56,170],"large-scale":[57],"circuit":[58],"layouts,":[59],"especially":[60],"in":[61,149,168],"advanced":[62],"nodes.":[63],"In":[64],"addition,":[65],"being":[66],"one":[67],"the":[69,132,147,163,166],"most":[70],"important":[71],"commonly":[73],"adopted":[74],"resolution":[75],"enhancement":[76],"techniques,":[77],"proximity":[79],"correction":[80],"(OPC)":[81],"corrects":[82],"image":[83],"errors":[84],"due":[85],"to":[86,97,113,131,145,160],"effects":[88],"by":[89,105],"moving":[90],"segment":[91],"edges":[92],"or":[93,107],"adding":[94],"extra":[95],"polygons":[96],"mask":[98],"patterns,":[99],"while":[100],"it":[101],"is":[102],"generally":[103],"driven":[104],"simulation":[106,127],"time-consuming":[108],"inverse":[109],"techniques":[111],"(ILTs)":[112],"achieve":[114],"acceptable":[115],"accuracy.":[116],"As":[117],"result,":[119],"state-of-the-art":[123],"works":[124],"or/and":[128],"OPC":[129],"resort":[130],"fast":[133],"inference":[134],"characteristic":[135],"machine/deep":[137],"learning.":[138],"This":[139],"paper":[140],"reviews":[141],"these":[142],"data-driven":[143],"approaches":[144],"highlight":[146],"challenges":[148],"various":[150],"aspects,":[151],"explore":[152],"preliminary":[153],"solutions,":[154],"reveal":[156],"possible":[157],"future":[158],"directions":[159],"push":[161],"forward":[162],"frontiers":[164],"research":[167],"design":[169],"manufacturability.":[171]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}