{"id":"https://openalex.org/W3203766485","doi":"https://doi.org/10.1145/3532185","title":"CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems","display_name":"CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems","publication_year":2022,"publication_date":"2022-06-14","ids":{"openalex":"https://openalex.org/W3203766485","doi":"https://doi.org/10.1145/3532185","mag":"3203766485"},"language":"en","primary_location":{"id":"doi:10.1145/3532185","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3532185","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3532185","source":{"id":"https://openalex.org/S26056741","display_name":"ACM Transactions on Architecture and Code Optimization","issn_l":"1544-3566","issn":["1544-3566","1544-3973"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Transactions on Architecture and Code Optimization","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3532185","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028956454","display_name":"Lokesh Siddhu","orcid":"https://orcid.org/0000-0002-5312-8679"},"institutions":[{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Lokesh Siddhu","raw_affiliation_strings":["Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India"],"raw_orcid":"https://orcid.org/0000-0002-5312-8679","affiliations":[{"raw_affiliation_string":"Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India","institution_ids":["https://openalex.org/I68891433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013807519","display_name":"Rajesh Kedia","orcid":"https://orcid.org/0000-0003-3711-0396"},"institutions":[{"id":"https://openalex.org/I65181880","display_name":"Indian Institute of Technology Hyderabad","ror":"https://ror.org/01j4v3x97","country_code":"IN","type":"education","lineage":["https://openalex.org/I65181880"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Rajesh Kedia","raw_affiliation_strings":["Department of CSE, Indian Institute of Technology Hyderabad, Kandi, Telangana, India"],"raw_orcid":"https://orcid.org/0000-0003-3711-0396","affiliations":[{"raw_affiliation_string":"Department of CSE, Indian Institute of Technology Hyderabad, Kandi, Telangana, India","institution_ids":["https://openalex.org/I65181880"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049432173","display_name":"Shailja Pandey","orcid":"https://orcid.org/0000-0003-3013-5128"},"institutions":[{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Shailja Pandey","raw_affiliation_strings":["Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India"],"raw_orcid":"https://orcid.org/0000-0003-3013-5128","affiliations":[{"raw_affiliation_string":"Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India","institution_ids":["https://openalex.org/I68891433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017470419","display_name":"Martin Rapp","orcid":"https://orcid.org/0000-0002-5989-2950"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Rapp","raw_affiliation_strings":["Chair for Embedded System (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany"],"raw_orcid":"https://orcid.org/0000-0002-5989-2950","affiliations":[{"raw_affiliation_string":"Chair for Embedded System (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067055700","display_name":"Anuj Pathania","orcid":"https://orcid.org/0000-0002-5813-7021"},"institutions":[{"id":"https://openalex.org/I887064364","display_name":"University of Amsterdam","ror":"https://ror.org/04dkp9463","country_code":"NL","type":"education","lineage":["https://openalex.org/I887064364"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Anuj Pathania","raw_affiliation_strings":["Informatics Departments, University of Amsterdam, Amsterdam, Netherlands"],"raw_orcid":"https://orcid.org/0000-0002-5813-7021","affiliations":[{"raw_affiliation_string":"Informatics Departments, University of Amsterdam, Amsterdam, Netherlands","institution_ids":["https://openalex.org/I887064364"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063508488","display_name":"J\u00f6rg Henkel","orcid":"https://orcid.org/0000-0001-9602-2922"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"J\u00f6rg Henkel","raw_affiliation_strings":["Chair for Embedded System (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany"],"raw_orcid":"https://orcid.org/0000-0001-9602-2922","affiliations":[{"raw_affiliation_string":"Chair for Embedded System (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027215692","display_name":"Preeti Ranjan Panda","orcid":"https://orcid.org/0000-0002-2508-7531"},"institutions":[{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Preeti Ranjan Panda","raw_affiliation_strings":["Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India"],"raw_orcid":"https://orcid.org/0000-0002-2508-7531","affiliations":[{"raw_affiliation_string":"Department of CSE, Indian Institute of Technology Delhi, New Delhi, Delhi, India","institution_ids":["https://openalex.org/I68891433"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5028956454"],"corresponding_institution_ids":["https://openalex.org/I68891433"],"apc_list":null,"apc_paid":null,"fwci":6.3033,"has_fulltext":true,"cited_by_count":29,"citation_normalized_percentile":{"value":0.97272564,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"19","issue":"3","first_page":"1","last_page":"25"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.682749330997467},{"id":"https://openalex.org/keywords/toolchain","display_name":"Toolchain","score":0.6210968494415283},{"id":"https://openalex.org/keywords/overheating","display_name":"Overheating (electricity)","score":0.5763654708862305},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5162048935890198},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4411914348602295},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.161838561296463},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.12554773688316345},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10873967409133911}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.682749330997467},{"id":"https://openalex.org/C2777062904","wikidata":"https://www.wikidata.org/wiki/Q545406","display_name":"Toolchain","level":3,"score":0.6210968494415283},{"id":"https://openalex.org/C2778284599","wikidata":"https://www.wikidata.org/wiki/Q25340000","display_name":"Overheating (electricity)","level":2,"score":0.5763654708862305},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5162048935890198},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4411914348602295},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.161838561296463},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.12554773688316345},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10873967409133911},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/3532185","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3532185","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3532185","source":{"id":"https://openalex.org/S26056741","display_name":"ACM Transactions on Architecture and Code Optimization","issn_l":"1544-3566","issn":["1544-3566","1544-3973"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Transactions on Architecture and Code Optimization","raw_type":"journal-article"},{"id":"pmh:oai:raiith.iith.ac.in:10622","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S4306400292","display_name":"Research Archive of Indian Institute of Technology Hyderabad (Indian Institute of Technology Hyderabad)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I65181880","host_organization_name":"Indian Institute of Technology Hyderabad","host_organization_lineage":["https://openalex.org/I65181880"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"","raw_type":"Article"},{"id":"pmh:oai:dare.uva.nl:publications/f61cbca2-6549-4429-974e-4de9069f7c51","is_oa":true,"landing_page_url":"https://handle.uba.uva.nl/personal/pure/en/publications/comet-an-integrated-interval-thermal-simulation-toolchain-for-2d-25-d-and-3d-processormemory-systems(f61cbca2-6549-4429-974e-4de9069f7c51).html","pdf_url":"https://pure.uva.nl/ws/files/138874426/CoMeT.pdf","source":{"id":"https://openalex.org/S4306400088","display_name":"UvA-DARE (University of Amsterdam)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I887064364","host_organization_name":"University of Amsterdam","host_organization_lineage":["https://openalex.org/I887064364"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Siddhu, L, Kedia, R, Pandey, S, Rapp, M, Pathania, A, Henkel, J & Panda, P R 2022, 'CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems', ACM Transactions on Architecture and Code Optimization, vol. 19, no. 3, 44. https://doi.org/10.1145/3532185","raw_type":"info:eu-repo/semantics/publishedVersion"}],"best_oa_location":{"id":"doi:10.1145/3532185","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3532185","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3532185","source":{"id":"https://openalex.org/S26056741","display_name":"ACM Transactions on Architecture and Code Optimization","issn_l":"1544-3566","issn":["1544-3566","1544-3973"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Transactions on Architecture and Code Optimization","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3203766485.pdf","grobid_xml":"https://content.openalex.org/works/W3203766485.grobid-xml"},"referenced_works_count":64,"referenced_works":["https://openalex.org/W190062532","https://openalex.org/W1596277129","https://openalex.org/W1602888674","https://openalex.org/W1972916006","https://openalex.org/W1974307224","https://openalex.org/W1980072970","https://openalex.org/W1981141412","https://openalex.org/W1994908438","https://openalex.org/W2018129150","https://openalex.org/W2025110944","https://openalex.org/W2046574526","https://openalex.org/W2046813310","https://openalex.org/W2051525823","https://openalex.org/W2063718160","https://openalex.org/W2078067171","https://openalex.org/W2080562887","https://openalex.org/W2103238722","https://openalex.org/W2131413854","https://openalex.org/W2133181071","https://openalex.org/W2142082169","https://openalex.org/W2145021036","https://openalex.org/W2147657366","https://openalex.org/W2150909864","https://openalex.org/W2152850399","https://openalex.org/W2153114155","https://openalex.org/W2153502022","https://openalex.org/W2154001575","https://openalex.org/W2169875292","https://openalex.org/W2170382128","https://openalex.org/W2285789556","https://openalex.org/W2343130326","https://openalex.org/W2345330289","https://openalex.org/W2345834493","https://openalex.org/W2398215041","https://openalex.org/W2475636809","https://openalex.org/W2512569446","https://openalex.org/W2531302887","https://openalex.org/W2545960051","https://openalex.org/W2581035600","https://openalex.org/W2582722821","https://openalex.org/W2758168304","https://openalex.org/W2773759500","https://openalex.org/W2789838752","https://openalex.org/W2796645376","https://openalex.org/W2806120045","https://openalex.org/W2908010746","https://openalex.org/W2909318183","https://openalex.org/W2917720315","https://openalex.org/W2947723533","https://openalex.org/W2979616436","https://openalex.org/W2979967650","https://openalex.org/W3006586535","https://openalex.org/W3085005384","https://openalex.org/W3088685084","https://openalex.org/W3093483245","https://openalex.org/W3146763006","https://openalex.org/W3161177728","https://openalex.org/W3174762441","https://openalex.org/W3213031690","https://openalex.org/W4200417963","https://openalex.org/W4205499638","https://openalex.org/W4234851174","https://openalex.org/W4240341390","https://openalex.org/W4300059161"],"related_works":["https://openalex.org/W4318615363","https://openalex.org/W2008502585","https://openalex.org/W2790577034","https://openalex.org/W2118298038","https://openalex.org/W2084986771","https://openalex.org/W3205308878","https://openalex.org/W1995590221","https://openalex.org/W2588683395","https://openalex.org/W2045545092","https://openalex.org/W2083162761"],"abstract_inverted_index":{"Processing":[0],"cores":[1,88,121,143],"and":[2,113,122,211,227,243],"the":[3,25,47,63,75,79,84,90,125,140,150,154,178,207,283],"accompanying":[4],"main":[5],"memory":[6,102,123,138],"working":[7],"in":[8,49,52,72,89,165,185],"tandem":[9],"enable":[10],"modern":[11],"processors.":[12,23,54,200],"Dissipating":[13],"heat":[14],"produced":[15],"from":[16],"computation":[17],"remains":[18],"a":[19],"significant":[20],"problem":[21],"for":[22,183,194,198,279],"Therefore,":[24,161],"thermal":[26,39,59,70,85,163,181,188,196,223],"management":[27,40,71,86,197],"of":[28,36,66,87,137,142,153,180,225,273],"processors":[29,73,108,167,229],"continues":[30],"to":[31,68,110,159,231,264],"be":[32],"an":[33,258,265],"active":[34],"subject":[35],"research.":[37,254],"Most":[38],"research":[41,64],"is":[42],"performed":[43],"using":[44],"simulations,":[45],"given":[46,177],"challenges":[48],"measuring":[50],"temperatures":[51],"real":[53],"Fast":[55],"yet":[56],"accurate":[57],"interval":[58,187,213],"simulation":[60,189,218,224],"toolchains":[61,81],"remain":[62],"tool":[65],"choice":[67],"study":[69],"at":[74],"system":[76,253],"level.":[77],"However,":[78,176],"existing":[80,186],"focus":[82],"on":[83,124,139],"processors,":[91,155],"since":[92],"they":[93,191],"exhibit":[94],"much":[95],"higher":[96],"power":[97,151],"densities":[98],"than":[99],"memory.":[100],"The":[101,270],"bandwidth":[103],"limitations":[104],"associated":[105],"with":[106,169],"2D":[107],"lead":[109],"high-density":[111,166,199],"2.5D":[112,117],"3D":[114,128,240],"packaging":[115,118,129],"technology:":[116],"technology":[119,130],"places":[120],"same":[126],"package;":[127],"takes":[131],"it":[132],"further":[133],"by":[134],"stacking":[135],"layers":[136],"top":[141],"themselves.":[144],"These":[145],"new":[146],"packagings":[147],"significantly":[148],"increase":[149],"density":[152],"making":[156],"them":[157],"prone":[158],"overheating.":[160],"mitigating":[162],"issues":[164],"(packaged":[168],"stacked":[170],"memory)":[171],"becomes":[172],"even":[173],"more":[174],"pressing.":[175],"lack":[179],"modeling":[182],"memories":[184],"toolchains,":[190],"are":[192],"unsuitable":[193],"studying":[195],"To":[201],"address":[202],"this":[203],"issue,":[204],"we":[205],"present":[206],"first":[208],"integrated":[209],"Core":[210],"Memory":[212],"Thermal":[214],"(":[215],"CoMeT":[216,220,245,255,274],")":[217],"toolchain.":[219,269],"comprehensively":[221],"supports":[222,246],"high-":[226],"low-density":[228],"corresponding":[230],"four":[232],"different":[233],"core-memory":[234],"(integration)":[235],"configurations\u2014off-chip":[236],"DDR":[237],"memory,":[238,241],"off-chip":[239],"2.5D,":[242],"3D.":[244],"several":[247],"novel":[248],"features":[249],"that":[250],"facilitate":[251],"overlying":[252],"adds":[256],"only":[257],"additional":[259],"~5%":[260],"simulation-time":[261],"overhead":[262],"compared":[263],"equivalent":[266],"state-of-the-art":[267],"core-only":[268],"source":[271],"code":[272],"has":[275],"been":[276],"made":[277],"open":[278],"public":[280],"use":[281],"under":[282],"MIT":[284],"license.":[285]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":7},{"year":2023,"cited_by_count":12},{"year":2022,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}