{"id":"https://openalex.org/W4223938077","doi":"https://doi.org/10.1145/3505170.3511798","title":"Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance","display_name":"Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance","publication_year":2022,"publication_date":"2022-04-13","ids":{"openalex":"https://openalex.org/W4223938077","doi":"https://doi.org/10.1145/3505170.3511798"},"language":"en","primary_location":{"id":"doi:10.1145/3505170.3511798","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3505170.3511798","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2022 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036199179","display_name":"Armen Kteyan","orcid":"https://orcid.org/0000-0002-8743-0155"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Armen Kteyan","raw_affiliation_strings":["Siemens EDA, Yerevan, Armenia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Yerevan, Armenia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089574594","display_name":"Jun-Ho Choy","orcid":"https://orcid.org/0000-0002-8977-5720"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jun-Ho Choy","raw_affiliation_strings":["Siemens EDA, Fremont, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021627904","display_name":"Valeriy Sukharev","orcid":"https://orcid.org/0000-0002-5647-0584"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Valeriy Sukharev","raw_affiliation_strings":["Siemens EDA, Fremont, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021372327","display_name":"Massimo Bertoletti","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142603","display_name":"Siemens (Italy)","ror":"https://ror.org/04f6ygk28","country_code":"IT","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210142603"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Massimo Bertoletti","raw_affiliation_strings":["Siemens EDA, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Milano, Italy","institution_ids":["https://openalex.org/I4210142603"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079279958","display_name":"Carmelo Maiorca","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142603","display_name":"Siemens (Italy)","ror":"https://ror.org/04f6ygk28","country_code":"IT","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210142603"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Carmelo Maiorca","raw_affiliation_strings":["Siemens EDA, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Milano, Italy","institution_ids":["https://openalex.org/I4210142603"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028052091","display_name":"Rossana Zadra","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142603","display_name":"Siemens (Italy)","ror":"https://ror.org/04f6ygk28","country_code":"IT","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210142603"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Rossana Zadra","raw_affiliation_strings":["Siemens EDA, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Milano, Italy","institution_ids":["https://openalex.org/I4210142603"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060326832","display_name":"Massimo Inzaghi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142603","display_name":"Siemens (Italy)","ror":"https://ror.org/04f6ygk28","country_code":"IT","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210142603"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Massimo Inzaghi","raw_affiliation_strings":["Siemens EDA, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA, Milano, Italy","institution_ids":["https://openalex.org/I4210142603"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057850531","display_name":"Gabriele Gattere","orcid":"https://orcid.org/0009-0001-4091-9578"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Gabriele Gattere","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074354367","display_name":"Giancarlo Zinco","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Giancarlo Zinco","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030678462","display_name":"P. Valente","orcid":"https://orcid.org/0000-0002-5413-0068"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Paolo Valente","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021927320","display_name":"Roberto Bardelli","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Roberto Bardelli","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085233052","display_name":"Alessandro Valerio","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alessandro Valerio","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109242172","display_name":"Pierluigi Rolandi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Pierluigi Rolandi","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053061085","display_name":"Mattia Monetti","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Mattia Monetti","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003821378","display_name":"Valentina Cuomo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Valentina Cuomo","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072946753","display_name":"Salvatore Santap\u00e0","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Salvatore Santap\u00e0","raw_affiliation_strings":["STMicroelectronics, Milano, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":16,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.01981399,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"83","last_page":"89"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5886346697807312},{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.5846582055091858},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.555939793586731},{"id":"https://openalex.org/keywords/schematic","display_name":"Schematic","score":0.5455708503723145},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5215252041816711},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5043603181838989},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.47870543599128723},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.45877915620803833},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.45120370388031006},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4253010153770447},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.17301157116889954},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1681903898715973},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.1675281822681427},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.1284354031085968}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5886346697807312},{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.5846582055091858},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.555939793586731},{"id":"https://openalex.org/C192328126","wikidata":"https://www.wikidata.org/wiki/Q4514647","display_name":"Schematic","level":2,"score":0.5455708503723145},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5215252041816711},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5043603181838989},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.47870543599128723},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.45877915620803833},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.45120370388031006},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4253010153770447},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.17301157116889954},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1681903898715973},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.1675281822681427},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.1284354031085968},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3505170.3511798","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3505170.3511798","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2022 International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1972584722","https://openalex.org/W2002257666","https://openalex.org/W2102588501","https://openalex.org/W2604131602","https://openalex.org/W3015954248","https://openalex.org/W3097813334","https://openalex.org/W4250230444"],"related_works":["https://openalex.org/W2253391080","https://openalex.org/W2365383750","https://openalex.org/W1590828620","https://openalex.org/W3022507253","https://openalex.org/W2138574771","https://openalex.org/W2513052177","https://openalex.org/W1585722462","https://openalex.org/W1945437321","https://openalex.org/W1513521697","https://openalex.org/W1595181365"],"abstract_inverted_index":{"The":[0,119],"paper":[1],"presents":[2],"a":[3,134,201],"multiscale":[4],"simulation":[5,74,139],"methodology":[6,42],"and":[7,31,57,61,167,172,216],"EDA":[8],"tool":[9,94],"that":[10,51],"assesses":[11],"the":[12,44,59,66,73,93,102,109,125,130,146,153,160,183,194,210],"effect":[13],"of":[14,28,34,43,54,65,80,98,105,116,122,124,209,219],"thermal":[15],"mechanical":[16],"stresses":[17],"arising":[18],"after":[19],"die":[20,165],"assembly":[21],"on":[22,200],"chip":[23],"performance.":[24,62,118],"Existing":[25],"non":[26],"uniformities":[27],"feature":[29],"geometries":[30],"composite":[32],"nature":[33,64],"on-chip":[35],"interconnect":[36],"layers":[37],"are":[38],"addressed":[39],"by":[40,144,156],"developed":[41],"anisotropic":[45],"effective":[46],"thermomechanical":[47],"material":[48],"properties":[49],"(EMP)":[50],"reduces":[52],"complexity":[53],"FEA":[55],"simulations":[56],"enhances":[58],"accuracy":[60],"Physical":[63],"calculated":[67],"EMP":[68],"makes":[69],"it":[70],"scalable":[71],"with":[72,129],"grid":[75],"size,":[76],"which":[77],"enables":[78,95],"resolution":[79],"stress/strain":[81],"at":[82,186],"different":[83,141,150,157],"scales":[84],"from":[85,159],"package":[86],"to":[87,136],"device":[88,220],"channel.":[89],"With":[90],"feature-scale":[91],"resolution,":[92],"accurate":[96],"calculation":[97],"stress":[99,131,142,161,184],"components":[100],"in":[101,114,140,149,152],"active":[103],"region":[104],"each":[106],"device,":[107],"where":[108],"carrier":[110],"mobility":[111],"variation":[112],"results":[113],"deviations":[115],"circuits":[117],"tool's":[120],"capability":[121],"back-annotation":[123],"hierarchic":[126],"Spice":[127],"netlist":[128],"values":[132],"allows":[133],"user":[135],"perform":[137],"circuit":[138,147],"environments,":[143],"placing":[145],"block":[148],"locations":[151],"layout":[154],"characterized":[155],"distances":[158],"sources,":[162],"such":[163],"as":[164,190,192],"edges":[166],"C4":[168],"bumps.":[169],"Both":[170],"schematic":[171],"post-layout":[173],"netlists":[174],"can":[175],"be":[176],"employed":[177],"for":[178,193,207],"finding":[179],"optimal":[180],"floorplan":[181],"minimizing":[182],"impact":[185],"early":[187],"design":[188,196],"stages,":[189],"well":[191],"final":[195],"sign-off.":[197],"Electrical":[198],"measurements":[199],"specially":[202],"designed":[203],"test-package":[204],"were":[205],"used":[206],"validation":[208],"methodology.":[211],"Good":[212],"agreement":[213],"between":[214],"measured":[215],"simulated":[217],"variations":[218],"characteristics":[221],"has":[222],"been":[223],"demonstrated.":[224]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}