{"id":"https://openalex.org/W4223991291","doi":"https://doi.org/10.1145/3505170.3506725","title":"ART-3D: Analytical 3D Placement with Reinforced Parameter Tuning for Monolithic 3D ICs","display_name":"ART-3D: Analytical 3D Placement with Reinforced Parameter Tuning for Monolithic 3D ICs","publication_year":2022,"publication_date":"2022-04-13","ids":{"openalex":"https://openalex.org/W4223991291","doi":"https://doi.org/10.1145/3505170.3506725"},"language":"en","primary_location":{"id":"doi:10.1145/3505170.3506725","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3505170.3506725","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2022 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086357798","display_name":"Gauthaman Murali","orcid":"https://orcid.org/0000-0003-0146-4977"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Gauthaman Murali","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088074078","display_name":"Sandra Maria Shaji","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sandra Maria Shaji","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017765050","display_name":"Anthony Agnesina","orcid":"https://orcid.org/0000-0003-0393-0230"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anthony Agnesina","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023468643","display_name":"Guojie Luo","orcid":"https://orcid.org/0000-0003-4932-3655"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guojie Luo","raw_affiliation_strings":["Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5086357798"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":1.0063,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.73930824,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"97","last_page":"104"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.8828349113464355},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6928309202194214},{"id":"https://openalex.org/keywords/reinforcement-learning","display_name":"Reinforcement learning","score":0.5676503777503967},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.5489127039909363},{"id":"https://openalex.org/keywords/flow","display_name":"Flow (mathematics)","score":0.526201069355011},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.5218200087547302},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5149227380752563},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.4631834030151367},{"id":"https://openalex.org/keywords/placement","display_name":"Placement","score":0.4195183515548706},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.3694745898246765},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.1950010359287262},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.14859893918037415},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14164718985557556},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.13651025295257568},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.12289738655090332}],"concepts":[{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.8828349113464355},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6928309202194214},{"id":"https://openalex.org/C97541855","wikidata":"https://www.wikidata.org/wiki/Q830687","display_name":"Reinforcement learning","level":2,"score":0.5676503777503967},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.5489127039909363},{"id":"https://openalex.org/C38349280","wikidata":"https://www.wikidata.org/wiki/Q1434290","display_name":"Flow (mathematics)","level":2,"score":0.526201069355011},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.5218200087547302},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5149227380752563},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.4631834030151367},{"id":"https://openalex.org/C117690923","wikidata":"https://www.wikidata.org/wiki/Q1484784","display_name":"Placement","level":4,"score":0.4195183515548706},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.3694745898246765},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.1950010359287262},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.14859893918037415},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14164718985557556},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.13651025295257568},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.12289738655090332},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3505170.3506725","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3505170.3506725","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2022 International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.6200000047683716,"id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G3414858298","display_name":null,"funder_award_id":"NRF-2020M3F3A2A02082445","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G6628780014","display_name":null,"funder_award_id":"GRC Task 2929","funder_id":"https://openalex.org/F4320306087","funder_display_name":"Semiconductor Research Corporation"}],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2100218206","https://openalex.org/W2130923737","https://openalex.org/W2160849628","https://openalex.org/W2284397099","https://openalex.org/W2785313678","https://openalex.org/W2979298516","https://openalex.org/W3011978806","https://openalex.org/W3110928049","https://openalex.org/W3136387861","https://openalex.org/W4250165014"],"related_works":["https://openalex.org/W4245336546","https://openalex.org/W2123076670","https://openalex.org/W2038511870","https://openalex.org/W2543290882","https://openalex.org/W2169510384","https://openalex.org/W2126475478","https://openalex.org/W2326620043","https://openalex.org/W4386859294","https://openalex.org/W2132668926","https://openalex.org/W2077246255"],"abstract_inverted_index":{"In":[0],"this":[1,24],"paper,":[2],"we":[3,26],"show":[4],"that":[5],"true":[6,30,68,108,137],"3D":[7,31,37,45,51,69,79,86,109,117,134,138,148,197],"placement":[8,32,63,70,110,139],"approaches,":[9],"enhanced":[10],"with":[11,47,176],"reinforcement":[12,56],"learning,":[13],"can":[14],"offer":[15],"further":[16],"PPA":[17,143],"improvements":[18,183],"over":[19],"pseudo-3D":[20],"approaches.":[21],"To":[22],"accomplish":[23],"goal,":[25],"integrate":[27],"an":[28,84],"academic":[29],"engine":[33,71,90],"into":[34],"a":[35,55,73,93,127],"commercial-grade":[36],"physical":[38],"design":[39,112,180],"flow,":[40],"creating":[41],"ART-3D":[42],"flow":[43,118,135],"(Analytical":[44],"Placement":[46],"Reinforced":[48],"Parameter":[49],"Tuning-based":[50],"flow).":[52],"We":[53,81,114],"use":[54,83],"learning":[57],"(RL)":[58],"framework":[59],"to":[60,100,146,157,164,173,201],"find":[61],"optimized":[62],"parameter":[64,188],"settings":[65],"of":[66,195],"the":[67,104,141,193,196],"for":[72],"given":[74],"netlist":[75],"and":[76,88,96,123,151,166],"perform":[77],"high-quality":[78],"placement.":[80],"then":[82],"efficient":[85],"optimization":[87],"routing":[89],"based":[91],"on":[92,126],"commercial":[94,128,177],"place":[95],"route":[97],"(P&R)":[98],"tool":[99],"maintain":[101],"or":[102],"improve":[103],"benefits":[105],"reaped":[106],"from":[107,186],"till":[111],"signoff.":[113],"evaluate":[115],"our":[116],"by":[119,155,162,171,199],"designing":[120],"several":[121],"gate-only":[122],"processor":[124],"benchmarks":[125],"28nm":[129],"technology":[130],"node.":[131],"Our":[132],"proposed":[133],"involving":[136],"offers":[140],"best":[142],"results":[144],"compared":[145,175],"existing":[147],"P&R":[149],"flows":[150],"reduces":[152,168],"power":[153],"consumption":[154],"up":[156,163,172,200],"31%,":[158],"improves":[159,192],"effective":[160],"frequency":[161],"25%,":[165],"therefore":[167],"power-delay":[169],"product":[170],"43%":[174],"2D":[178],"IC":[179],"flow.":[181],"These":[182],"predominantly":[184],"come":[185],"RL-based":[187],"tuning,":[189],"as":[190],"it":[191],"performance":[194],"placer":[198],"12%.":[202]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":6}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}