{"id":"https://openalex.org/W4200385851","doi":"https://doi.org/10.1145/3495000","title":"ModElec","display_name":"ModElec","publication_year":2021,"publication_date":"2021-12-27","ids":{"openalex":"https://openalex.org/W4200385851","doi":"https://doi.org/10.1145/3495000"},"language":"en","primary_location":{"id":"doi:10.1145/3495000","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3495000","pdf_url":null,"source":{"id":"https://openalex.org/S4210219751","display_name":"Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies","issn_l":"2474-9567","issn":["2474-9567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100317921","display_name":"Liang He","orcid":"https://orcid.org/0000-0003-4826-629X"},"institutions":[{"id":"https://openalex.org/I201448701","display_name":"University of Washington","ror":"https://ror.org/00cvxb145","country_code":"US","type":"education","lineage":["https://openalex.org/I201448701"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liang He","raw_affiliation_strings":["Paul G. Allen School of Computer Science & Engineering, University of Washington, NE, Seattle, WA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Paul G. Allen School of Computer Science & Engineering, University of Washington, NE, Seattle, WA, USA","institution_ids":["https://openalex.org/I201448701"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039199230","display_name":"Jarrid A. Wittkopf","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122178","display_name":"Hewlett Packard Enterprise (United States)","ror":"https://ror.org/020x0c621","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122178"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jarrid A. Wittkopf","raw_affiliation_strings":["HP, Palo Alto, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HP, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I4210122178"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002151526","display_name":"Ji Won Jun","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ji Won Jun","raw_affiliation_strings":["HP Labs, Palo Alto, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HP Labs, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044035102","display_name":"Kris Erickson","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122178","display_name":"Hewlett Packard Enterprise (United States)","ror":"https://ror.org/020x0c621","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122178"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kris Erickson","raw_affiliation_strings":["HP Incorporated, Palo Alto, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HP Incorporated, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I4210122178"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109240172","display_name":"Rafael Ballagas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122178","display_name":"Hewlett Packard Enterprise (United States)","ror":"https://ror.org/020x0c621","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122178"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rafael Tico Ballagas","raw_affiliation_strings":["HP Inc., Palo Alto, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"HP Inc., Palo Alto, CA, USA","institution_ids":["https://openalex.org/I4210122178"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2547,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.79782838,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"5","issue":"4","first_page":"1","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9950000047683716,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/debugging","display_name":"Debugging","score":0.7559230327606201},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7273744344711304},{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.7121800184249878},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.5568260550498962},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5430618524551392},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.4383472502231598},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.41869089007377625},{"id":"https://openalex.org/keywords/design-tool","display_name":"Design tool","score":0.4158782362937927},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.41254520416259766},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3748443126678467},{"id":"https://openalex.org/keywords/human\u2013computer-interaction","display_name":"Human\u2013computer interaction","score":0.3304878771305084},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3267260789871216},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.28025591373443604},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.13160476088523865},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.10200080275535583},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08366984128952026},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.08011913299560547}],"concepts":[{"id":"https://openalex.org/C168065819","wikidata":"https://www.wikidata.org/wiki/Q845566","display_name":"Debugging","level":2,"score":0.7559230327606201},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7273744344711304},{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.7121800184249878},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.5568260550498962},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5430618524551392},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.4383472502231598},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.41869089007377625},{"id":"https://openalex.org/C2777466363","wikidata":"https://www.wikidata.org/wiki/Q17008971","display_name":"Design tool","level":2,"score":0.4158782362937927},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.41254520416259766},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3748443126678467},{"id":"https://openalex.org/C107457646","wikidata":"https://www.wikidata.org/wiki/Q207434","display_name":"Human\u2013computer interaction","level":1,"score":0.3304878771305084},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3267260789871216},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.28025591373443604},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13160476088523865},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10200080275535583},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08366984128952026},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.08011913299560547},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3495000","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3495000","pdf_url":null,"source":{"id":"https://openalex.org/S4210219751","display_name":"Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies","issn_l":"2474-9567","issn":["2474-9567"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4000000059604645,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":48,"referenced_works":["https://openalex.org/W815080081","https://openalex.org/W1845382878","https://openalex.org/W1964907068","https://openalex.org/W1984399688","https://openalex.org/W1994547327","https://openalex.org/W2034526488","https://openalex.org/W2045279221","https://openalex.org/W2047947115","https://openalex.org/W2071620178","https://openalex.org/W2079316448","https://openalex.org/W2113111887","https://openalex.org/W2147326417","https://openalex.org/W2168018860","https://openalex.org/W2193303691","https://openalex.org/W2198727081","https://openalex.org/W2218683243","https://openalex.org/W2406520034","https://openalex.org/W2406687334","https://openalex.org/W2407832777","https://openalex.org/W2410055381","https://openalex.org/W2460832736","https://openalex.org/W2534558385","https://openalex.org/W2560776569","https://openalex.org/W2602506628","https://openalex.org/W2611629043","https://openalex.org/W2624544962","https://openalex.org/W2736736250","https://openalex.org/W2795403405","https://openalex.org/W2807991816","https://openalex.org/W2881217838","https://openalex.org/W2896018541","https://openalex.org/W2902099625","https://openalex.org/W2925130711","https://openalex.org/W2941263421","https://openalex.org/W2942288414","https://openalex.org/W2959024664","https://openalex.org/W2962947588","https://openalex.org/W2975357592","https://openalex.org/W2980319421","https://openalex.org/W2980320664","https://openalex.org/W3029740816","https://openalex.org/W3094083774","https://openalex.org/W3094123077","https://openalex.org/W3100353733","https://openalex.org/W3117426587","https://openalex.org/W3161065906","https://openalex.org/W4235179118","https://openalex.org/W4246058654"],"related_works":["https://openalex.org/W4321442002","https://openalex.org/W2015265939","https://openalex.org/W2284072287","https://openalex.org/W2611067230","https://openalex.org/W2480201319","https://openalex.org/W2387706296","https://openalex.org/W2155788121","https://openalex.org/W1936058338","https://openalex.org/W1989826251","https://openalex.org/W2911696970"],"abstract_inverted_index":{"Integrating":[0],"electronics":[1],"with":[2,78,97,112,123,149],"highly":[3],"custom":[4],"3D":[5,31,37,79,91,105,115],"designs":[6],"for":[7,44],"the":[8,27,42,51,62,83,94,103,119,137],"physical":[9,68],"fabrication":[10],"of":[11,21,30,65,121,130],"interactive":[12,46,57],"prototypes":[13],"is":[14],"traditionally":[15],"cumbersome":[16],"and":[17,24,36,67,101],"requires":[18],"numerous":[19],"iterations":[20],"manual":[22],"assembly":[23],"debugging.":[25],"With":[26,81],"new":[28],"capabilities":[29],"printers,":[32],"combining":[33],"electronic":[34,66,87],"design":[35,58,69,96],"modeling":[38],"workflows":[39],"can":[40,85,108],"lower":[41],"barrier":[43],"achieving":[45],"functionality":[47],"or":[48],"iterating":[49],"on":[50],"overall":[52],"design.":[53],"We":[54,117],"present":[55],"ModElec---an":[56],"tool":[59,138],"that":[60,107],"enables":[61],"coordinated":[63],"expression":[64],"intent":[70],"by":[71],"allowing":[72],"designers":[73],"to":[74,133,143],"integrate":[75],"3D-printable":[76],"circuits":[77,99],"forms.":[80],"ModElec,":[82],"user":[84],"arrange":[86],"parts":[88],"in":[89],"a":[90,113,128,146],"body,":[92],"modify":[93],"model":[95],"embedded":[98],"updated,":[100],"preview":[102],"auto-generated":[104],"traces":[106],"be":[109],"directly":[110],"printed":[111],"multi-material-based":[114],"printer.":[116],"demonstrate":[118],"potential":[120],"ModElec":[122],"four":[124],"example":[125],"applications,":[126],"from":[127],"set":[129],"game":[131],"controls":[132],"reconfigurable":[134],"devices.":[135],"Further,":[136],"was":[139],"reported":[140],"as":[141],"easy":[142],"use":[144],"through":[145],"preliminary":[147],"evaluation":[148],"eight":[150],"designers.":[151]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":2}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2021-12-31T00:00:00"}