{"id":"https://openalex.org/W4211086981","doi":"https://doi.org/10.1145/3490149.3505577","title":"Smart Textile Using 3D Printed Conductive Sequins","display_name":"Smart Textile Using 3D Printed Conductive Sequins","publication_year":2022,"publication_date":"2022-02-08","ids":{"openalex":"https://openalex.org/W4211086981","doi":"https://doi.org/10.1145/3490149.3505577"},"language":"en","primary_location":{"id":"doi:10.1145/3490149.3505577","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3490149.3505577","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019675427","display_name":"Hua Ma","orcid":"https://orcid.org/0000-0002-8838-0778"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hua Ma","raw_affiliation_strings":["Keio University, Japan"],"affiliations":[{"raw_affiliation_string":"Keio University, Japan","institution_ids":["https://openalex.org/I203951103"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073143447","display_name":"Junichi Yamaoka","orcid":"https://orcid.org/0000-0002-1544-7564"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Junichi Yamaoka","raw_affiliation_strings":["Keio University, Japan"],"affiliations":[{"raw_affiliation_string":"Keio University, Japan","institution_ids":["https://openalex.org/I203951103"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5019675427"],"corresponding_institution_ids":["https://openalex.org/I203951103"],"apc_list":null,"apc_paid":null,"fwci":0.0782,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.32570423,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9807999730110168,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.791912317276001},{"id":"https://openalex.org/keywords/textile","display_name":"Textile","score":0.7157673239707947},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.6746927499771118},{"id":"https://openalex.org/keywords/electrically-conductive","display_name":"Electrically conductive","score":0.42754003405570984},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41107094287872314},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3883991837501526},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2318233847618103},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2270016074180603},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.1644459366798401}],"concepts":[{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.791912317276001},{"id":"https://openalex.org/C164767435","wikidata":"https://www.wikidata.org/wiki/Q28823","display_name":"Textile","level":2,"score":0.7157673239707947},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.6746927499771118},{"id":"https://openalex.org/C3020000807","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrically conductive","level":2,"score":0.42754003405570984},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41107094287872314},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3883991837501526},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2318233847618103},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2270016074180603},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.1644459366798401}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/3490149.3505577","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3490149.3505577","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction","raw_type":"proceedings-article"},{"id":"pmh:koara-j:koara_id/KO40001001-00002021-0927","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S4377196406","display_name":"KeiO Associated Repository of Academic Resources (Keio University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I203951103","host_organization_name":"Keio University","host_organization_lineage":["https://openalex.org/I203951103"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""},{"id":"pmh:koara-j:koara_id/KO40001001-00002021-0927","is_oa":false,"landing_page_url":"https://koara.lib.keio.ac.jp/xoonips/modules/xoonips/detail.php?koara_id=KO40001001-00002021-0927","pdf_url":null,"source":{"id":"https://openalex.org/S4377196406","display_name":"KeiO Associated Repository of Academic Resources (Keio University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I203951103","host_organization_name":"Keio University","host_organization_lineage":["https://openalex.org/I203951103"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"NIIType:Thesis or Dissertation"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W2810531573","https://openalex.org/W2962835412","https://openalex.org/W2980411555","https://openalex.org/W2980887891","https://openalex.org/W3028892895","https://openalex.org/W3029310617","https://openalex.org/W3040047047","https://openalex.org/W3092967957","https://openalex.org/W3129871069","https://openalex.org/W3131796024","https://openalex.org/W3162308512","https://openalex.org/W3216697752"],"related_works":["https://openalex.org/W3107652906","https://openalex.org/W2393365986","https://openalex.org/W2623459820","https://openalex.org/W2156704392","https://openalex.org/W778742068","https://openalex.org/W4243215209","https://openalex.org/W2232413603","https://openalex.org/W4211178418","https://openalex.org/W2766710219","https://openalex.org/W2376542070"],"abstract_inverted_index":{"In":[0],"this":[1],"study,":[2],"we":[3],"propose":[4],"the":[5],"design":[6],"and":[7],"implementation":[8],"of":[9],"a":[10,18],"smart":[11],"textile":[12],"using":[13],"conductive":[14],"sequins":[15],"produced":[16],"by":[17],"3D":[19],"printer":[20],"based":[21],"on":[22],"traditional":[23],"sequin":[24],"embroidery.":[25]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2025-10-10T00:00:00"}