{"id":"https://openalex.org/W3202285417","doi":"https://doi.org/10.1145/3477244.3477619","title":"Determining MPSoC layout from thermal camera images","display_name":"Determining MPSoC layout from thermal camera images","publication_year":2021,"publication_date":"2021-09-30","ids":{"openalex":"https://openalex.org/W3202285417","doi":"https://doi.org/10.1145/3477244.3477619","mag":"3202285417"},"language":"en","primary_location":{"id":"doi:10.1145/3477244.3477619","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3477244.3477619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2021 International Conference on Embedded Software","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/10467/98840","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085476423","display_name":"Micha\u0142 S\u00f3jka","orcid":"https://orcid.org/0000-0002-8738-075X"},"institutions":[{"id":"https://openalex.org/I44504214","display_name":"Czech Technical University in Prague","ror":"https://ror.org/03kqpb082","country_code":"CZ","type":"education","lineage":["https://openalex.org/I44504214"]}],"countries":["CZ"],"is_corresponding":true,"raw_author_name":"Michal Sojka","raw_affiliation_strings":["Czech Technical University in Prague, Prague, Czech republic"],"affiliations":[{"raw_affiliation_string":"Czech Technical University in Prague, Prague, Czech republic","institution_ids":["https://openalex.org/I44504214"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039707537","display_name":"Ond\u0159ej Benedikt","orcid":"https://orcid.org/0000-0002-7365-844X"},"institutions":[{"id":"https://openalex.org/I44504214","display_name":"Czech Technical University in Prague","ror":"https://ror.org/03kqpb082","country_code":"CZ","type":"education","lineage":["https://openalex.org/I44504214"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"Ond\u0159ej Benedikt","raw_affiliation_strings":["Czech Technical University in Prague, Prague, Czech republic"],"affiliations":[{"raw_affiliation_string":"Czech Technical University in Prague, Prague, Czech republic","institution_ids":["https://openalex.org/I44504214"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039174863","display_name":"Zden\u011bk Hanz\u00e1lek","orcid":"https://orcid.org/0000-0002-8135-1296"},"institutions":[{"id":"https://openalex.org/I44504214","display_name":"Czech Technical University in Prague","ror":"https://ror.org/03kqpb082","country_code":"CZ","type":"education","lineage":["https://openalex.org/I44504214"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"Zden\u011bk Hanz\u00e1lek","raw_affiliation_strings":["Czech Technical University in Prague, Prague, Czech republic"],"affiliations":[{"raw_affiliation_string":"Czech Technical University in Prague, Prague, Czech republic","institution_ids":["https://openalex.org/I44504214"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5085476423"],"corresponding_institution_ids":["https://openalex.org/I44504214"],"apc_list":null,"apc_paid":null,"fwci":0.1507,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.56502895,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"39","last_page":"40"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mpsoc","display_name":"MPSoC","score":0.9022033214569092},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7590068578720093},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7083887457847595},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6518651247024536},{"id":"https://openalex.org/keywords/scheduling","display_name":"Scheduling (production processes)","score":0.531161367893219},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5273455381393433},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.43820756673812866},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.43784016370773315},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.4206967353820801},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.27752193808555603},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12803533673286438}],"concepts":[{"id":"https://openalex.org/C2777187653","wikidata":"https://www.wikidata.org/wiki/Q975106","display_name":"MPSoC","level":3,"score":0.9022033214569092},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7590068578720093},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7083887457847595},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6518651247024536},{"id":"https://openalex.org/C206729178","wikidata":"https://www.wikidata.org/wiki/Q2271896","display_name":"Scheduling (production processes)","level":2,"score":0.531161367893219},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5273455381393433},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.43820756673812866},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.43784016370773315},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.4206967353820801},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.27752193808555603},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12803533673286438},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/3477244.3477619","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3477244.3477619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2021 International Conference on Embedded Software","raw_type":"proceedings-article"},{"id":"pmh:oai:dspace.cvut.cz:10467/98840","is_oa":true,"landing_page_url":"http://hdl.handle.net/10467/98840","pdf_url":null,"source":{"id":"https://openalex.org/S4306400739","display_name":"Cvut DSpace (Czech Technical University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I44504214","host_organization_name":"Czech Technical University in Prague","host_organization_lineage":["https://openalex.org/I44504214"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"sta\u0165 ve sborn\u00edku"}],"best_oa_location":{"id":"pmh:oai:dspace.cvut.cz:10467/98840","is_oa":true,"landing_page_url":"http://hdl.handle.net/10467/98840","pdf_url":null,"source":{"id":"https://openalex.org/S4306400739","display_name":"Cvut DSpace (Czech Technical University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I44504214","host_organization_name":"Czech Technical University in Prague","host_organization_lineage":["https://openalex.org/I44504214"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"sta\u0165 ve sborn\u00edku"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/15","display_name":"Life in Land","score":0.49000000953674316}],"awards":[{"id":"https://openalex.org/G8519243904","display_name":null,"funder_award_id":"832011","funder_id":"https://openalex.org/F4320320367","funder_display_name":"Cleansky"}],"funders":[{"id":"https://openalex.org/F4320320367","display_name":"Cleansky","ror":"https://ror.org/03nv0z257"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W3036768537","https://openalex.org/W3201719478"],"related_works":["https://openalex.org/W2111155249","https://openalex.org/W2172073773","https://openalex.org/W2006047055","https://openalex.org/W2502691491","https://openalex.org/W1976012348","https://openalex.org/W4244845418","https://openalex.org/W2002682434","https://openalex.org/W2137671689","https://openalex.org/W4387782849","https://openalex.org/W2113449380"],"abstract_inverted_index":{"In":[0],"many":[1],"safety-critical":[2],"applications,":[3],"Multi-Processor":[4],"Systems-on-Chip":[5],"(MPSoC)":[6],"must":[7],"operate":[8],"within":[9],"a":[10,41],"given":[11],"thermal":[12,20,60],"envelope":[13],"under":[14],"harsh":[15],"environmental":[16],"conditions.":[17],"Meeting":[18],"the":[19,45,49,65,73,79,91,99],"requirements":[21],"often":[22],"requires":[23],"using":[24],"advanced":[25],"task":[26],"allocation":[27],"and":[28,78,108],"scheduling":[29],"techniques":[30],"that":[31,43],"are":[32],"guided":[33],"by":[34,84],"detailed":[35],"power":[36],"models.":[37,53],"This":[38],"paper":[39],"introduces":[40],"method":[42,89],"has":[44],"potential":[46],"to":[47],"simplify":[48],"creation":[50],"of":[51,68,75,81,101],"such":[52],"It":[54],"constructs":[55],"so-called":[56],"heat":[57,66,82],"maps":[58,67],"from":[59,94],"camera":[61],"images.":[62],"By":[63],"comparing":[64],"different":[69],"workloads,":[70],"we":[71,97],"identify":[72,98],"locations":[74,100],"on-chip":[76],"components":[77],"amount":[80],"produced":[83],"them.":[85],"We":[86],"demonstrate":[87],"our":[88],"on":[90],"i.MX8QuadMax":[92],"chip":[93],"NXP,":[95],"where":[96],"CPU":[102,105],"clusters,":[103],"bigger":[104],"cores,":[106],"GPUs,":[107],"DRAM":[109],"controllers.":[110]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2021-10-11T00:00:00"}