{"id":"https://openalex.org/W3100353733","doi":"https://doi.org/10.1145/3411764.3445469","title":"Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending","display_name":"Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending","publication_year":2021,"publication_date":"2021-05-06","ids":{"openalex":"https://openalex.org/W3100353733","doi":"https://doi.org/10.1145/3411764.3445469","mag":"3100353733"},"language":"en","primary_location":{"id":"doi:10.1145/3411764.3445469","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3411764.3445469","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["arxiv","crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://arxiv.org/pdf/2011.06473","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Freddie Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I4210089887","display_name":"Dyson (United Kingdom)","ror":"https://ror.org/00a4npp83","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210089887"]},{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Freddie Hong","raw_affiliation_strings":["Dysong School of Design Engineering Imperial College London, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dysong School of Design Engineering Imperial College London, United Kingdom","institution_ids":["https://openalex.org/I47508984","https://openalex.org/I4210089887"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Connor Myant","orcid":null},"institutions":[{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Connor Myant","raw_affiliation_strings":["Imperial College London, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imperial College London, United Kingdom","institution_ids":["https://openalex.org/I47508984"]}]},{"author_position":"last","author":{"id":null,"display_name":"David E Boyle","orcid":null},"institutions":[{"id":"https://openalex.org/I47508984","display_name":"Imperial College London","ror":"https://ror.org/041kmwe10","country_code":"GB","type":"education","lineage":["https://openalex.org/I47508984"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"David E Boyle","raw_affiliation_strings":["Systems and Algorithms Laboratory Imperial College London, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Systems and Algorithms Laboratory Imperial College London, United Kingdom","institution_ids":["https://openalex.org/I47508984"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.4805,"has_fulltext":false,"cited_by_count":38,"citation_normalized_percentile":{"value":0.88901189,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoforming","display_name":"Thermoforming","score":0.8962000012397766},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.8580999970436096},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.7160999774932861},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6780999898910522},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.6690000295639038},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6474000215530396},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5034999847412109},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.43810001015663147},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"Printed electronics","score":0.4348999857902527}],"concepts":[{"id":"https://openalex.org/C26593445","wikidata":"https://www.wikidata.org/wiki/Q1759746","display_name":"Thermoforming","level":2,"score":0.8962000012397766},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.8580999970436096},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.7160999774932861},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6780999898910522},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.6690000295639038},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6474000215530396},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.504800021648407},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5034999847412109},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4853000044822693},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.43810001015663147},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.4348999857902527},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4309999942779541},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.3991999924182892},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.390500009059906},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3813000023365021},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.3772999942302704},{"id":"https://openalex.org/C3020000807","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrically conductive","level":2,"score":0.37369999289512634},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.3296000063419342},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32429999113082886},{"id":"https://openalex.org/C17511633","wikidata":"https://www.wikidata.org/wiki/Q830694","display_name":"SMT placement equipment","level":3,"score":0.322299987077713},{"id":"https://openalex.org/C2781247691","wikidata":"https://www.wikidata.org/wiki/Q380677","display_name":"Thermoplastic","level":2,"score":0.31690001487731934},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.3089999854564667},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2992999851703644},{"id":"https://openalex.org/C119823426","wikidata":"https://www.wikidata.org/wiki/Q184793","display_name":"Computer Aided Design","level":2,"score":0.296999990940094},{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.28369998931884766},{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.28060001134872437},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.272599995136261},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.2574999928474426},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.25369998812675476},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2533999979496002}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/3411764.3445469","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3411764.3445469","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems","raw_type":"proceedings-article"},{"id":"pmh:oai:arXiv.org:2011.06473","is_oa":true,"landing_page_url":"http://arxiv.org/abs/2011.06473","pdf_url":"https://arxiv.org/pdf/2011.06473","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},{"id":"pmh:oai:spiral.imperial.ac.uk:10044/1/88195","is_oa":false,"landing_page_url":"http://hdl.handle.net/10044/1/88195","pdf_url":null,"source":{"id":"https://openalex.org/S4306401396","display_name":"Spiral (Imperial College London)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I47508984","host_organization_name":"Imperial College London","host_organization_lineage":["https://openalex.org/I47508984"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"CHI Conference on Human Factors in Computing Systems","raw_type":"Conference Paper"}],"best_oa_location":{"id":"pmh:oai:arXiv.org:2011.06473","is_oa":true,"landing_page_url":"http://arxiv.org/abs/2011.06473","pdf_url":"https://arxiv.org/pdf/2011.06473","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":35,"referenced_works":["https://openalex.org/W1266913904","https://openalex.org/W1656143830","https://openalex.org/W2017439483","https://openalex.org/W2036931096","https://openalex.org/W2038937326","https://openalex.org/W2103339808","https://openalex.org/W2197150605","https://openalex.org/W2198727081","https://openalex.org/W2227388478","https://openalex.org/W2234224816","https://openalex.org/W2345666525","https://openalex.org/W2410055381","https://openalex.org/W2501142486","https://openalex.org/W2599924551","https://openalex.org/W2762149733","https://openalex.org/W2770600390","https://openalex.org/W2783831346","https://openalex.org/W2792703040","https://openalex.org/W2795599829","https://openalex.org/W2807991816","https://openalex.org/W2910424609","https://openalex.org/W2923403274","https://openalex.org/W2925130711","https://openalex.org/W2940900318","https://openalex.org/W2941263421","https://openalex.org/W2942288414","https://openalex.org/W2945553432","https://openalex.org/W2962947588","https://openalex.org/W2995307291","https://openalex.org/W3018317591","https://openalex.org/W3048780683","https://openalex.org/W3094083774","https://openalex.org/W4235678886","https://openalex.org/W4235812468","https://openalex.org/W4243991703"],"related_works":[],"abstract_inverted_index":{"Fabricating":[0],"3D":[1,56,126],"printed":[2,57],"electronics":[3],"using":[4],"desktop":[5],"printers":[6],"has":[7],"become":[8],"more":[9],"accessible":[10,135],"with":[11,92],"recent":[12],"developments":[13],"in":[14,25,28],"conductive":[15,66,122],"thermoplastic":[16],"filaments.":[17],"Because":[18],"of":[19,54,83,90],"their":[20],"high":[21,73],"resistance":[22],"and":[23,64,97,121,124,133],"difficulties":[24],"printing":[26],"traces":[27],"vertical":[29],"directions,":[30],"most":[31],"applications":[32,75],"are":[33],"restricted":[34],"to":[35,59,108,116,139],"capacitive":[36],"sensing.":[37],"In":[38],"this":[39],"paper,":[40],"we":[41,86],"introduce":[42],"Thermoformed":[43],"Circuit":[44],"Board":[45],"(TCB),":[46],"a":[47,88,103],"novel":[48],"approach":[49],"that":[50,70,113],"employs":[51],"the":[52,55,81,84,119],"thermoformability":[53],"plastics":[58],"construct":[60],"various":[61,93],"double-sided,":[62],"rigid":[63],"highly":[65,134],"freeform":[67],"circuit":[68],"boards":[69],"can":[71],"withstand":[72],"current":[74],"through":[76],"copper":[77],"electroplating.":[78],"To":[79],"illustrate":[80],"capability":[82],"TCB,":[85],"showcase":[87],"range":[89],"examples":[91],"shapes,":[94],"electrical":[95],"characteristics":[96],"interaction":[98],"mechanisms.":[99],"We":[100],"also":[101],"demonstrate":[102],"new":[104],"design":[105],"tool":[106],"extension":[107],"an":[109,131],"existing":[110],"CAD":[111],"environment":[112],"allows":[114],"users":[115],"parametrically":[117],"draw":[118],"substrate":[120],"trace,":[123],"export":[125],"printable":[127],"files.":[128],"TCB":[129],"is":[130],"inexpensive":[132],"fabrication":[136],"technique":[137],"intended":[138],"broaden":[140],"HCI":[141],"researcher":[142],"participation.":[143]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":11},{"year":2023,"cited_by_count":12},{"year":2022,"cited_by_count":5},{"year":2021,"cited_by_count":2}],"updated_date":"2026-07-03T08:13:44.112507","created_date":"2020-11-23T00:00:00"}