{"id":"https://openalex.org/W3117626375","doi":"https://doi.org/10.1145/3400302.3415779","title":"Re-examining VLSI manufacturing and yield through the lens of deep learning","display_name":"Re-examining VLSI manufacturing and yield through the lens of deep learning","publication_year":2020,"publication_date":"2020-11-02","ids":{"openalex":"https://openalex.org/W3117626375","doi":"https://doi.org/10.1145/3400302.3415779","mag":"3117626375"},"language":"en","primary_location":{"id":"doi:10.1145/3400302.3415779","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3400302.3415779","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 39th International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038501242","display_name":"Mohamed Baker Alawieh","orcid":"https://orcid.org/0000-0002-3546-0336"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mohamed Baker Alawieh","raw_affiliation_strings":["University of Texas at Austin"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100448683","display_name":"Wei Ye","orcid":"https://orcid.org/0000-0002-3784-7788"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Ye","raw_affiliation_strings":["University of Texas at Austin"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["University of Texas at Austin"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5038501242"],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":0.2055,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.53222545,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.9464264512062073},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6268947124481201},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6085924506187439},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.49509087204933167},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.48972538113594055},{"id":"https://openalex.org/keywords/scope","display_name":"Scope (computer science)","score":0.488197386264801},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.47503143548965454},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4684574604034424},{"id":"https://openalex.org/keywords/upgrade","display_name":"Upgrade","score":0.4586794972419739},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.4516217112541199},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4378967583179474},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4255014955997467},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.41903677582740784},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4173480272293091},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4166211783885956},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3685923218727112},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.3560470938682556},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3497105836868286},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.28103378415107727},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.20044487714767456},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15168192982673645},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.14113256335258484}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.9464264512062073},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6268947124481201},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6085924506187439},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.49509087204933167},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.48972538113594055},{"id":"https://openalex.org/C2778012447","wikidata":"https://www.wikidata.org/wiki/Q1034415","display_name":"Scope (computer science)","level":2,"score":0.488197386264801},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.47503143548965454},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4684574604034424},{"id":"https://openalex.org/C2780615140","wikidata":"https://www.wikidata.org/wiki/Q920419","display_name":"Upgrade","level":2,"score":0.4586794972419739},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.4516217112541199},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4378967583179474},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4255014955997467},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.41903677582740784},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4173480272293091},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4166211783885956},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3685923218727112},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.3560470938682556},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3497105836868286},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28103378415107727},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.20044487714767456},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15168192982673645},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.14113256335258484},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3400302.3415779","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3400302.3415779","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 39th International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5899999737739563,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":55,"referenced_works":["https://openalex.org/W589621558","https://openalex.org/W1975617480","https://openalex.org/W1986014385","https://openalex.org/W1999987713","https://openalex.org/W2020286945","https://openalex.org/W2021209310","https://openalex.org/W2025700572","https://openalex.org/W2034052243","https://openalex.org/W2035969035","https://openalex.org/W2053066651","https://openalex.org/W2074520226","https://openalex.org/W2099471712","https://openalex.org/W2105559484","https://openalex.org/W2123511121","https://openalex.org/W2137057062","https://openalex.org/W2147947791","https://openalex.org/W2150099050","https://openalex.org/W2173520492","https://openalex.org/W2173692178","https://openalex.org/W2186446752","https://openalex.org/W2296629652","https://openalex.org/W2344478748","https://openalex.org/W2499766583","https://openalex.org/W2502925949","https://openalex.org/W2523714292","https://openalex.org/W2596216784","https://openalex.org/W2604486584","https://openalex.org/W2605287558","https://openalex.org/W2737795851","https://openalex.org/W2741634092","https://openalex.org/W2741728759","https://openalex.org/W2768626898","https://openalex.org/W2774618166","https://openalex.org/W2780978202","https://openalex.org/W2782159825","https://openalex.org/W2794271438","https://openalex.org/W2809465272","https://openalex.org/W2899885603","https://openalex.org/W2909619825","https://openalex.org/W2913204915","https://openalex.org/W2923018418","https://openalex.org/W2939908742","https://openalex.org/W2945462300","https://openalex.org/W2945764596","https://openalex.org/W2946543926","https://openalex.org/W2951394837","https://openalex.org/W2963073614","https://openalex.org/W2963470893","https://openalex.org/W2963767194","https://openalex.org/W2996886069","https://openalex.org/W2997579412","https://openalex.org/W3011227197","https://openalex.org/W3027658987","https://openalex.org/W3036696276","https://openalex.org/W3133413229"],"related_works":["https://openalex.org/W2388589331","https://openalex.org/W1569991298","https://openalex.org/W2545489593","https://openalex.org/W4246351405","https://openalex.org/W1970762549","https://openalex.org/W2549099758","https://openalex.org/W4234083032","https://openalex.org/W2366713167","https://openalex.org/W3021581891","https://openalex.org/W1963695760"],"abstract_inverted_index":{"The":[0],"continued":[1],"scaling":[2],"of":[3,43,62,193,199],"integrated":[4],"circuit":[5],"technologies,":[6],"along":[7],"with":[8,18],"the":[9,15,38,44,50,58,71,82,106,145,167,190,197],"increased":[10,49],"design":[11,33,72],"complexity,":[12],"has":[13],"exacerbated":[14],"challenges":[16],"associated":[17],"manufacturability":[19,122,201],"and":[20,41,53,60,123,130,202],"yield.":[21,203],"In":[22,99],"today's":[23],"semiconductor":[24],"manufacturing,":[25],"lithography":[26,51,128],"plays":[27],"a":[28,92,116,180],"fundamental":[29],"role":[30,59,146],"in":[31,70,85,150,158,196],"printing":[32],"patterns":[34],"on":[35,105],"silicon.":[36],"However,":[37],"growing":[39],"complexity":[40],"variation":[42],"manufacturing":[45],"process":[46,73],"have":[47,75,90,114,138],"tremendously":[48],"modeling":[52,129],"simulation":[54,131],"cost.":[55],"Besides,":[56],"both":[57],"cost":[61],"resolution":[63],"enhancement":[64],"techniques":[65],"(RETs)":[66],"-":[67,74],"now":[68],"indispensable":[69],"increased.":[76],"Parallel":[77],"to":[78,119,164],"these":[79],"developments":[80],"are":[81],"recent":[83,107],"advancements":[84],"Machine":[86],"Learning":[87,109],"(ML)":[88],"which":[89,137,175],"provided":[91,115],"far-reaching":[93],"data-driven":[94],"perspective":[95],"for":[96],"problem":[97],"solving.":[98],"this":[100],"work,":[101],"we":[102,143],"shed":[103],"light":[104],"Deep":[108],"(DL)":[110],"based":[111],"approaches":[112,195],"that":[113],"new":[117],"lens":[118],"examine":[120],"traditional":[121],"yield":[124,165],"challenges.":[125],"We":[126],"present":[127],"techniques,":[132],"leveraging":[133],"advanced":[134],"learning":[135,184],"paradigms,":[136],"demonstrated":[139],"unprecedented":[140],"efficiency.":[141],"Moreover,":[142],"demonstrate":[144],"DL":[147],"can":[148],"play":[149],"advancing":[151],"RETs":[152],"by":[153],"presenting":[154],"its":[155],"successful":[156],"application":[157],"assist":[159],"feature":[160],"generation.":[161],"Also":[162],"critical":[163],"is":[166],"post":[168],"fabrication":[169],"wafer":[170],"map":[171],"defect":[172],"analysis":[173],"step":[174],"our":[176],"work":[177],"tackles":[178],"using":[179],"novel":[181],"confidence-aware":[182],"deep":[183],"scheme.":[185],"This":[186],"paper":[187],"further":[188],"discusses":[189],"future":[191],"prospects":[192],"DL-based":[194],"scope":[198],"circuits":[200]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}