{"id":"https://openalex.org/W3112831165","doi":"https://doi.org/10.1145/3400302.3415763","title":"Fast IR Drop Estimation with Machine Learning : Invited Paper","display_name":"Fast IR Drop Estimation with Machine Learning : Invited Paper","publication_year":2020,"publication_date":"2020-11-02","ids":{"openalex":"https://openalex.org/W3112831165","doi":"https://doi.org/10.1145/3400302.3415763","mag":"3112831165"},"language":"en","primary_location":{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-117888","is_oa":false,"landing_page_url":"http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1092-3152&rft.volume=&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Xie&rft.aufirst=&rft.atitle=Fast+IR+Drop+Estimation+with+Machine+Learning+%3A+Invited+Paper&rft.title=IEEE%2FACM+International+Conference+on+Computer-Aided+Design%2C+Digest+of+Technical+Papers%2C+ICCAD","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"},"type":"conference-paper","indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5075696558","display_name":"Zhiyao Xie","orcid":"https://orcid.org/0000-0002-4442-592X"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhiyao Xie","raw_affiliation_strings":["[Duke Univeristy, Durham, NC, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"[Duke Univeristy, Durham, NC, USA]","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100429374","display_name":"Hai Li","orcid":"https://orcid.org/0000-0001-6577-2050"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hai Li","raw_affiliation_strings":["[Duke Univeristy, Durham, NC, USA]"],"raw_orcid":"https://orcid.org/0000-0001-6577-2050","affiliations":[{"raw_affiliation_string":"[Duke Univeristy, Durham, NC, USA]","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078415010","display_name":"Xiaoqing Xu","orcid":"https://orcid.org/0000-0002-5314-7669"},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaoqing Xu","raw_affiliation_strings":["ARM Inc.,Austin,TX,USA"],"raw_orcid":"https://orcid.org/0000-0002-5314-7669","affiliations":[{"raw_affiliation_string":"ARM Inc.,Austin,TX,USA","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103246390","display_name":"Jiang Hu","orcid":"https://orcid.org/0000-0003-1157-7799"},"institutions":[{"id":"https://openalex.org/I91045830","display_name":"Texas A&M University","ror":"https://ror.org/01f5ytq51","country_code":"US","type":"education","lineage":["https://openalex.org/I91045830"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiang Hu","raw_affiliation_strings":["[Texas A&M University, College station, TX, USA]"],"raw_orcid":"https://orcid.org/0000-0003-1157-7799","affiliations":[{"raw_affiliation_string":"[Texas A&M University, College station, TX, USA]","institution_ids":["https://openalex.org/I91045830"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058073627","display_name":"Yiran Chen","orcid":"https://orcid.org/0000-0002-1486-8412"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiran Chen","raw_affiliation_strings":["[Duke Univeristy, Durham, NC, USA]"],"raw_orcid":"https://orcid.org/0000-0002-1486-8412","affiliations":[{"raw_affiliation_string":"[Duke Univeristy, Durham, NC, USA]","institution_ids":["https://openalex.org/I170897317"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power-network-design","display_name":"Power network design","score":0.7125399112701416},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.6327908635139465},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6321943402290344},{"id":"https://openalex.org/keywords/drop","display_name":"Drop (telecommunication)","score":0.5874481201171875},{"id":"https://openalex.org/keywords/turnaround-time","display_name":"Turnaround time","score":0.5851076245307922},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5099238157272339},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.49799180030822754},{"id":"https://openalex.org/keywords/design-methods","display_name":"Design methods","score":0.41304725408554077},{"id":"https://openalex.org/keywords/drop-out","display_name":"Drop out","score":0.4101629853248596},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.37831351161003113},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.32711726427078247},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.3265601694583893},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.24187883734703064},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.2362392544746399},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22169670462608337},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.08986485004425049}],"concepts":[{"id":"https://openalex.org/C164565468","wikidata":"https://www.wikidata.org/wiki/Q7236535","display_name":"Power network design","level":3,"score":0.7125399112701416},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.6327908635139465},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6321943402290344},{"id":"https://openalex.org/C2781345722","wikidata":"https://www.wikidata.org/wiki/Q5308388","display_name":"Drop (telecommunication)","level":2,"score":0.5874481201171875},{"id":"https://openalex.org/C176553487","wikidata":"https://www.wikidata.org/wiki/Q7855819","display_name":"Turnaround time","level":2,"score":0.5851076245307922},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5099238157272339},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.49799180030822754},{"id":"https://openalex.org/C138852830","wikidata":"https://www.wikidata.org/wiki/Q2292993","display_name":"Design methods","level":2,"score":0.41304725408554077},{"id":"https://openalex.org/C2984949393","wikidata":"https://www.wikidata.org/wiki/Q1260241","display_name":"Drop out","level":2,"score":0.4101629853248596},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.37831351161003113},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.32711726427078247},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.3265601694583893},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.24187883734703064},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.2362392544746399},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22169670462608337},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08986485004425049},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C4249254","wikidata":"https://www.wikidata.org/wiki/Q3044431","display_name":"Demographic economics","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-117888","is_oa":false,"landing_page_url":"http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1092-3152&rft.volume=&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Xie&rft.aufirst=&rft.atitle=Fast+IR+Drop+Estimation+with+Machine+Learning+%3A+Invited+Paper&rft.title=IEEE%2FACM+International+Conference+on+Computer-Aided+Design%2C+Digest+of+Technical+Papers%2C+ICCAD","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"},{"id":"mag:3112831165","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":40,"referenced_works":["https://openalex.org/W1673310716","https://openalex.org/W1678356000","https://openalex.org/W1968939168","https://openalex.org/W2030651811","https://openalex.org/W2080600740","https://openalex.org/W2099647435","https://openalex.org/W2110295511","https://openalex.org/W2115314588","https://openalex.org/W2124089733","https://openalex.org/W2140475081","https://openalex.org/W2161338410","https://openalex.org/W2165190641","https://openalex.org/W2168747796","https://openalex.org/W2293147384","https://openalex.org/W2520279918","https://openalex.org/W2538780316","https://openalex.org/W2570771846","https://openalex.org/W2750396644","https://openalex.org/W2787374052","https://openalex.org/W2807453315","https://openalex.org/W2899885603","https://openalex.org/W2900015380","https://openalex.org/W2939908742","https://openalex.org/W2945759188","https://openalex.org/W2945802982","https://openalex.org/W2946795101","https://openalex.org/W2966284335","https://openalex.org/W2979854933","https://openalex.org/W2996794321","https://openalex.org/W2997579412","https://openalex.org/W2998169401","https://openalex.org/W3008774611","https://openalex.org/W3012124806","https://openalex.org/W3013474731","https://openalex.org/W3018195242","https://openalex.org/W3036319002","https://openalex.org/W3092585568","https://openalex.org/W3102476541","https://openalex.org/W3109998468","https://openalex.org/W3113078536"],"related_works":["https://openalex.org/W3108565323","https://openalex.org/W49478203","https://openalex.org/W8481587","https://openalex.org/W85295759","https://openalex.org/W2188148922","https://openalex.org/W2765768680","https://openalex.org/W2914946590","https://openalex.org/W2318523399","https://openalex.org/W2531544664","https://openalex.org/W2477810159","https://openalex.org/W3106410607","https://openalex.org/W2914991307","https://openalex.org/W12562045","https://openalex.org/W2138702823","https://openalex.org/W2342657089","https://openalex.org/W633814207","https://openalex.org/W3129953904","https://openalex.org/W2776869714","https://openalex.org/W2188727833","https://openalex.org/W2227675248"],"abstract_inverted_index":{"IR":[0,35,56,98],"drop":[1,36,57,99],"constraint":[2],"is":[3],"a":[4,17,90,106],"fundamental":[5],"requirement":[6],"enforced":[7],"in":[8,65,96,117],"almost":[9],"all":[10],"chip":[11],"designs.":[12],"However,":[13],"its":[14],"evaluation":[15],"takes":[16],"long":[18],"time,":[19],"and":[20,33,63,78,85,122],"mitigation":[21],"techniques":[22,49,131],"for":[23,40,54,108,132],"fixing":[24],"violations":[25],"may":[26],"require":[27],"numerous":[28],"iterations.":[29],"As":[30],"such,":[31],"fast":[32,55],"accurate":[34],"prediction":[37],"becomes":[38],"critical":[39],"reducing":[41],"design":[42,73,119],"turnaround":[43],"time.":[44],"Recently,":[45],"machine":[46],"learning":[47],"(ML)":[48],"have":[50],"been":[51],"actively":[52],"studied":[53],"estimation":[58,100],"due":[59],"to":[60,92,125],"their":[61],"promise":[62],"success":[64],"many":[66],"fields.":[67],"These":[68],"studies":[69],"target":[70],"at":[71],"various":[72],"stages":[74],"with":[75,129],"different":[76,80],"emphasis,":[77],"accordingly,":[79],"ML":[81,115,127],"algorithms":[82],"are":[83],"adopted":[84],"customized.":[86],"This":[87],"paper":[88],"provides":[89],"review":[91],"the":[93,133],"latest":[94],"progress":[95],"ML-based":[97],"techniques.":[101],"It":[102],"also":[103],"serves":[104],"as":[105],"vehicle":[107],"discussing":[109],"some":[110],"general":[111],"challenges":[112],"faced":[113],"by":[114],"applications":[116],"electronics":[118],"automation":[120],"(EDA),":[121],"demonstrating":[123],"how":[124],"integrate":[126],"models":[128],"conventional":[130],"better":[134],"efficiency":[135],"of":[136],"EDA":[137],"tools.":[138]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}