{"id":"https://openalex.org/W3083144577","doi":"https://doi.org/10.1145/3386263.3407580","title":"Modeling and Benchmarking Computing-in-Memory for Design Space Exploration","display_name":"Modeling and Benchmarking Computing-in-Memory for Design Space Exploration","publication_year":2020,"publication_date":"2020-09-04","ids":{"openalex":"https://openalex.org/W3083144577","doi":"https://doi.org/10.1145/3386263.3407580","mag":"3083144577"},"language":"en","primary_location":{"id":"doi:10.1145/3386263.3407580","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3386263.3407580","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2020 on Great Lakes Symposium on VLSI","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064528017","display_name":"Dayane Reis","orcid":"https://orcid.org/0000-0002-8571-1308"},"institutions":[{"id":"https://openalex.org/I107639228","display_name":"University of Notre Dame","ror":"https://ror.org/00mkhxb43","country_code":"US","type":"education","lineage":["https://openalex.org/I107639228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dayane Reis","raw_affiliation_strings":["University of Notre Dame, Notre Dame, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Notre Dame, Notre Dame, IN, USA","institution_ids":["https://openalex.org/I107639228"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081391925","display_name":"Di Gao","orcid":"https://orcid.org/0000-0001-7619-1964"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Di Gao","raw_affiliation_strings":["Zhejiang University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhejiang University, Hangzhou, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051680668","display_name":"Shaahin Angizi","orcid":"https://orcid.org/0000-0003-2289-6381"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shaahin Angizi","raw_affiliation_strings":["Arizona State University, Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071383109","display_name":"Xunzhao Yin","orcid":"https://orcid.org/0000-0003-4656-9545"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xunzhao Yin","raw_affiliation_strings":["Zhejiang University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhejiang University, Hangzhou, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047916979","display_name":"Deliang Fan","orcid":"https://orcid.org/0000-0002-7989-6297"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deliang Fan","raw_affiliation_strings":["Arizona State University, Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003032564","display_name":"Michael Niemier","orcid":"https://orcid.org/0000-0001-7776-4306"},"institutions":[{"id":"https://openalex.org/I107639228","display_name":"University of Notre Dame","ror":"https://ror.org/00mkhxb43","country_code":"US","type":"education","lineage":["https://openalex.org/I107639228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Niemier","raw_affiliation_strings":["University of Notre Dame, Notre Dame, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Notre Dame, Notre Dame, IN, USA","institution_ids":["https://openalex.org/I107639228"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054211420","display_name":"Cheng Zhuo","orcid":"https://orcid.org/0000-0002-2610-7522"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cheng Zhuo","raw_affiliation_strings":["Zhejiang University, Hangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhejiang University, Hangzhou, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100600905","display_name":"Xiaobo Sharon Hu","orcid":"https://orcid.org/0000-0002-6636-9738"},"institutions":[{"id":"https://openalex.org/I107639228","display_name":"University of Notre Dame","ror":"https://ror.org/00mkhxb43","country_code":"US","type":"education","lineage":["https://openalex.org/I107639228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"X. Sharon Hu","raw_affiliation_strings":["University of Notre Dame, Notre Dame, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Notre Dame, Notre Dame, IN, USA","institution_ids":["https://openalex.org/I107639228"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":22,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"39","last_page":"44"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6719233393669128},{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.5897257924079895},{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.5853942036628723},{"id":"https://openalex.org/keywords/benchmarking","display_name":"Benchmarking","score":0.543321430683136},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5169745683670044},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.4909070134162903},{"id":"https://openalex.org/keywords/design-space-exploration","display_name":"Design space exploration","score":0.48724499344825745},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4487161934375763},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.41433778405189514},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3107769191265106},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.2511500418186188},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22418680787086487}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6719233393669128},{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.5897257924079895},{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.5853942036628723},{"id":"https://openalex.org/C86251818","wikidata":"https://www.wikidata.org/wiki/Q816754","display_name":"Benchmarking","level":2,"score":0.543321430683136},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5169745683670044},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.4909070134162903},{"id":"https://openalex.org/C2776221188","wikidata":"https://www.wikidata.org/wiki/Q21072556","display_name":"Design space exploration","level":2,"score":0.48724499344825745},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4487161934375763},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.41433778405189514},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3107769191265106},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.2511500418186188},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22418680787086487},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3386263.3407580","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3386263.3407580","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2020 on Great Lakes Symposium on VLSI","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8899999856948853}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":38,"referenced_works":["https://openalex.org/W1529285927","https://openalex.org/W1983096721","https://openalex.org/W2010202670","https://openalex.org/W2073535522","https://openalex.org/W2075960179","https://openalex.org/W2093524602","https://openalex.org/W2096445739","https://openalex.org/W2109574129","https://openalex.org/W2112980698","https://openalex.org/W2122757690","https://openalex.org/W2141546789","https://openalex.org/W2146276996","https://openalex.org/W2147657366","https://openalex.org/W2150909864","https://openalex.org/W2331783522","https://openalex.org/W2342750693","https://openalex.org/W2407339173","https://openalex.org/W2584580867","https://openalex.org/W2588666075","https://openalex.org/W2593172471","https://openalex.org/W2613569094","https://openalex.org/W2623635728","https://openalex.org/W2742841780","https://openalex.org/W2766489088","https://openalex.org/W2801000640","https://openalex.org/W2889210320","https://openalex.org/W2945829174","https://openalex.org/W2945854677","https://openalex.org/W2946017187","https://openalex.org/W2946591837","https://openalex.org/W2963446207","https://openalex.org/W2974067241","https://openalex.org/W3000277453","https://openalex.org/W3035964421","https://openalex.org/W3036942028","https://openalex.org/W3125984961","https://openalex.org/W3169681048","https://openalex.org/W4292169167"],"related_works":["https://openalex.org/W4238897586","https://openalex.org/W435179959","https://openalex.org/W2619091065","https://openalex.org/W2059640416","https://openalex.org/W1490753184","https://openalex.org/W2284465472","https://openalex.org/W2291782699","https://openalex.org/W1993948687","https://openalex.org/W2000169967","https://openalex.org/W2112883198"],"abstract_inverted_index":{"The":[0],"bottleneck":[1],"between":[2,110],"the":[3,13,49,54,69,75,134,154,175,185,227],"limited":[4],"memory":[5],"bandwidth":[6],"and":[7,42,133,169,181],"high":[8,20],"speed":[9],"processing":[10,239],"demands":[11],"is":[12,93],"main":[14],"cause":[15],"of":[16,22,40,71,125,137,157,208,213,230],"problems":[17],"associated":[18],"with":[19,142,163],"volume":[21],"data":[23,50],"transfers":[24],"in":[25,243],"data-intensive":[26],"applications.":[27],"As":[28,148],"a":[29,38,80,84,89,107,119,140,143,149,191,200,211,236],"possible":[30,104],"remedy":[31],"to":[32,45,62,95,105,139,218,235],"these":[33],"issues,":[34],"computing-in-memory":[35],"(CiM)":[36],"enables":[37],"subset":[39],"logic":[41],"arithmetic":[43],"operations":[44],"be":[46,83],"performed":[47],"where":[48,238],"resides,":[51],"i.e.,":[52],"inside":[53],"memory.":[55,244],"Various":[56],"CiM":[57,90,126,138,160,198,203],"designs":[58,161],"have":[59],"been":[60],"proposed":[61],"date,":[63],"based":[64,145],"on":[65,146],"different":[66],"technologies.":[67],"Given":[68],"variety":[70],"options":[72],"available,":[73],"picking":[74],"right":[76],"design":[77,112,177],"option":[78],"for":[79,121],"system/application":[81],"can":[82],"complex":[85],"task.":[86],"When":[87],"choosing":[88],"design,":[91],"it":[92],"important":[94],"establish":[96],"evaluation":[97,194],"conditions":[98],"that":[99,174,196],"are":[100],"as":[101,103],"uniform":[102,123],"make":[106],"fair":[108],"choice":[109],"available":[111],"options.":[113],"In":[114],"this":[115],"paper,":[116],"we":[117,152,172,188],"describe":[118],"methodology":[120],"an":[122,206],"benchmarking":[124],"designs.":[127],"Our":[128],"approach":[129],"evaluates":[130],"devices/circuits,":[131],"arrays":[132],"overall":[135],"impact":[136],"system":[141,192],"framework":[144],"Eva-CiM.":[147],"case":[150],"study,":[151],"analyze":[153],"array-level":[155],"performance":[156],"7":[158],"recent":[159],"implemented":[162],"SRAM,":[164],"DRAM,":[165],"FeFET-RAM,":[166],"STT-MRAM,":[167],"SOT-MRAM,":[168],"RRAM.":[170],"After":[171],"identify":[173],"FeFET-RAM-based":[176,197],"shows":[178],"promising":[179],"energy":[180,219],"delay":[182],"savings":[183],"at":[184],"array":[186],"level,":[187],"carry":[189],"out":[190],"level":[193],"showing":[195],"outperforms":[199],"CMOS":[201],"SRAM":[202],"baseline":[204],"by":[205],"average":[207],"60%":[209],"across":[210],"set":[212],"17":[214],"benchmarks":[215],"(with":[216],"respect":[217],"savings).":[220],"Regarding":[221],"speedups,":[222],"both":[223],"technologies":[224],"offer":[225],"virtually":[226],"same":[228],"benefit":[229],"about":[231],"1.5X":[232],"when":[233],"compared":[234],"situation":[237],"does":[240],"not":[241],"happen":[242]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}