{"id":"https://openalex.org/W2991573186","doi":"https://doi.org/10.1145/3355056.3364559","title":"Multi-directional 3D Printing with Strength Retention","display_name":"Multi-directional 3D Printing with Strength Retention","publication_year":2019,"publication_date":"2019-11-17","ids":{"openalex":"https://openalex.org/W2991573186","doi":"https://doi.org/10.1145/3355056.3364559","mag":"2991573186"},"language":"en","primary_location":{"id":"doi:10.1145/3355056.3364559","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3355056.3364559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SIGGRAPH Asia 2019 Posters","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089487891","display_name":"Yupeng Guan","orcid":"https://orcid.org/0000-0003-3438-8982"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yupeng Guan","raw_affiliation_strings":["Beijing University of Technology"],"affiliations":[{"raw_affiliation_string":"Beijing University of Technology","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040078873","display_name":"Yisong Gao","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yisong Gao","raw_affiliation_strings":["Beijing University of Technology"],"affiliations":[{"raw_affiliation_string":"Beijing University of Technology","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005945981","display_name":"Lifang Wu","orcid":"https://orcid.org/0000-0002-7209-0215"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lifang Wu","raw_affiliation_strings":["Beijing University of Technology"],"affiliations":[{"raw_affiliation_string":"Beijing University of Technology","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018779744","display_name":"Kejian Cui","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kejian Cui","raw_affiliation_strings":["Institute of Chemistry, Chinese Academy of Science"],"affiliations":[{"raw_affiliation_string":"Institute of Chemistry, Chinese Academy of Science","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016717473","display_name":"Jianwei Guo","orcid":"https://orcid.org/0000-0002-3376-1725"},"institutions":[{"id":"https://openalex.org/I4210090176","display_name":"Institute of Computing Technology","ror":"https://ror.org/0090r4d87","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210090176"]},{"id":"https://openalex.org/I4210094879","display_name":"Shandong Institute of Automation","ror":"https://ror.org/00qdtba35","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210094879","https://openalex.org/I4210142748"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianwei Guo","raw_affiliation_strings":["Institute of Automation, Institute Of Computing Technology Chinese Academy Of Sciences"],"affiliations":[{"raw_affiliation_string":"Institute of Automation, Institute Of Computing Technology Chinese Academy Of Sciences","institution_ids":["https://openalex.org/I4210090176","https://openalex.org/I4210094879"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101826744","display_name":"Zechao Liu","orcid":"https://orcid.org/0000-0002-1406-8415"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zechao Liu","raw_affiliation_strings":["Beijing University of Technology"],"affiliations":[{"raw_affiliation_string":"Beijing University of Technology","institution_ids":["https://openalex.org/I37796252"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5089487891"],"corresponding_institution_ids":["https://openalex.org/I37796252"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.17625084,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11190","display_name":"3D Printing in Biomedical Research","score":0.9901000261306763,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bonding-strength","display_name":"Bonding strength","score":0.6742574572563171},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.66900634765625},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6390341520309448},{"id":"https://openalex.org/keywords/ultimate-tensile-strength","display_name":"Ultimate tensile strength","score":0.6376577019691467},{"id":"https://openalex.org/keywords/mechanical-strength","display_name":"Mechanical strength","score":0.5267661809921265},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5123153924942017},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39504051208496094},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3907443881034851},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12025779485702515}],"concepts":[{"id":"https://openalex.org/C2984173401","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bonding strength","level":2,"score":0.6742574572563171},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.66900634765625},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6390341520309448},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.6376577019691467},{"id":"https://openalex.org/C2988076202","wikidata":"https://www.wikidata.org/wiki/Q240553","display_name":"Mechanical strength","level":2,"score":0.5267661809921265},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5123153924942017},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39504051208496094},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3907443881034851},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12025779485702515}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3355056.3364559","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3355056.3364559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SIGGRAPH Asia 2019 Posters","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W423764468","https://openalex.org/W2522069949","https://openalex.org/W2770505755","https://openalex.org/W2797898089","https://openalex.org/W2810733959","https://openalex.org/W2902432663"],"related_works":["https://openalex.org/W4280652955","https://openalex.org/W2954638906","https://openalex.org/W2988789574","https://openalex.org/W2476964901","https://openalex.org/W2388308431","https://openalex.org/W2601594414","https://openalex.org/W3023724765","https://openalex.org/W2123786585","https://openalex.org/W2182632956","https://openalex.org/W102689010"],"abstract_inverted_index":{"In":[0],"this":[1],"poster,":[2],"we":[3],"proposed":[4],"a":[5],"refined":[6],"scheme":[7],"and":[8,45],"system":[9,35,95],"to":[10,99],"realize":[11,100],"the":[12,17,20,26,29,33,38,41,47,52,56,60,73,86,89],"multi-directional":[13,101],"3D":[14,23,102],"printing":[15,34,94,103],"with":[16,104],"strength":[18,63,76,87,105],"as":[19],"traditional":[21],"unidirectional":[22],"printing.":[24],"With":[25],"introduction":[27],"of":[28,40,55,88],"10.6m":[30],"CO2":[31],"laser,":[32],"can":[36,77],"heat":[37],"interfaces":[39],"already":[42],"printed":[43],"components":[44,65],"increase":[46],"intermolecular-penetrating":[48],"diffusion":[49],"while":[50],"fabricating":[51],"base":[53],"layers":[54],"next":[57],"components.":[58],"Therefore,":[59],"interfacial":[61,74],"bonding":[62,75],"between":[64],"is":[66],"augmented.":[67],"The":[68,92],"tensile":[69],"tests":[70],"demonstrate":[71],"that":[72],"be":[78],"increased":[79],"by":[80],"more":[81],"than":[82],"27%,":[83],"which":[84],"reaches":[85],"integrated":[90],"ones.":[91],"improved":[93],"makes":[96],"it":[97],"possible":[98],"retention.":[106]},"counts_by_year":[{"year":2023,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}