{"id":"https://openalex.org/W2982791879","doi":"https://doi.org/10.1145/3348488.3348493","title":"Research on Geometric Modeling Virtual Assembly Technology Based on Component-level Assembly Feature","display_name":"Research on Geometric Modeling Virtual Assembly Technology Based on Component-level Assembly Feature","publication_year":2019,"publication_date":"2019-07-27","ids":{"openalex":"https://openalex.org/W2982791879","doi":"https://doi.org/10.1145/3348488.3348493","mag":"2982791879"},"language":"en","primary_location":{"id":"doi:10.1145/3348488.3348493","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3348488.3348493","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2019 3rd International Conference on Artificial Intelligence and Virtual Reality","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037062534","display_name":"Shuxing Du","orcid":null},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Du Shuxing","raw_affiliation_strings":["Colledge of Mechano-electronic Engineering, XiDian University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Colledge of Mechano-electronic Engineering, XiDian University, Xi'an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100708667","display_name":"Yanfeng Liu","orcid":"https://orcid.org/0000-0002-0218-6027"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liu Yanfeng","raw_affiliation_strings":["Colledge of Mechano-electronic Engineering, XiDian University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Colledge of Mechano-electronic Engineering, XiDian University, Xi'an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5024471641","display_name":"Wenyan Chen","orcid":"https://orcid.org/0000-0001-8949-0816"},"institutions":[{"id":"https://openalex.org/I110440473","display_name":"Xi'an University of Science and Technology","ror":"https://ror.org/046fkpt18","country_code":"CN","type":"education","lineage":["https://openalex.org/I110440473"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chen Wenyan","raw_affiliation_strings":["Colledge of Electrical and Control Engineering, Xi'an University of Science and Technology, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Colledge of Electrical and Control Engineering, Xi'an University of Science and Technology, Xi'an, China","institution_ids":["https://openalex.org/I110440473"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5037062534"],"corresponding_institution_ids":["https://openalex.org/I149594827"],"apc_list":null,"apc_paid":null,"fwci":0.2175,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.6307438,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"17","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10719","display_name":"3D Shape Modeling and Analysis","score":0.9664000272750854,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11245","display_name":"Advanced Numerical Analysis Techniques","score":0.9628000259399414,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.679934024810791},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.679153561592102},{"id":"https://openalex.org/keywords/assembly-modelling","display_name":"Assembly modelling","score":0.6487156748771667},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.5860143899917603},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5786895155906677},{"id":"https://openalex.org/keywords/feature-recognition","display_name":"Feature recognition","score":0.5008201599121094},{"id":"https://openalex.org/keywords/adjacency-list","display_name":"Adjacency list","score":0.46230024099349976},{"id":"https://openalex.org/keywords/interoperability","display_name":"Interoperability","score":0.45764631032943726},{"id":"https://openalex.org/keywords/geometric-modeling","display_name":"Geometric modeling","score":0.4386936128139496},{"id":"https://openalex.org/keywords/semantics","display_name":"Semantics (computer science)","score":0.4263976216316223},{"id":"https://openalex.org/keywords/component-based-software-engineering","display_name":"Component-based software engineering","score":0.42102310061454773},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.41299504041671753},{"id":"https://openalex.org/keywords/software-system","display_name":"Software system","score":0.34018075466156006},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23121711611747742},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.21561047434806824},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.16889673471450806},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.167425274848938},{"id":"https://openalex.org/keywords/feature-extraction","display_name":"Feature extraction","score":0.1547684371471405}],"concepts":[{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.679934024810791},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.679153561592102},{"id":"https://openalex.org/C16377676","wikidata":"https://www.wikidata.org/wiki/Q4808685","display_name":"Assembly modelling","level":3,"score":0.6487156748771667},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.5860143899917603},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5786895155906677},{"id":"https://openalex.org/C180863505","wikidata":"https://www.wikidata.org/wiki/Q5439687","display_name":"Feature recognition","level":3,"score":0.5008201599121094},{"id":"https://openalex.org/C110484373","wikidata":"https://www.wikidata.org/wiki/Q264398","display_name":"Adjacency list","level":2,"score":0.46230024099349976},{"id":"https://openalex.org/C20136886","wikidata":"https://www.wikidata.org/wiki/Q749647","display_name":"Interoperability","level":2,"score":0.45764631032943726},{"id":"https://openalex.org/C104065381","wikidata":"https://www.wikidata.org/wiki/Q1002535","display_name":"Geometric modeling","level":2,"score":0.4386936128139496},{"id":"https://openalex.org/C184337299","wikidata":"https://www.wikidata.org/wiki/Q1437428","display_name":"Semantics (computer science)","level":2,"score":0.4263976216316223},{"id":"https://openalex.org/C174683762","wikidata":"https://www.wikidata.org/wiki/Q609588","display_name":"Component-based software engineering","level":4,"score":0.42102310061454773},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.41299504041671753},{"id":"https://openalex.org/C149091818","wikidata":"https://www.wikidata.org/wiki/Q2429814","display_name":"Software system","level":3,"score":0.34018075466156006},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23121711611747742},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.21561047434806824},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.16889673471450806},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.167425274848938},{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.1547684371471405},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3348488.3348493","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3348488.3348493","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2019 3rd International Conference on Artificial Intelligence and Virtual Reality","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.47999998927116394,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1490090961","https://openalex.org/W2004909996","https://openalex.org/W2237906215"],"related_works":["https://openalex.org/W1495517617","https://openalex.org/W2351078211","https://openalex.org/W2145712798","https://openalex.org/W2057153527","https://openalex.org/W2359838915","https://openalex.org/W2376432544","https://openalex.org/W3130148269","https://openalex.org/W2372632800","https://openalex.org/W1990496685","https://openalex.org/W2366731626"],"abstract_inverted_index":{"Virtual":[0],"assembly":[1,17,39,46,58,63,81,91,95,114,118,159,174,184],"technology":[2],"is":[3,18,49,66,129,141,177],"an":[4],"important":[5],"part":[6],"of":[7,37,57,75,84,147,160,172],"geometric":[8,23,101],"modeling.":[9],"Aiming":[10],"at":[11],"the":[12,15,26,35,52,55,61,70,76,80,85,99,126,132,144,148,152,156,161,169,186],"problem":[13],"that":[14,108,168],"virtual":[16,38,158,183],"complicated":[19],"and":[20,72,79,93,179],"inefficient":[21],"in":[22,151,185],"modeling":[24,28,188],"under":[25],"current":[27],"software":[29,135,189],"platform,":[30],"a":[31,43],"method":[32],"to":[33,112,122,154],"improve":[34],"level":[36],"automation":[40],"by":[41,68,89],"constructing":[42,94],"component":[44],"-level":[45],"feature":[47,64,74,82,175],"library":[48,176],"proposed.":[50],"First":[51],"paper":[53,153],"gives":[54],"concept":[56],"feature.":[59],"Then":[60],"component-level":[62,173],"database":[65],"constructed":[67],"using":[69],"convexity":[71],"concavity":[73],"model":[77],"edge":[78],"recognition":[83],"adjacency":[86],"graph.":[87],"Finally,":[88],"defining":[90],"semantics":[92,96],"decomposition":[97],"module,":[98],"underlying":[100],"constraints":[102],"are":[103],"separated":[104],"from":[105],"users,":[106],"so":[107],"users":[109],"only":[110],"need":[111],"realize":[113,155],"drive":[115],"through":[116],"easy-to-understand":[117],"semantics.":[119],"In":[120],"order":[121],"facilitate":[123],"user":[124],"operation,":[125],"voice":[127,149,163],"system":[128],"introduced":[130],"into":[131],"general":[133],"commercial":[134],"Pro/Engineer.":[136],"Speech":[137],"SDK(Software":[138],"Development":[139],"Kit)":[140],"used":[142],"as":[143],"development":[145],"tool":[146],"module":[150],"rapid":[157],"integrated":[162],"system.":[164],"The":[165],"results":[166],"show":[167],"proposed":[170],"establishment":[171],"effective":[178],"feasible":[180],"for":[181],"realizing":[182],"original":[187],"environment.":[190]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}