{"id":"https://openalex.org/W2946090344","doi":"https://doi.org/10.1145/3316781.3317874","title":"On-Chip Memory Technology Design Space Explorations for Mobile Deep Neural Network Accelerators","display_name":"On-Chip Memory Technology Design Space Explorations for Mobile Deep Neural Network Accelerators","publication_year":2019,"publication_date":"2019-05-23","ids":{"openalex":"https://openalex.org/W2946090344","doi":"https://doi.org/10.1145/3316781.3317874","mag":"2946090344"},"language":"en","primary_location":{"id":"doi:10.1145/3316781.3317874","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3316781.3317874","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 56th Annual Design Automation Conference 2019","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009672380","display_name":"Haitong Li","orcid":"https://orcid.org/0000-0003-3393-9252"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Haitong Li","raw_affiliation_strings":["Stanford University"],"affiliations":[{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089769405","display_name":"Mudit Bhargava","orcid":"https://orcid.org/0000-0003-4503-2260"},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mudit Bhargava","raw_affiliation_strings":["Arm Research"],"affiliations":[{"raw_affiliation_string":"Arm Research","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103266146","display_name":"Paul N. Whatmough","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul N. Whatmough","raw_affiliation_strings":["Arm Research"],"affiliations":[{"raw_affiliation_string":"Arm Research","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059975258","display_name":"H.\u2010S. Philip Wong","orcid":"https://orcid.org/0000-0002-0096-1472"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H.-S. Philip Wong","raw_affiliation_strings":["Stanford University"],"affiliations":[{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5009672380"],"corresponding_institution_ids":["https://openalex.org/I97018004"],"apc_list":null,"apc_paid":null,"fwci":3.8465,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.94842265,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10036","display_name":"Advanced Neural Network Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10036","display_name":"Advanced Neural Network Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.7851980924606323},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7727059125900269},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7280526757240295},{"id":"https://openalex.org/keywords/universal-memory","display_name":"Universal memory","score":0.7133660912513733},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6391828656196594},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43294844031333923},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.4327274262905121},{"id":"https://openalex.org/keywords/efficient-energy-use","display_name":"Efficient energy use","score":0.4199938476085663},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.40616896748542786},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.32978978753089905},{"id":"https://openalex.org/keywords/memory-management","display_name":"Memory management","score":0.26711946725845337},{"id":"https://openalex.org/keywords/semiconductor-memory","display_name":"Semiconductor memory","score":0.24372929334640503},{"id":"https://openalex.org/keywords/interleaved-memory","display_name":"Interleaved memory","score":0.22502705454826355},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15331107378005981},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1023162305355072}],"concepts":[{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.7851980924606323},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7727059125900269},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7280526757240295},{"id":"https://openalex.org/C195053848","wikidata":"https://www.wikidata.org/wiki/Q7894141","display_name":"Universal memory","level":5,"score":0.7133660912513733},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6391828656196594},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43294844031333923},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4327274262905121},{"id":"https://openalex.org/C2742236","wikidata":"https://www.wikidata.org/wiki/Q924713","display_name":"Efficient energy use","level":2,"score":0.4199938476085663},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.40616896748542786},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.32978978753089905},{"id":"https://openalex.org/C176649486","wikidata":"https://www.wikidata.org/wiki/Q2308807","display_name":"Memory management","level":3,"score":0.26711946725845337},{"id":"https://openalex.org/C98986596","wikidata":"https://www.wikidata.org/wiki/Q1143031","display_name":"Semiconductor memory","level":2,"score":0.24372929334640503},{"id":"https://openalex.org/C63511323","wikidata":"https://www.wikidata.org/wiki/Q908936","display_name":"Interleaved memory","level":4,"score":0.22502705454826355},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15331107378005981},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1023162305355072},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3316781.3317874","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3316781.3317874","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 56th Annual Design Automation Conference 2019","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8799999952316284,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320315684","display_name":"Stanford SystemX Alliance","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W2030671441","https://openalex.org/W2089064077","https://openalex.org/W2094756095","https://openalex.org/W2094786483","https://openalex.org/W2152839228","https://openalex.org/W2285660444","https://openalex.org/W2292764711","https://openalex.org/W2294282016","https://openalex.org/W2442974303","https://openalex.org/W2508602506","https://openalex.org/W2518281301","https://openalex.org/W2583581802","https://openalex.org/W2605347906","https://openalex.org/W2606722458","https://openalex.org/W2791748601","https://openalex.org/W2793776854","https://openalex.org/W2800944932","https://openalex.org/W2808976322","https://openalex.org/W2900327659","https://openalex.org/W2906043559","https://openalex.org/W2922246768","https://openalex.org/W2950656546","https://openalex.org/W4243519499","https://openalex.org/W4254672563","https://openalex.org/W6756118020"],"related_works":["https://openalex.org/W2516517078","https://openalex.org/W1974599144","https://openalex.org/W2150909864","https://openalex.org/W3146763006","https://openalex.org/W4382618825","https://openalex.org/W2161286015","https://openalex.org/W4384572207","https://openalex.org/W4386903460","https://openalex.org/W2900372418","https://openalex.org/W1898301658"],"abstract_inverted_index":{"Deep":[0],"neural":[1],"network":[2],"(DNN)":[3],"inference":[4],"tasks":[5],"have":[6],"become":[7],"ubiquitous":[8],"workloads":[9],"on":[10,83,112],"mobile":[11],"SoCs":[12],"and":[13,92,105,109,118],"demand":[14],"energy-efficient":[15],"hardware":[16],"accelerators.":[17,80],"Mobile":[18],"DNN":[19],"accelerators":[20,126],"are":[21],"heavily":[22],"area-constrained,":[23],"with":[24],"only":[25],"minimal":[26],"on-chip":[27,85],"SRAM,":[28,89],"which":[29],"results":[30,111],"in":[31],"heavy":[32],"use":[33],"of":[34,75],"inefficient":[35],"off-chip":[36,63],"DRAM.":[37],"With":[38],"diminishing":[39],"returns":[40],"from":[41],"conventional":[42],"silicon":[43],"technology":[44],"scaling,":[45],"emerging":[46],"memory":[47,86],"technologies":[48],"that":[49],"offer":[50],"better":[51],"area":[52,134,146],"density":[53],"than":[54],"SRAM":[55],"can":[56],"boost":[57],"accelerator":[58],"efficiency":[59],"by":[60],"minimizing":[61],"costly":[62],"DRAM":[64],"accesses.":[65],"This":[66],"paper":[67],"presents":[68],"a":[69,137],"detailed":[70],"design":[71,140],"space":[72],"exploration":[73],"(DSE)":[74],"technology-system":[76],"co-design":[77],"for":[78],"systolic-array":[79],"We":[81],"focus":[82],"practical/mature":[84],"technologies,":[87],"including":[88,115],"eDRAM,":[90],"MRAM,":[91],"3D":[93,138],"vertical":[94],"RRAM":[95],"(VRRAM).":[96],"The":[97],"DSE":[98],"employs":[99],"state-of-the-art":[100],"optimizations":[101],"(e.g.,":[102],"model":[103],"compression":[104],"optimized":[106],"buffer":[107],"scheduling),":[108],"evaluates":[110],"important":[113],"models":[114],"ResNet-50,":[116],"MobileNet,":[117],"Faster-RCNN.":[119],"Compared":[120],"to":[121,129],"an":[122],"SRAM/DRAM":[123],"baseline,":[124],"MRAM-based":[125],"show":[127],"up":[128],"4.68\u00d7":[130],"energy":[131,143],"benefits":[132,144],"(57%":[133],"overhead),":[135],"while":[136],"VRRAM-based":[139],"achieves":[141],"2.22\u00d7":[142],"(33%":[145],"reduction).":[147]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":9},{"year":2021,"cited_by_count":13},{"year":2020,"cited_by_count":13},{"year":2019,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}