{"id":"https://openalex.org/W2939529913","doi":"https://doi.org/10.1145/3299902.3313156","title":"Electromigration-Aware Interconnect Design","display_name":"Electromigration-Aware Interconnect Design","publication_year":2019,"publication_date":"2019-04-04","ids":{"openalex":"https://openalex.org/W2939529913","doi":"https://doi.org/10.1145/3299902.3313156","mag":"2939529913"},"language":"en","primary_location":{"id":"doi:10.1145/3299902.3313156","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3299902.3313156","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3299902.3313156","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2019 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://dl.acm.org/doi/pdf/10.1145/3299902.3313156","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068714995","display_name":"Sachin S. Sapatnekar","orcid":"https://orcid.org/0000-0002-5353-2364"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Sachin S. Sapatnekar","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN, USA","institution_ids":["https://openalex.org/I130238516"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5068714995"],"corresponding_institution_ids":["https://openalex.org/I130238516"],"apc_list":null,"apc_paid":null,"fwci":0.4466,"has_fulltext":true,"cited_by_count":9,"citation_normalized_percentile":{"value":0.55007326,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"83","last_page":"90"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9617329835891724},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7194902896881104},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5679442882537842},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.49247273802757263},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47638529539108276},{"id":"https://openalex.org/keywords/power-grid","display_name":"Power grid","score":0.472086638212204},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4656537175178528},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.46292543411254883},{"id":"https://openalex.org/keywords/root-cause","display_name":"Root cause","score":0.46048104763031006},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42798519134521484},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3644653558731079},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.33597952127456665},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.2942577600479126},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2795013189315796},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.16897809505462646}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9617329835891724},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7194902896881104},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5679442882537842},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.49247273802757263},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47638529539108276},{"id":"https://openalex.org/C2983254600","wikidata":"https://www.wikidata.org/wiki/Q1096907","display_name":"Power grid","level":3,"score":0.472086638212204},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4656537175178528},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.46292543411254883},{"id":"https://openalex.org/C84945661","wikidata":"https://www.wikidata.org/wiki/Q7366567","display_name":"Root cause","level":2,"score":0.46048104763031006},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42798519134521484},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3644653558731079},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.33597952127456665},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.2942577600479126},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2795013189315796},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16897809505462646},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3299902.3313156","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3299902.3313156","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3299902.3313156","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2019 International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1145/3299902.3313156","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3299902.3313156","pdf_url":"https://dl.acm.org/doi/pdf/10.1145/3299902.3313156","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2019 International Symposium on Physical Design","raw_type":"proceedings-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2518423528","display_name":"SHF: Small: Stress Management in Integrated Circuits","funder_award_id":"1421606","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G2691740555","display_name":null,"funder_award_id":"CCF-1421606","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G3978893783","display_name":"SHF: Small: Enchancing the Reliability of Mixed-Signal Integrated Circuits","funder_award_id":"1714805","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G4612683467","display_name":null,"funder_award_id":"CCF-1421606, CCF-1714805","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2939529913.pdf","grobid_xml":"https://content.openalex.org/works/W2939529913.grobid-xml"},"referenced_works_count":37,"referenced_works":["https://openalex.org/W1970826249","https://openalex.org/W1972282962","https://openalex.org/W1988631834","https://openalex.org/W1990215011","https://openalex.org/W2010076578","https://openalex.org/W2011500971","https://openalex.org/W2014295176","https://openalex.org/W2029040443","https://openalex.org/W2033241763","https://openalex.org/W2038026471","https://openalex.org/W2038987112","https://openalex.org/W2047400812","https://openalex.org/W2064477270","https://openalex.org/W2071520186","https://openalex.org/W2077241659","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2091384027","https://openalex.org/W2112903419","https://openalex.org/W2121496311","https://openalex.org/W2123446492","https://openalex.org/W2128455324","https://openalex.org/W2129123174","https://openalex.org/W2131239505","https://openalex.org/W2155640459","https://openalex.org/W2155880552","https://openalex.org/W2158811675","https://openalex.org/W2163896657","https://openalex.org/W2246740483","https://openalex.org/W2344790342","https://openalex.org/W2394569310","https://openalex.org/W2472642372","https://openalex.org/W2587645287","https://openalex.org/W2626746672","https://openalex.org/W2791362638","https://openalex.org/W2792652433","https://openalex.org/W2941407424"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2136403807","https://openalex.org/W796810817"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"is":[2],"seen":[3],"as":[4],"a":[5,16,70],"growing":[6],"problem":[7],"in":[8,72],"recent":[9],"and":[10,14,31,93,99],"upcoming":[11],"technology":[12],"nodes,":[13],"affects":[15],"wider":[17],"variety":[18],"of":[19,40,65,86,103],"wires":[20],"(e.g.,":[21,27,33],"power":[22],"grid,":[23],"clock/signal":[24],"nets),":[25],"circuits":[26],"digital,":[28],"analog,":[29],"mixed-signal),":[30],"systems":[32],"mobile,":[34],"server,":[35],"automotive),":[36],"touching":[37],"lower":[38],"levels":[39],"metal":[41],"than":[42],"before.":[43],"Moreover,":[44],"unlike":[45],"traditional":[46],"EM":[47,56],"checks":[48,57],"that":[49],"were":[50],"performed":[51],"on":[52,90],"each":[53],"wire":[54,66],"individually,":[55],"must":[58],"evolve":[59],"to":[60],"consider":[61],"the":[62,83,101],"system-level":[63],"impact":[64,89],"failure.":[67],"This":[68,80],"requires":[69],"change":[71],"how":[73],"interconnect":[74],"design":[75],"incor-":[76],"porates":[77],"this":[78],"effect.":[79],"paper":[81],"overviews":[82],"root":[84],"causes":[85],"EM,":[87],"its":[88],"high-performance":[91],"designs,":[92],"techniques":[94],"for":[95],"analyzing,":[96],"working":[97],"around,":[98],"alleviating":[100],"effects":[102],"EM.":[104]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2026-06-22T08:00:12.763002","created_date":"2025-10-10T00:00:00"}