{"id":"https://openalex.org/W2909831073","doi":"https://doi.org/10.1145/3287624.3288747","title":"Detecting multi-layer layout hotspots with adaptive squish patterns","display_name":"Detecting multi-layer layout hotspots with adaptive squish patterns","publication_year":2019,"publication_date":"2019-01-18","ids":{"openalex":"https://openalex.org/W2909831073","doi":"https://doi.org/10.1145/3287624.3288747","mag":"2909831073"},"language":"en","primary_location":{"id":"doi:10.1145/3287624.3288747","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3287624.3288747","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 24th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100642435","display_name":"Haoyu Yang","orcid":"https://orcid.org/0000-0002-4709-0061"},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Haoyu Yang","raw_affiliation_strings":["CUHK"],"affiliations":[{"raw_affiliation_string":"CUHK","institution_ids":["https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055806164","display_name":"Piyush Pathak","orcid":"https://orcid.org/0000-0001-6747-1016"},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Piyush Pathak","raw_affiliation_strings":["Cadence Design Systems Inc"],"affiliations":[{"raw_affiliation_string":"Cadence Design Systems Inc","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084794463","display_name":"Frank Gennari","orcid":"https://orcid.org/0000-0001-7608-4624"},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Frank Gennari","raw_affiliation_strings":["Cadence Design Systems Inc"],"affiliations":[{"raw_affiliation_string":"Cadence Design Systems Inc","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108101838","display_name":"Ya-Chieh Lai","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ya-Chieh Lai","raw_affiliation_strings":["Cadence Design Systems Inc"],"affiliations":[{"raw_affiliation_string":"Cadence Design Systems Inc","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051340429","display_name":"Bei Yu","orcid":"https://orcid.org/0000-0001-6406-4810"},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Bei Yu","raw_affiliation_strings":["CUHK"],"affiliations":[{"raw_affiliation_string":"CUHK","institution_ids":["https://openalex.org/I889458895"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100642435"],"corresponding_institution_ids":["https://openalex.org/I889458895"],"apc_list":null,"apc_paid":null,"fwci":5.0561,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.96008349,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"299","last_page":"304"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6919016242027283},{"id":"https://openalex.org/keywords/hotspot","display_name":"Hotspot (geology)","score":0.667233407497406},{"id":"https://openalex.org/keywords/lossless-compression","display_name":"Lossless compression","score":0.4996306896209717},{"id":"https://openalex.org/keywords/convolutional-neural-network","display_name":"Convolutional neural network","score":0.4981956481933594},{"id":"https://openalex.org/keywords/feature-extraction","display_name":"Feature extraction","score":0.4833080768585205},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.4713791310787201},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.44417813420295715},{"id":"https://openalex.org/keywords/integrated-circuit-layout","display_name":"Integrated circuit layout","score":0.4341079592704773},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.42731574177742004},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.35902369022369385},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.2742822766304016},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.2560202479362488}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6919016242027283},{"id":"https://openalex.org/C146481406","wikidata":"https://www.wikidata.org/wiki/Q105131","display_name":"Hotspot (geology)","level":2,"score":0.667233407497406},{"id":"https://openalex.org/C81081738","wikidata":"https://www.wikidata.org/wiki/Q55542","display_name":"Lossless compression","level":3,"score":0.4996306896209717},{"id":"https://openalex.org/C81363708","wikidata":"https://www.wikidata.org/wiki/Q17084460","display_name":"Convolutional neural network","level":2,"score":0.4981956481933594},{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.4833080768585205},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.4713791310787201},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.44417813420295715},{"id":"https://openalex.org/C2765594","wikidata":"https://www.wikidata.org/wiki/Q2624187","display_name":"Integrated circuit layout","level":3,"score":0.4341079592704773},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.42731574177742004},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.35902369022369385},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.2742822766304016},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2560202479362488},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3287624.3288747","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3287624.3288747","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 24th Asia and South Pacific Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.550000011920929}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1533861849","https://openalex.org/W1686810756","https://openalex.org/W1999879018","https://openalex.org/W2008176598","https://openalex.org/W2008709856","https://openalex.org/W2037552354","https://openalex.org/W2038835846","https://openalex.org/W2057596653","https://openalex.org/W2083951140","https://openalex.org/W2092970276","https://openalex.org/W2101703365","https://openalex.org/W2163605009","https://openalex.org/W2194775991","https://openalex.org/W2294849903","https://openalex.org/W2402144811","https://openalex.org/W2538780316","https://openalex.org/W2553320496","https://openalex.org/W2596216784","https://openalex.org/W2625105415","https://openalex.org/W2625434482","https://openalex.org/W2625784888","https://openalex.org/W2750396644","https://openalex.org/W2776520902","https://openalex.org/W2792824541","https://openalex.org/W2809465272","https://openalex.org/W2962835968","https://openalex.org/W3150329878","https://openalex.org/W6687483927","https://openalex.org/W6713134421"],"related_works":["https://openalex.org/W3106969033","https://openalex.org/W2379637199","https://openalex.org/W2186939576","https://openalex.org/W2357988910","https://openalex.org/W2948148442","https://openalex.org/W2377158164","https://openalex.org/W2792375908","https://openalex.org/W3097018712","https://openalex.org/W2997143235","https://openalex.org/W3204804334"],"abstract_inverted_index":{"Layout":[0],"hotpot":[1],"detection":[2,44,135],"is":[3,93],"one":[4],"of":[5,32,41],"the":[6,127],"critical":[7],"steps":[8],"in":[9,22,65],"modern":[10],"integrated":[11],"circuit":[12],"design":[13],"flow.":[14],"It":[15],"aims":[16],"to":[17],"find":[18],"potential":[19],"weak":[20],"points":[21],"layouts":[23],"before":[24],"feeding":[25],"them":[26],"into":[27],"manufacturing":[28],"stage.":[29],"Rapid":[30],"development":[31],"machine":[33],"learning":[34,54],"has":[35],"made":[36],"it":[37],"a":[38,111,139],"preferable":[39],"alternative":[40],"traditional":[42],"hotspot":[43,67,134],"solutions.":[45],"Recent":[46],"researches":[47],"range":[48],"from":[49],"layout":[50,61],"feature":[51],"extraction":[52],"and":[53,69,97,114],"model":[55],"design.":[56],"However,":[57],"only":[58],"single":[59],"layer":[60,113],"hotspots":[62],"are":[63,76],"considered":[64],"state-of-the-art":[66],"detectors":[68],"certain":[70],"defects":[71],"such":[72],"as":[73],"metal-to-via":[74,122],"failures":[75],"not":[77],"naturally":[78],"supported.":[79],"In":[80],"this":[81],"paper,":[82],"we":[83],"propose":[84],"an":[85],"adaptive":[86,128],"squish":[87,129],"representation":[88,130],"for":[89],"multilayer":[90],"layouts,":[91],"which":[92],"storage":[94],"efficient,":[95],"lossless":[96],"compatible":[98],"with":[99,110],"deep":[100],"neural":[101,142],"networks.":[102,143],"We":[103],"conduct":[104],"experiments":[105],"on":[106],"14nm":[107],"industrial":[108],"designs":[109],"metal":[112],"its":[115],"two":[116],"adjacent":[117],"via":[118],"layers":[119],"that":[120,126],"contain":[121],"hotspots.":[123],"Results":[124],"show":[125],"can":[131],"achieve":[132],"satisfactory":[133],"accuracy":[136],"by":[137],"incorporating":[138],"medium-sized":[140],"convolutional":[141]},"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":7},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":7}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}