{"id":"https://openalex.org/W2792162844","doi":"https://doi.org/10.1145/3177540.3178455","title":"Challenges and Opportunities in Automotive, Industrial, and IoT Physical Design","display_name":"Challenges and Opportunities in Automotive, Industrial, and IoT Physical Design","publication_year":2018,"publication_date":"2018-03-16","ids":{"openalex":"https://openalex.org/W2792162844","doi":"https://doi.org/10.1145/3177540.3178455","mag":"2792162844"},"language":"en","primary_location":{"id":"doi:10.1145/3177540.3178455","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3177540.3178455","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2018 International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022647946","display_name":"Anthony Hill","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Anthony M. Hill","raw_affiliation_strings":["Texas Instruments, Inc., Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5022647946"],"corresponding_institution_ids":["https://openalex.org/I74760111"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9871000051498413,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9778000116348267,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.8689199090003967},{"id":"https://openalex.org/keywords/internet-of-things","display_name":"Internet of Things","score":0.5965052247047424},{"id":"https://openalex.org/keywords/physical-space","display_name":"Physical space","score":0.569507360458374},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5305044651031494},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.47606202960014343},{"id":"https://openalex.org/keywords/space","display_name":"Space (punctuation)","score":0.4260403513908386},{"id":"https://openalex.org/keywords/industrial-design","display_name":"Industrial design","score":0.41304540634155273},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.39176926016807556},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3537399172782898},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.25866907835006714},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.13829249143600464},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.075829416513443}],"concepts":[{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.8689199090003967},{"id":"https://openalex.org/C81860439","wikidata":"https://www.wikidata.org/wiki/Q251212","display_name":"Internet of Things","level":2,"score":0.5965052247047424},{"id":"https://openalex.org/C2982717780","wikidata":"https://www.wikidata.org/wiki/Q107","display_name":"Physical space","level":2,"score":0.569507360458374},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5305044651031494},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.47606202960014343},{"id":"https://openalex.org/C2778572836","wikidata":"https://www.wikidata.org/wiki/Q380933","display_name":"Space (punctuation)","level":2,"score":0.4260403513908386},{"id":"https://openalex.org/C134535237","wikidata":"https://www.wikidata.org/wiki/Q243606","display_name":"Industrial design","level":2,"score":0.41304540634155273},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.39176926016807556},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3537399172782898},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.25866907835006714},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.13829249143600464},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.075829416513443},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C58640448","wikidata":"https://www.wikidata.org/wiki/Q42515","display_name":"Cartography","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3177540.3178455","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3177540.3178455","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2018 International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4382644535","https://openalex.org/W4245926026","https://openalex.org/W4401670978","https://openalex.org/W122916748","https://openalex.org/W2013364747","https://openalex.org/W2350720519","https://openalex.org/W2995193815","https://openalex.org/W4206754221","https://openalex.org/W2366576578","https://openalex.org/W4221127805"],"abstract_inverted_index":{"Taping":[0],"out":[1],"modern,":[2],"complex":[3],"SOCs":[4],"presents":[5],"a":[6,33,84],"myriad":[7,85],"of":[8,86],"challenges":[9,57],"in":[10,74,80],"physical":[11,38],"design.":[12],"Doing":[13],"so":[14],"for":[15,58,72],"demanding":[16],"markets":[17],"such":[18],"as":[19],"automotive,":[20],"industrial,":[21],"and":[22,41,48,55,78,93],"IoT":[23],"multiplies":[24],"that":[25],"complexity.":[26],"In":[27],"this":[28],"talk":[29],"we":[30],"will":[31,62],"take":[32],"broad":[34],"look":[35,63],"across":[36,83],"the":[37,50,68],"design":[39],"space":[40],"discuss":[42],"what":[43,45],"works,":[44],"doesn't":[46],"work,":[47],"where":[49],"major":[51],"gaps":[52],"are":[53],"today":[54],"evolving":[56],"future":[59],"devices.":[60],"We":[61],"at":[64],"experiences":[65],"gained":[66],"over":[67],"last":[69],"20":[70],"years":[71],"devices":[73,79],"high":[75],"volume":[76],"production":[77],"active":[81],"development":[82],"technologies":[87],"including":[88],"bulk":[89],"CMOS,":[90],"low-power":[91],"nodes,":[92],"FinFET.":[94]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}