{"id":"https://openalex.org/W2766997844","doi":"https://doi.org/10.1145/3131785.3131836","title":"Designing 3D-Printed Deformation Behaviors Using Spring-Based Structures","display_name":"Designing 3D-Printed Deformation Behaviors Using Spring-Based Structures","publication_year":2017,"publication_date":"2017-10-20","ids":{"openalex":"https://openalex.org/W2766997844","doi":"https://doi.org/10.1145/3131785.3131836","mag":"2766997844"},"language":"en","primary_location":{"id":"doi:10.1145/3131785.3131836","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3131785.3131836","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Adjunct Publication of the 30th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100317921","display_name":"Liang He","orcid":"https://orcid.org/0000-0003-4826-629X"},"institutions":[{"id":"https://openalex.org/I201448701","display_name":"University of Washington","ror":"https://ror.org/00cvxb145","country_code":"US","type":"education","lineage":["https://openalex.org/I201448701"]},{"id":"https://openalex.org/I24796534","display_name":"Washington College","ror":"https://ror.org/02vk0qj37","country_code":"US","type":"education","lineage":["https://openalex.org/I24796534"]},{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liang He","raw_affiliation_strings":["University of Maryland, College Park & University of Washington, College Park, MD, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Maryland, College Park & University of Washington, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132","https://openalex.org/I24796534","https://openalex.org/I201448701"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067580146","display_name":"Huaishu Peng","orcid":"https://orcid.org/0000-0002-2749-4835"},"institutions":[{"id":"https://openalex.org/I205783295","display_name":"Cornell University","ror":"https://ror.org/05bnh6r87","country_code":"US","type":"education","lineage":["https://openalex.org/I205783295"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Huaishu Peng","raw_affiliation_strings":["Cornell University, Ithaca, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cornell University, Ithaca, NY, USA","institution_ids":["https://openalex.org/I205783295"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024406637","display_name":"Joshua Land","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joshua Land","raw_affiliation_strings":["University of Maryland, College Park, College Park, MD, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Maryland, College Park, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036788329","display_name":"Mark Fuge","orcid":"https://orcid.org/0000-0003-3819-8895"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark D. Fuge","raw_affiliation_strings":["University of Maryland, College Park, College Park, MD, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Maryland, College Park, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016828530","display_name":"Jon E. Froehlich","orcid":"https://orcid.org/0000-0001-8291-3353"},"institutions":[{"id":"https://openalex.org/I201448701","display_name":"University of Washington","ror":"https://ror.org/00cvxb145","country_code":"US","type":"education","lineage":["https://openalex.org/I201448701"]},{"id":"https://openalex.org/I24796534","display_name":"Washington College","ror":"https://ror.org/02vk0qj37","country_code":"US","type":"education","lineage":["https://openalex.org/I24796534"]},{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jon E. Froehlich","raw_affiliation_strings":["University of Maryland, College Park & University of Washington, College Park, MD, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Maryland, College Park & University of Washington, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132","https://openalex.org/I24796534","https://openalex.org/I201448701"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.247,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.57074127,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"151","last_page":"153"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10719","display_name":"3D Shape Modeling and Analysis","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10719","display_name":"3D Shape Modeling and Analysis","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.7718013525009155},{"id":"https://openalex.org/keywords/spring","display_name":"Spring (device)","score":0.7109500169754028},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6831918358802795},{"id":"https://openalex.org/keywords/metamaterial","display_name":"Metamaterial","score":0.6678694486618042},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.6482077836990356},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6151102185249329},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.4509087800979614},{"id":"https://openalex.org/keywords/range","display_name":"Range (aeronautics)","score":0.44139739871025085},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.35735398530960083},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2623947262763977},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19200852513313293},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08419761061668396},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.06997233629226685}],"concepts":[{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.7718013525009155},{"id":"https://openalex.org/C2778712887","wikidata":"https://www.wikidata.org/wiki/Q102836","display_name":"Spring (device)","level":2,"score":0.7109500169754028},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6831918358802795},{"id":"https://openalex.org/C110367647","wikidata":"https://www.wikidata.org/wiki/Q497166","display_name":"Metamaterial","level":2,"score":0.6678694486618042},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.6482077836990356},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6151102185249329},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.4509087800979614},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.44139739871025085},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35735398530960083},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2623947262763977},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19200852513313293},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08419761061668396},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.06997233629226685},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3131785.3131836","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3131785.3131836","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Adjunct Publication of the 30th Annual ACM Symposium on User Interface Software and Technology","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/11","score":0.5299999713897705,"display_name":"Sustainable cities and communities"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2215913752","https://openalex.org/W2408357557","https://openalex.org/W2471082839","https://openalex.org/W2534558385","https://openalex.org/W2602506628","https://openalex.org/W2611121405","https://openalex.org/W2912460004"],"related_works":["https://openalex.org/W4319224835","https://openalex.org/W1955801659","https://openalex.org/W3036311796","https://openalex.org/W4367665844","https://openalex.org/W4285543619","https://openalex.org/W4319589397","https://openalex.org/W2582005554","https://openalex.org/W3131618301","https://openalex.org/W3158363272","https://openalex.org/W3089387070"],"abstract_inverted_index":{"Recent":[0],"work":[1],"in":[2],"3D":[3],"printing":[4],"has":[5],"focused":[6],"on":[7],"tools":[8],"and":[9,21,31,60,64,76],"techniques":[10],"to":[11,29,35,50],"design":[12,44],"deformation":[13],"behaviors":[14],"using":[15],"mechanical":[16,33],"structures":[17,49],"such":[18],"as":[19],"joints":[20],"metamaterials.":[22],"In":[23],"this":[24],"poster,":[25],"we":[26],"explore":[27],"how":[28],"embed":[30],"control":[32],"springs":[34],"create":[36],"deformable":[37],"3D-printed":[38],"objects.":[39],"We":[40],"propose":[41],"an":[42],"initial":[43],"space":[45],"of":[46,55],"3D-printable":[47],"spring-based":[48],"support":[51],"a":[52,72],"wide":[53],"range":[54],"expressive":[56],"behaviors,":[57],"including":[58],"stretch":[59],"compress,":[61],"bend,":[62],"twist,":[63],"all":[65],"possible":[66],"combinations.":[67],"The":[68],"poster":[69],"concludes":[70],"with":[71],"brief":[73],"feasibility":[74],"test":[75],"enumerates":[77],"future":[78],"work.":[79]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}