{"id":"https://openalex.org/W2756095187","doi":"https://doi.org/10.1145/3130218.3130235","title":"Hybrid Automotive In-Vehicle Networks","display_name":"Hybrid Automotive In-Vehicle Networks","publication_year":2017,"publication_date":"2017-09-20","ids":{"openalex":"https://openalex.org/W2756095187","doi":"https://doi.org/10.1145/3130218.3130235","mag":"2756095187"},"language":"en","primary_location":{"id":"doi:10.1145/3130218.3130235","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3130218.3130235","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://mediatum.ub.tum.de/node?id=1431639","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102800785","display_name":"Debayan Roy","orcid":"https://orcid.org/0000-0002-2069-210X"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Debayan Roy","raw_affiliation_strings":["Technical University of Munich"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024233365","display_name":"Michael Balszun","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael Balszun","raw_affiliation_strings":["Technical University of Munich"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049989469","display_name":"Dip Goswami","orcid":"https://orcid.org/0000-0002-2268-0014"},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Dip Goswami","raw_affiliation_strings":["Eindhoven University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Eindhoven University of Technology","institution_ids":["https://openalex.org/I83019370"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100737286","display_name":"Samarjit Chakraborty","orcid":"https://orcid.org/0000-0002-0503-6235"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Samarjit Chakraborty","raw_affiliation_strings":["Technical University of Munich"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich","institution_ids":["https://openalex.org/I62916508"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.6936,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.69990788,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10933","display_name":"Real-Time Systems Scheduling","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10933","display_name":"Real-Time Systems Scheduling","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12216","display_name":"Network Time Synchronization Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flexray","display_name":"FlexRay","score":0.959288477897644},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.7741626501083374},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7129544615745544},{"id":"https://openalex.org/keywords/exploit","display_name":"Exploit","score":0.674013614654541},{"id":"https://openalex.org/keywords/ethernet","display_name":"Ethernet","score":0.6483006477355957},{"id":"https://openalex.org/keywords/communications-protocol","display_name":"Communications protocol","score":0.541854202747345},{"id":"https://openalex.org/keywords/automotive-electronics","display_name":"Automotive electronics","score":0.5115860104560852},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5092653036117554},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5085881948471069},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4741765260696411},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.45565342903137207},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.4346265196800232},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.41380053758621216},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20845714211463928},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.160055011510849},{"id":"https://openalex.org/keywords/computer-security","display_name":"Computer security","score":0.10629191994667053}],"concepts":[{"id":"https://openalex.org/C2777648190","wikidata":"https://www.wikidata.org/wiki/Q571846","display_name":"FlexRay","level":3,"score":0.959288477897644},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.7741626501083374},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7129544615745544},{"id":"https://openalex.org/C165696696","wikidata":"https://www.wikidata.org/wiki/Q11287","display_name":"Exploit","level":2,"score":0.674013614654541},{"id":"https://openalex.org/C172173386","wikidata":"https://www.wikidata.org/wiki/Q79984","display_name":"Ethernet","level":2,"score":0.6483006477355957},{"id":"https://openalex.org/C12269588","wikidata":"https://www.wikidata.org/wiki/Q132364","display_name":"Communications protocol","level":2,"score":0.541854202747345},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.5115860104560852},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5092653036117554},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5085881948471069},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4741765260696411},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.45565342903137207},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.4346265196800232},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.41380053758621216},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20845714211463928},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.160055011510849},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.10629191994667053},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":7,"locations":[{"id":"doi:10.1145/3130218.3130235","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3130218.3130235","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"proceedings-article"},{"id":"pmh:899591","is_oa":false,"landing_page_url":"http://library.tue.nl/csp/dare/LinkToRepository.csp?recordnumber=899591","pdf_url":null,"source":{"id":"https://openalex.org/S4406923046","display_name":"TU/e Research Portal (Eindhoven University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""},{"id":"pmh:oai:library.tue.nl:899591","is_oa":false,"landing_page_url":"http://repository.tue.nl/899591","pdf_url":null,"source":{"id":"https://openalex.org/S4406923046","display_name":"TU/e Research Portal (Eindhoven University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""},{"id":"pmh:oai:mediatum.ub.tum.de:node/1431639","is_oa":true,"landing_page_url":"http://mediatum.ub.tum.de/node?id=1431639","pdf_url":null,"source":{"id":"https://openalex.org/S4377196330","display_name":"mediaTUM  (Technical University of Munich)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I62916508","host_organization_name":"Technical University of Munich","host_organization_lineage":["https://openalex.org/I62916508"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"article"},{"id":"pmh:oai:pure.tue.nl:openaire_cris_publications/78a9a360-47a0-4c0e-98eb-6dc0d405ce9e","is_oa":false,"landing_page_url":"https://research.tue.nl/en/publications/78a9a360-47a0-4c0e-98eb-6dc0d405ce9e","pdf_url":null,"source":{"id":"https://openalex.org/S4406922641","display_name":"TU/e Research Portal","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Roy, D, Balszun, M, Goswami, D & Chakraborty, S 2017, Hybrid automotive in-vehicle networks. in NOCS '17 Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip ., 12, Association for Computing Machinery, Inc., New York, 11th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2017, Seoul, Korea, Republic of, 19/10/17. https://doi.org/10.1145/3130218.3130235","raw_type":"info:eu-repo/semantics/publishedVersion"},{"id":"pmh:oai:pure.tue.nl:publications/78a9a360-47a0-4c0e-98eb-6dc0d405ce9e","is_oa":false,"landing_page_url":"http://www.scopus.com/inward/record.url?scp=85035761489&partnerID=8YFLogxK","pdf_url":null,"source":{"id":"https://openalex.org/S4406922641","display_name":"TU/e Research Portal","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Roy, D, Balszun, M, Goswami, D & Chakraborty, S 2017, Hybrid automotive in-vehicle networks. in NOCS '17 Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip ., 12, Association for Computing Machinery, Inc., New York, 11th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2017, Seoul, Korea, Republic of, 19/10/17. https://doi.org/10.1145/3130218.3130235","raw_type":"info:eu-repo/semantics/publishedVersion"},{"id":"pmh:tue:oai:pure.tue.nl:publications/78a9a360-47a0-4c0e-98eb-6dc0d405ce9e","is_oa":false,"landing_page_url":"https://research.tue.nl/nl/publications/78a9a360-47a0-4c0e-98eb-6dc0d405ce9e","pdf_url":null,"source":{"id":"https://openalex.org/S4306401843","display_name":"Data Archiving and Networked Services (DANS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1322597698","host_organization_name":"Royal Netherlands Academy of Arts and Sciences","host_organization_lineage":["https://openalex.org/I1322597698"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"NOCS '17 Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip","raw_type":"info:eu-repo/semantics/conferencepaper"}],"best_oa_location":{"id":"pmh:oai:mediatum.ub.tum.de:node/1431639","is_oa":true,"landing_page_url":"http://mediatum.ub.tum.de/node?id=1431639","pdf_url":null,"source":{"id":"https://openalex.org/S4377196330","display_name":"mediaTUM  (Technical University of Munich)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I62916508","host_organization_name":"Technical University of Munich","host_organization_lineage":["https://openalex.org/I62916508"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1518361374","https://openalex.org/W2021697132","https://openalex.org/W2037777662","https://openalex.org/W2037847878","https://openalex.org/W2079525699","https://openalex.org/W2083645139","https://openalex.org/W2119167559","https://openalex.org/W2152195021","https://openalex.org/W2165033619","https://openalex.org/W2402541670","https://openalex.org/W4231613826"],"related_works":["https://openalex.org/W2132658806","https://openalex.org/W2758348730","https://openalex.org/W2126959175","https://openalex.org/W2042971094","https://openalex.org/W204868353","https://openalex.org/W4251679081","https://openalex.org/W2074447753","https://openalex.org/W2141354351","https://openalex.org/W2132757435","https://openalex.org/W2057920975"],"abstract_inverted_index":{"The":[0],"design":[1,116,176],"of":[2,24,38,53,63,85,100,127,144,154,166],"automotive":[3,119],"in-vehicle":[4,44],"networks":[5],"is":[6],"influenced":[7],"by":[8],"several":[9],"factors":[10],"like":[11,29,79],"bandwidth,":[12],"real-time":[13],"properties,":[14],"reliability":[15],"and":[16,26,33,66,81,87,146,156],"cost.":[17],"This":[18],"has":[19,103],"led":[20],"to":[21,73,173],"a":[22,49,142,152],"number":[23],"protocols":[25,78,102],"communication":[27,45,130],"standards":[28],"CAN,":[30],"MOST,":[31],"FlexRay":[32,80],"more":[34,92],"recently":[35],"the":[36,41,61,97,101,124,128,174],"use":[37],"Ethernet.":[39],"In":[40,51,110],"future,":[42],"wireless":[43],"might":[46],"also":[47],"become":[48],"possibility.":[50],"all":[52],"these":[54,167],"cases,":[55],"often":[56],"hybrid":[57,77,98,125,168],"schemes":[58,148,169],"such":[59],"as":[60,149,151],"combination":[62,153],"time-triggered":[64],"(TT)":[65],"event-triggered":[67,147],"(ET)":[68],"paradigms":[69],"have":[70],"been":[71,105],"considered":[72],"be":[74,171],"useful.":[75],"Thus,":[76],"TTEthernet,":[82],"offering":[83],"advantages":[84],"TT":[86],"ET":[88],"communications,":[89],"are":[90,135],"becoming":[91],"popular.":[93],"However,":[94],"until":[95],"now":[96],"nature":[99,126],"not":[104],"exploited":[106],"in":[107],"application":[108,175],"design.":[109],"this":[111],"paper,":[112],"we":[113,139,160],"will":[114,140,161],"discuss":[115],"strategies":[117],"for":[118],"control":[120],"applications":[121],"that":[122],"exploit":[123],"underlying":[129],"architecture":[131],"on":[132],"which":[133],"they":[134],"mapped.":[136],"Towards":[137],"this,":[138],"consider":[141],"mix":[143],"time-":[145],"well":[150],"reliable":[155],"unreliable":[157],"communication.":[158],"Correspondingly,":[159],"show":[162],"how":[163],"appropriate":[164],"abstractions":[165],"could":[170],"lifted":[172],"stage.":[177]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}