{"id":"https://openalex.org/W2766976633","doi":"https://doi.org/10.1145/3109984.3109995","title":"Development of microtransformers using MCM and electronic packaging technologies","display_name":"Development of microtransformers using MCM and electronic packaging technologies","publication_year":2017,"publication_date":"2017-08-28","ids":{"openalex":"https://openalex.org/W2766976633","doi":"https://doi.org/10.1145/3109984.3109995","mag":"2766976633"},"language":"en","primary_location":{"id":"doi:10.1145/3109984.3109995","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3109984.3109995","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 30th Symposium on Integrated Circuits and Systems Design: Chip on the Sands","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025251931","display_name":"Marinalva M. Rocha","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142333","display_name":"Centro de Tecnologia da Informa\u00e7\u00e3o Renato Archer","ror":"https://ror.org/044nfga98","country_code":"BR","type":"government","lineage":["https://openalex.org/I4210142333","https://openalex.org/I4210151455"]}],"countries":["BR"],"is_corresponding":true,"raw_author_name":"M. M. Rocha","raw_affiliation_strings":["Renato Archer - CTI - Campinas, (SP), Brazil"],"affiliations":[{"raw_affiliation_string":"Renato Archer - CTI - Campinas, (SP), Brazil","institution_ids":["https://openalex.org/I4210142333"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043832766","display_name":"A. C. C. Telles","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142333","display_name":"Centro de Tecnologia da Informa\u00e7\u00e3o Renato Archer","ror":"https://ror.org/044nfga98","country_code":"BR","type":"government","lineage":["https://openalex.org/I4210142333","https://openalex.org/I4210151455"]}],"countries":["BR"],"is_corresponding":false,"raw_author_name":"A. C. C. Telles","raw_affiliation_strings":["Renato Archer - CTI - Campinas, (SP), Brazil"],"affiliations":[{"raw_affiliation_string":"Renato Archer - CTI - Campinas, (SP), Brazil","institution_ids":["https://openalex.org/I4210142333"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048092157","display_name":"Ricardo Cotrin Teixeira","orcid":"https://orcid.org/0000-0002-5443-2605"},"institutions":[{"id":"https://openalex.org/I4210142333","display_name":"Centro de Tecnologia da Informa\u00e7\u00e3o Renato Archer","ror":"https://ror.org/044nfga98","country_code":"BR","type":"government","lineage":["https://openalex.org/I4210142333","https://openalex.org/I4210151455"]}],"countries":["BR"],"is_corresponding":false,"raw_author_name":"R. C. Teixeira","raw_affiliation_strings":["Renato Archer - CTI - Campinas, (SP), Brazil"],"affiliations":[{"raw_affiliation_string":"Renato Archer - CTI - Campinas, (SP), Brazil","institution_ids":["https://openalex.org/I4210142333"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5025251931"],"corresponding_institution_ids":["https://openalex.org/I4210142333"],"apc_list":null,"apc_paid":null,"fwci":0.1977,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.5511724,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"125","last_page":"128"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromagnetic-coil","display_name":"Electromagnetic coil","score":0.7031331658363342},{"id":"https://openalex.org/keywords/transformer","display_name":"Transformer","score":0.6709709167480469},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5615087747573853},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5105091333389282},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4887523651123047},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4761626422405243},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.4530089795589447},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.44559717178344727},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43187758326530457},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.4308415651321411},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43061330914497375},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4063909649848938},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3903653025627136},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31408053636550903},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2355612814426422},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.12368598580360413}],"concepts":[{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.7031331658363342},{"id":"https://openalex.org/C66322947","wikidata":"https://www.wikidata.org/wiki/Q11658","display_name":"Transformer","level":3,"score":0.6709709167480469},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5615087747573853},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5105091333389282},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4887523651123047},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4761626422405243},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.4530089795589447},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.44559717178344727},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43187758326530457},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4308415651321411},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43061330914497375},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4063909649848938},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3903653025627136},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31408053636550903},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2355612814426422},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.12368598580360413}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3109984.3109995","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3109984.3109995","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 30th Symposium on Integrated Circuits and Systems Design: Chip on the Sands","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8700000047683716,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322025","display_name":"Conselho Nacional de Desenvolvimento Cient\u00edfico e Tecnol\u00f3gico","ror":"https://ror.org/03swz6y49"},{"id":"https://openalex.org/F4320322904","display_name":"Financiadora de Estudos e Projetos","ror":"https://ror.org/030w99567"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1944957967","https://openalex.org/W1976589951","https://openalex.org/W2022602708","https://openalex.org/W2062995611","https://openalex.org/W2079831792","https://openalex.org/W2154353412","https://openalex.org/W2475111901","https://openalex.org/W2767153179","https://openalex.org/W6683047861"],"related_works":["https://openalex.org/W2188146187","https://openalex.org/W2036494154","https://openalex.org/W4372294755","https://openalex.org/W2379772394","https://openalex.org/W3123114176","https://openalex.org/W16482907","https://openalex.org/W2364791190","https://openalex.org/W2379511752","https://openalex.org/W2374335651","https://openalex.org/W2163019679"],"abstract_inverted_index":{"Several":[0],"electronic":[1],"systems":[2],"such":[3],"as":[4,47,49,59,61],"implants":[5],"and":[6,100],"wireless":[7],"sensors":[8],"networks":[9],"could":[10,101],"benefit":[11],"from":[12,105],"compact":[13],"transformers.":[14],"In":[15],"this":[16],"paper,":[17],"the":[18,43,65,82,85],"development":[19],"of":[20,37,42,67,84,97,108],"microtransformers":[21],"on":[22],"a":[23,68,94,106],"MCM":[24],"(Multi":[25],"Chip":[26],"Module)":[27],"platform":[28],"is":[29],"presented.":[30],"The":[31,87],"windings":[32],"were":[33],"manufactured":[34],"using":[35],"wirebonding":[36],"Au":[38],"wires.":[39],"Electrical":[40],"characterization":[41],"prototypes":[44],"showed":[45],"results":[46],"good":[48],"those":[50],"built":[51],"with":[52,64,93],"printed":[53],"circuit":[54,88],"boards,":[55],"providing":[56],"coupling":[57],"factor":[58],"high":[60],"95,2%":[62],"@10Vpp/1MHz,":[63],"advantage":[66],"dimensional":[69],"reduction.":[70],"An":[71],"oscillator":[72],"for":[73],"energy":[74],"harvesting":[75],"was":[76,89],"assembled":[77],"in":[78],"order":[79],"to":[80,91],"verify":[81],"functionality":[83],"transformer.":[86],"able":[90],"operate":[92],"minimum":[95],"supply":[96],"30":[98],"mV":[99],"deliver":[102],"640":[103],"\u03bcW":[104],"source":[107],"100":[109],"mV.":[110]},"counts_by_year":[{"year":2021,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}