{"id":"https://openalex.org/W2625533263","doi":"https://doi.org/10.1145/3061639.3062285","title":"Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design","display_name":"Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design","publication_year":2017,"publication_date":"2017-06-13","ids":{"openalex":"https://openalex.org/W2625533263","doi":"https://doi.org/10.1145/3061639.3062285","mag":"2625533263"},"language":"en","primary_location":{"id":"doi:10.1145/3061639.3062285","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3061639.3062285","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 54th Annual Design Automation Conference 2017","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052177721","display_name":"Gengjie Chen","orcid":"https://orcid.org/0000-0001-6016-4742"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Gengjie Chen","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062061242","display_name":"Jian Kuang","orcid":"https://orcid.org/0000-0002-2659-0040"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jian Kuang","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013018384","display_name":"Zhiliang Zeng","orcid":"https://orcid.org/0000-0002-6538-2340"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhiliang Zeng","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100438471","display_name":"Hang Zhang","orcid":"https://orcid.org/0000-0003-0115-387X"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hang Zhang","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070795253","display_name":"Evangeline F. Y. Young","orcid":"https://orcid.org/0000-0003-0623-1590"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Evangeline F. Y. Young","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051340429","display_name":"Bei Yu","orcid":"https://orcid.org/0000-0001-6406-4810"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bei Yu","raw_affiliation_strings":["CSE Department, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"CSE Department, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5052177721"],"corresponding_institution_ids":["https://openalex.org/I177725633"],"apc_list":null,"apc_paid":null,"fwci":1.2901,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.81453482,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.987500011920929,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.6950435638427734},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.680877149105072},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5944085121154785},{"id":"https://openalex.org/keywords/obstacle","display_name":"Obstacle","score":0.570589542388916},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"Temperature gradient","score":0.517781138420105},{"id":"https://openalex.org/keywords/construct","display_name":"Construct (python library)","score":0.46338021755218506},{"id":"https://openalex.org/keywords/water-cooling","display_name":"Water cooling","score":0.45192641019821167},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.44483959674835205},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.43480557203292847},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.43230491876602173},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37939950823783875},{"id":"https://openalex.org/keywords/nuclear-engineering","display_name":"Nuclear engineering","score":0.32753658294677734},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24160471558570862},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2027837038040161},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.19096055626869202},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.18127736449241638},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14756175875663757}],"concepts":[{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.6950435638427734},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.680877149105072},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5944085121154785},{"id":"https://openalex.org/C2776650193","wikidata":"https://www.wikidata.org/wiki/Q264661","display_name":"Obstacle","level":2,"score":0.570589542388916},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.517781138420105},{"id":"https://openalex.org/C2780801425","wikidata":"https://www.wikidata.org/wiki/Q5164392","display_name":"Construct (python library)","level":2,"score":0.46338021755218506},{"id":"https://openalex.org/C7694927","wikidata":"https://www.wikidata.org/wiki/Q7667810","display_name":"Water cooling","level":2,"score":0.45192641019821167},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.44483959674835205},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.43480557203292847},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.43230491876602173},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37939950823783875},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.32753658294677734},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24160471558570862},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2027837038040161},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.19096055626869202},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.18127736449241638},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14756175875663757},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3061639.3062285","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3061639.3062285","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 54th Annual Design Automation Conference 2017","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W1978056450","https://openalex.org/W1982770732","https://openalex.org/W1987505487","https://openalex.org/W2006312753","https://openalex.org/W2019379390","https://openalex.org/W2025110944","https://openalex.org/W2035324471","https://openalex.org/W2072693637","https://openalex.org/W2083963493","https://openalex.org/W2098463182","https://openalex.org/W2106655896","https://openalex.org/W2108302928","https://openalex.org/W2114678376","https://openalex.org/W2132559078","https://openalex.org/W2136769255","https://openalex.org/W2137001807","https://openalex.org/W2142850400","https://openalex.org/W2149988879","https://openalex.org/W2152146628","https://openalex.org/W2304819379","https://openalex.org/W2314120490","https://openalex.org/W2341822376","https://openalex.org/W2543907405","https://openalex.org/W3148284042"],"related_works":["https://openalex.org/W2147842873","https://openalex.org/W4229056284","https://openalex.org/W4200000700","https://openalex.org/W3127436230","https://openalex.org/W2121129873","https://openalex.org/W2783400884","https://openalex.org/W4386131012","https://openalex.org/W4220789877","https://openalex.org/W2312244358","https://openalex.org/W2361759987"],"abstract_inverted_index":{"Liquid":[0],"cooling":[1,31,56,69,90],"shows":[2],"great":[3],"potential":[4],"in":[5,11],"resolving":[6],"the":[7,55,86,89],"huge":[8],"thermal":[9,21,47,52,77,103],"obstacle":[10],"3D":[12],"ICs.":[13],"However,":[14],"it":[15],"brings":[16],"new":[17],"challenges":[18],"including":[19],"large":[20],"gradient":[22,78,104],"and":[23,46,60,76],"high":[24],"pumping":[25,73,98],"requirement.":[26],"In":[27],"this":[28],"paper,":[29],"liquid":[30],"networks":[32,70],"with":[33],"flexible":[34],"topology":[35],"are":[36],"investigated":[37],"to":[38,67,106],"achieve":[39],"more":[40],"desirable":[41],"trade-offs":[42],"between":[43],"energy":[44],"efficiency":[45],"profile.":[48],"Specifically,":[49],"a":[50],"fast":[51],"model":[53],"for":[54],"network":[57,91],"is":[58],"proposed":[59],"analyzed,":[61],"followed":[62],"by":[63],"our":[64],"optimization":[65],"methodologies":[66],"construct":[68],"targeting":[71],"at":[72],"power":[74,99],"saving":[75],"reduction,":[79],"respectively.":[80],"Experimental":[81],"results":[82],"show":[83],"that,":[84],"under":[85],"same":[87],"constraints,":[88],"can":[92],"save":[93],"as":[94,96],"much":[95],"84.03%":[97],"or":[100],"reduce":[101],"37.65%":[102],"compared":[105],"straight":[107],"microchannels.":[108]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}