{"id":"https://openalex.org/W2616620112","doi":"https://doi.org/10.1145/3060403.3060461","title":"Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving","display_name":"Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving","publication_year":2017,"publication_date":"2017-05-10","ids":{"openalex":"https://openalex.org/W2616620112","doi":"https://doi.org/10.1145/3060403.3060461","mag":"2616620112"},"language":"en","primary_location":{"id":"doi:10.1145/3060403.3060461","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3060403.3060461","pdf_url":"http://dl.acm.org/ft_gateway.cfm?id=3060461&type=pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Great Lakes Symposium on VLSI 2017","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"http://dl.acm.org/ft_gateway.cfm?id=3060461&type=pdf","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038084044","display_name":"Brian Crites","orcid":"https://orcid.org/0000-0003-1440-5060"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Brian Crites","raw_affiliation_strings":["University of California, Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112510462","display_name":"Karen Kong","orcid":null},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Karen Kong","raw_affiliation_strings":["University of California, Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5011244614","display_name":"Philip Brisk","orcid":"https://orcid.org/0000-0003-0083-9781"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Philip Brisk","raw_affiliation_strings":["University of California, Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5038084044"],"corresponding_institution_ids":["https://openalex.org/I103635307"],"apc_list":null,"apc_paid":null,"fwci":0.3936,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.60001355,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"459","last_page":"462"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/carving","display_name":"Carving","score":0.8949059844017029},{"id":"https://openalex.org/keywords/seam-carving","display_name":"Seam carving","score":0.5900015234947205},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.532484233379364},{"id":"https://openalex.org/keywords/microfluidic-chip","display_name":"Microfluidic chip","score":0.5076040029525757},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5060440897941589},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.5027098655700684},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.47828778624534607},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.46925947070121765},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.44221892952919006},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.4333251714706421},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32716113328933716},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.22426527738571167},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18542993068695068},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.1379924714565277},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.10260611772537231},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09708130359649658},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.07609757781028748},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.07584011554718018}],"concepts":[{"id":"https://openalex.org/C2777370761","wikidata":"https://www.wikidata.org/wiki/Q18448934","display_name":"Carving","level":2,"score":0.8949059844017029},{"id":"https://openalex.org/C23746413","wikidata":"https://www.wikidata.org/wiki/Q1141379","display_name":"Seam carving","level":3,"score":0.5900015234947205},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.532484233379364},{"id":"https://openalex.org/C2988198817","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Microfluidic chip","level":3,"score":0.5076040029525757},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5060440897941589},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.5027098655700684},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.47828778624534607},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.46925947070121765},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.44221892952919006},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.4333251714706421},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32716113328933716},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22426527738571167},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18542993068695068},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.1379924714565277},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.10260611772537231},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09708130359649658},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.07609757781028748},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.07584011554718018},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":5,"locations":[{"id":"doi:10.1145/3060403.3060461","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3060403.3060461","pdf_url":"http://dl.acm.org/ft_gateway.cfm?id=3060461&type=pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Great Lakes Symposium on VLSI 2017","raw_type":"proceedings-article"},{"id":"pmh:ark:/13030/qt60p5k0f2","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},{"id":"pmh:oai:escholarship.org/ark:/13030/qt60p5k0f2","is_oa":false,"landing_page_url":"https://escholarship.org/uc/item/60p5k0f2","pdf_url":null,"source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"article"},{"id":"pmh:oai:escholarship.org/ark:/13030/qt9vk5x6ms","is_oa":false,"landing_page_url":"https://escholarship.org/uc/item/9vk5x6ms","pdf_url":null,"source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol 40, iss 10","raw_type":"article"},{"id":"pmh:qt60p5k0f2","is_oa":false,"landing_page_url":"http://www.escholarship.org/uc/item/60p5k0f2","pdf_url":null,"source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Crites, B; Kong, K; & Brisk, P. Behjat, L; Han, J; Velev, MN; & Chen, D eds. (2017). Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving.. ACM Great Lakes Symposium on VLSI, 459 - 462. doi: 10.1145/3060403.3060461. UC Riverside: Retrieved from: http://www.escholarship.org/uc/item/60p5k0f2","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1145/3060403.3060461","is_oa":true,"landing_page_url":"https://doi.org/10.1145/3060403.3060461","pdf_url":"http://dl.acm.org/ft_gateway.cfm?id=3060461&type=pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Great Lakes Symposium on VLSI 2017","raw_type":"proceedings-article"},"sustainable_development_goals":[{"score":0.8299999833106995,"display_name":"Life below water","id":"https://metadata.un.org/sdg/14"}],"awards":[{"id":"https://openalex.org/G2502992419","display_name":null,"funder_award_id":"1351115, 1536026, 1640757","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2616620112.pdf","grobid_xml":"https://content.openalex.org/works/W2616620112.grobid-xml"},"referenced_works_count":12,"referenced_works":["https://openalex.org/W1483595802","https://openalex.org/W1921174562","https://openalex.org/W1996296142","https://openalex.org/W1997641556","https://openalex.org/W2018377917","https://openalex.org/W2061975272","https://openalex.org/W2110460556","https://openalex.org/W2153580689","https://openalex.org/W2171414627","https://openalex.org/W2399948660","https://openalex.org/W3137241515","https://openalex.org/W6682928080"],"related_works":["https://openalex.org/W2738811747","https://openalex.org/W4252225815","https://openalex.org/W4244444919","https://openalex.org/W2058246061","https://openalex.org/W2356576053","https://openalex.org/W2060742235","https://openalex.org/W1967695159","https://openalex.org/W4367182701","https://openalex.org/W2078604053","https://openalex.org/W4205661130"],"abstract_inverted_index":{"This":[0],"paper":[1],"introduces":[2],"a":[3],"technique":[4],"based":[5],"on":[6],"seam":[7,45],"carving":[8,22,46],"to":[9],"reduce":[10],"the":[11,28],"area":[12,55],"of":[13,27,52,66],"microfluidic":[14],"very":[15],"large":[16],"scale":[17],"integration":[18],"(mVLSI)":[19],"chips.":[20],"Seam":[21],"repeatedly":[23],"identifies":[24],"small":[25],"slices":[26],"device":[29,41],"that":[30],"can":[31],"be":[32],"safely":[33],"removed":[34],"(carved)":[35],"and":[36,57],"patched":[37],"without":[38],"adversely":[39],"affecting":[40],"functionality.":[42],"Using":[43],"non-linear":[44],"we":[47],"achieve":[48],"an":[49,58],"average":[50,59],"improvement":[51],"4.28x":[53],"in":[54,61],"utilization":[56],"reduction":[60],"fluid":[62],"routing":[63],"channel":[64],"length":[65],"53%":[67]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}