{"id":"https://openalex.org/W2616549416","doi":"https://doi.org/10.1145/3060403.3060440","title":"Redundant Via Insertion with Cut Optimization for Self-Aligned Double Patterning","display_name":"Redundant Via Insertion with Cut Optimization for Self-Aligned Double Patterning","publication_year":2017,"publication_date":"2017-05-10","ids":{"openalex":"https://openalex.org/W2616549416","doi":"https://doi.org/10.1145/3060403.3060440","mag":"2616549416"},"language":"en","primary_location":{"id":"doi:10.1145/3060403.3060440","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3060403.3060440","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Great Lakes Symposium on VLSI 2017","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014796830","display_name":"Youngsoo Song","orcid":"https://orcid.org/0000-0002-7674-4722"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]},{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngsoo Song","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology & Samsung Electronics, Dajeon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology & Samsung Electronics, Dajeon, South Korea","institution_ids":["https://openalex.org/I157485424","https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101764248","display_name":"Jinwook Jung","orcid":"https://orcid.org/0000-0002-9384-5277"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jinwook Jung","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology, Dajeon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology, Dajeon, South Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020011072","display_name":"Youngsoo Shin","orcid":"https://orcid.org/0000-0002-7474-9212"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngsoo Shin","raw_affiliation_strings":["Korea Advanced Institute of Science and Technology, Dajeon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Advanced Institute of Science and Technology, Dajeon, South Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"137","last_page":"142"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10996","display_name":"Computational Geometry and Mesh Generation","score":0.989799976348877,"subfield":{"id":"https://openalex.org/subfields/1704","display_name":"Computer Graphics and Computer-Aided Design"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10996","display_name":"Computational Geometry and Mesh Generation","score":0.989799976348877,"subfield":{"id":"https://openalex.org/subfields/1704","display_name":"Computer Graphics and Computer-Aided Design"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9886999726295471,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9771999716758728,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.5570105314254761},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5338678359985352},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.506301999092102},{"id":"https://openalex.org/keywords/line","display_name":"Line (geometry)","score":0.49511757493019104},{"id":"https://openalex.org/keywords/cut-off","display_name":"Cut-off","score":0.4782670736312866},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.4426139295101166},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.33594268560409546},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24463307857513428},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.2261064052581787},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20739227533340454},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12345960736274719},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11628648638725281},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1035197377204895},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.07617542147636414},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.07610002160072327},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0667620301246643},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.06379160284996033}],"concepts":[{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.5570105314254761},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5338678359985352},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.506301999092102},{"id":"https://openalex.org/C198352243","wikidata":"https://www.wikidata.org/wiki/Q37105","display_name":"Line (geometry)","level":2,"score":0.49511757493019104},{"id":"https://openalex.org/C2778462145","wikidata":"https://www.wikidata.org/wiki/Q5196598","display_name":"Cut-off","level":3,"score":0.4782670736312866},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4426139295101166},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.33594268560409546},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24463307857513428},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.2261064052581787},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20739227533340454},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12345960736274719},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11628648638725281},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1035197377204895},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.07617542147636414},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.07610002160072327},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0667620301246643},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.06379160284996033},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/3060403.3060440","is_oa":false,"landing_page_url":"https://doi.org/10.1145/3060403.3060440","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Great Lakes Symposium on VLSI 2017","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7699999809265137,"id":"https://metadata.un.org/sdg/16","display_name":"Peace, Justice and strong institutions"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1992910879","https://openalex.org/W2061083860","https://openalex.org/W2075880753","https://openalex.org/W2089247135","https://openalex.org/W2093576521","https://openalex.org/W2094395317","https://openalex.org/W2127254586","https://openalex.org/W2128751559","https://openalex.org/W2139653724","https://openalex.org/W2148390345","https://openalex.org/W2169376433","https://openalex.org/W2174423591","https://openalex.org/W2535823762","https://openalex.org/W3147874790"],"related_works":["https://openalex.org/W2027477739","https://openalex.org/W1992074305","https://openalex.org/W2066891900","https://openalex.org/W2054055613","https://openalex.org/W1980290801","https://openalex.org/W2816742003","https://openalex.org/W2357256365","https://openalex.org/W2016423568","https://openalex.org/W2140942945","https://openalex.org/W1997841768"],"abstract_inverted_index":{"Line-end":[0],"cuts":[1,42],"are":[2,45],"employed":[3],"to":[4,16,35],"enable":[5],"1D":[6],"gridded":[7],"designs":[8],"in":[9],"self-aligned":[10],"double":[11],"patterning":[12],"(SADP)":[13],"process.":[14],"Due":[15],"the":[17,41],"minimum":[18],"spacing":[19],"constraints":[20],"between":[21],"adjacent":[22],"cuts,":[23],"cut":[24,52],"optimization":[25],"is":[26],"important":[27],"component.":[28],"However,":[29],"it":[30],"brings":[31],"a":[32],"new":[33],"challenge":[34],"redundant":[36],"via":[37],"(RV)":[38],"insertion.":[39],"As":[40],"for":[43],"RVs":[44,56],"not":[46],"taken":[47],"into":[48],"account":[49],"during":[50],"line-end":[51],"optimization,":[53],"inserting":[54],"some":[55],"may":[57],"cause":[58],"coloring":[59],"conflicts":[60],"or":[61],"design":[62],"rule":[63],"violations.":[64]},"counts_by_year":[{"year":2017,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}