{"id":"https://openalex.org/W2071605778","doi":"https://doi.org/10.1145/2786572.2786586","title":"Novel Hybrid Wired-Wireless Network-on-Chip Architectures","display_name":"Novel Hybrid Wired-Wireless Network-on-Chip Architectures","publication_year":2015,"publication_date":"2015-08-26","ids":{"openalex":"https://openalex.org/W2071605778","doi":"https://doi.org/10.1145/2786572.2786586","mag":"2071605778"},"language":"en","primary_location":{"id":"doi:10.1145/2786572.2786586","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2786572.2786586","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 9th International Symposium on Networks-on-Chip","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5035218478","display_name":"Michael Opoku Agyeman","orcid":"https://orcid.org/0000-0002-3734-4451"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Michael Opoku Agyeman","raw_affiliation_strings":["Department of Computer Science and Engineering, The Chinese University of Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, The Chinese University of Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015304429","display_name":"Wen Zong","orcid":null},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wen Zong","raw_affiliation_strings":["Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong","Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong","institution_ids":["https://openalex.org/I177725633"]},{"raw_affiliation_string":"Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong#TAB#","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091593355","display_name":"Wan Ji-xiang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210117836","display_name":"Space Micro (United States)","ror":"https://ror.org/03bc0qh53","country_code":"US","type":"company","lineage":["https://openalex.org/I4210117836"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ji-Xiang Wan","raw_affiliation_strings":["Xian Institute of Space Radio Technology, 150 Wei Qu West Street, Changan District, P.O. Box 165, Xian, 710100 PRC"],"affiliations":[{"raw_affiliation_string":"Xian Institute of Space Radio Technology, 150 Wei Qu West Street, Changan District, P.O. Box 165, Xian, 710100 PRC","institution_ids":["https://openalex.org/I4210117836"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029446985","display_name":"Alex Yakovlev","orcid":"https://orcid.org/0000-0003-0826-9330"},"institutions":[{"id":"https://openalex.org/I84884186","display_name":"Newcastle University","ror":"https://ror.org/01kj2bm70","country_code":"GB","type":"education","lineage":["https://openalex.org/I84884186"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Alex Yakovlev","raw_affiliation_strings":["School of Electrical & Electronic Engineering, Newcastle University, UK","School of Electrical and Electronic Engineering Newcastle University, UK#TAB#"],"affiliations":[{"raw_affiliation_string":"School of Electrical & Electronic Engineering, Newcastle University, UK","institution_ids":["https://openalex.org/I84884186"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering Newcastle University, UK#TAB#","institution_ids":["https://openalex.org/I84884186"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089309705","display_name":"Kin\u2010Fai Tong","orcid":"https://orcid.org/0000-0003-3913-0227"},"institutions":[{"id":"https://openalex.org/I45129253","display_name":"University College London","ror":"https://ror.org/02jx3x895","country_code":"GB","type":"education","lineage":["https://openalex.org/I124357947","https://openalex.org/I45129253"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Kenneth Tong","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, UCL, London, UK"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, UCL, London, UK","institution_ids":["https://openalex.org/I45129253"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103281227","display_name":"Terrence Mak","orcid":"https://orcid.org/0000-0003-1945-8292"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Terrence Mak","raw_affiliation_strings":["Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong","Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong","institution_ids":["https://openalex.org/I177725633"]},{"raw_affiliation_string":"Department of Computer Science and Engineering, The Chinese University of Hong Kong: michael, wzong#TAB#","institution_ids":["https://openalex.org/I177725633"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5035218478"],"corresponding_institution_ids":["https://openalex.org/I177725633"],"apc_list":null,"apc_paid":null,"fwci":1.6641,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.85963861,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9670000076293945,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.7079480290412903},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6635921001434326},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5535377860069275},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.5395066142082214},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.526648998260498},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5197739005088806},{"id":"https://openalex.org/keywords/wireless-network","display_name":"Wireless network","score":0.48864299058914185},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48332810401916504},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.47353336215019226},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.4559112787246704},{"id":"https://openalex.org/keywords/network-on-a-chip","display_name":"Network on a chip","score":0.4480569064617157},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.29201650619506836},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25308340787887573},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.223992258310318}],"concepts":[{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.7079480290412903},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6635921001434326},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5535377860069275},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.5395066142082214},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.526648998260498},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5197739005088806},{"id":"https://openalex.org/C108037233","wikidata":"https://www.wikidata.org/wiki/Q11375","display_name":"Wireless network","level":3,"score":0.48864299058914185},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48332810401916504},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.47353336215019226},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4559112787246704},{"id":"https://openalex.org/C128519102","wikidata":"https://www.wikidata.org/wiki/Q339554","display_name":"Network on a chip","level":2,"score":0.4480569064617157},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.29201650619506836},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25308340787887573},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.223992258310318},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2786572.2786586","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2786572.2786586","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 9th International Symposium on Networks-on-Chip","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4300000071525574,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322942","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2020081716","https://openalex.org/W2039830522","https://openalex.org/W2169169782"],"related_works":["https://openalex.org/W3014521742","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4386230336","https://openalex.org/W4306968100","https://openalex.org/W2136583354","https://openalex.org/W2111238207","https://openalex.org/W2171986175","https://openalex.org/W2089791793","https://openalex.org/W2065289416"],"abstract_inverted_index":{"Existing":[0],"wireless":[1,54],"communication":[2,38,55,64,86],"interface":[3],"of":[4,48,72,92,97,106],"Hybrid":[5],"Wired-Wireless":[6],"Network-on-Chip":[7],"(WiNoC)":[8],"has":[9,16],"3-dimensional":[10],"free":[11],"space":[12],"signal":[13,25],"radiation":[14],"which":[15],"high":[17],"power":[18],"dissipation":[19],"and":[20,100,111],"drastically":[21],"affects":[22],"the":[23,45,53,62,76,84,90],"received":[24],"strength.":[26],"In":[27],"this":[28],"paper,":[29],"we":[30],"propose":[31],"a":[32,68],"CMOS":[33],"based":[34],"2-dimensional":[35],"(2-D)":[36],"waveguide":[37],"fabric":[39,65,87],"that":[40],"is":[41],"able":[42],"to":[43,81],"match":[44],"channel":[46],"reliability":[47,91],"traditional":[49],"wired":[50],"NoCs":[51],"as":[52],"fabric.":[56],"Our":[57],"experimental":[58],"results":[59],"demonstrate":[60],"that,":[61],"proposed":[63,85],"can":[66,88],"achieve":[67],"5dB":[69],"operational":[70],"bandwidth":[71],"about":[73],"60GHz":[74],"around":[75],"center":[77],"frequency":[78],"(60GHz).":[79],"Compared":[80],"existing":[82],"WiNoCs,":[83],"improve":[89],"WiNoCs":[93],"with":[94],"average":[95],"gains":[96],"21.4%,":[98],"13.8%":[99],"10.6%":[101],"performance":[102],"efficiencies":[103],"in":[104],"terms":[105],"maximum":[107],"sustainable":[108],"load,":[109],"throughput":[110],"delay,":[112],"respectively.":[113]},"counts_by_year":[{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}