{"id":"https://openalex.org/W2064704576","doi":"https://doi.org/10.1145/2744769.2747953","title":"Interconnect reliability modeling and analysis for multi-branch interconnect trees","display_name":"Interconnect reliability modeling and analysis for multi-branch interconnect trees","publication_year":2015,"publication_date":"2015-06-02","ids":{"openalex":"https://openalex.org/W2064704576","doi":"https://doi.org/10.1145/2744769.2747953","mag":"2064704576"},"language":"en","primary_location":{"id":"doi:10.1145/2744769.2747953","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2744769.2747953","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 52nd Annual Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5030264455","display_name":"Hai\u2010Bao Chen","orcid":"https://orcid.org/0000-0001-7046-3455"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Hai-Bao Chen","raw_affiliation_strings":["Shanghai Jiao Tong University, Shanghai, China","Department of Micro/Nano-electronics, Shanghai Jiao Tong University, 200240, China"],"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]},{"raw_affiliation_string":"Department of Micro/Nano-electronics, Shanghai Jiao Tong University, 200240, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["University of California, Riverside, CA","Department of Electrical and Computer Engineering, University of California Riverside, 92521 USA"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California Riverside, 92521 USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021627904","display_name":"Valeriy Sukharev","orcid":"https://orcid.org/0000-0002-5647-0584"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Valeriy Sukharev","raw_affiliation_strings":["Mentor Graphics Corporation, Fremont, CA","Mentor Graphics Corporation, Fremont, CA 94538, USA"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, CA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, CA 94538, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101512775","display_name":"Xin Huang","orcid":"https://orcid.org/0000-0002-6381-1797"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xin Huang","raw_affiliation_strings":["University of California, Riverside, CA","Department of Electrical and Computer Engineering, University of California Riverside, 92521 USA"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California Riverside, 92521 USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100412370","display_name":"Taeyoung Kim","orcid":"https://orcid.org/0000-0002-8353-1776"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Taeyoung Kim","raw_affiliation_strings":["University of California, Riverside, CA","Department of Computer Science and Engineering, University of California, Riverside, 92521, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]},{"raw_affiliation_string":"Department of Computer Science and Engineering, University of California, Riverside, 92521, USA#TAB#","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5030264455"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":1.2622,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.79089959,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7481921911239624},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.7123854160308838},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6754592061042786},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5343054533004761},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4811788499355316},{"id":"https://openalex.org/keywords/laplace-transform","display_name":"Laplace transform","score":0.47440099716186523},{"id":"https://openalex.org/keywords/terminal","display_name":"Terminal (telecommunication)","score":0.4662880599498749},{"id":"https://openalex.org/keywords/transformation","display_name":"Transformation (genetics)","score":0.4429882764816284},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4166179299354553},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3923354744911194},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3492879867553711},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3478691279888153},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.25394612550735474},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.22130173444747925},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19025284051895142},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1886056363582611},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13154137134552002},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.12099376320838928}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7481921911239624},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.7123854160308838},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6754592061042786},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5343054533004761},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4811788499355316},{"id":"https://openalex.org/C97937538","wikidata":"https://www.wikidata.org/wiki/Q199691","display_name":"Laplace transform","level":2,"score":0.47440099716186523},{"id":"https://openalex.org/C2779664074","wikidata":"https://www.wikidata.org/wiki/Q3518405","display_name":"Terminal (telecommunication)","level":2,"score":0.4662880599498749},{"id":"https://openalex.org/C204241405","wikidata":"https://www.wikidata.org/wiki/Q461499","display_name":"Transformation (genetics)","level":3,"score":0.4429882764816284},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4166179299354553},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3923354744911194},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3492879867553711},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3478691279888153},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.25394612550735474},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.22130173444747925},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19025284051895142},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1886056363582611},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13154137134552002},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.12099376320838928},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2744769.2747953","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2744769.2747953","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 52nd Annual Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1482398762","https://openalex.org/W1975930457","https://openalex.org/W1986007177","https://openalex.org/W1993301830","https://openalex.org/W1993513854","https://openalex.org/W1994438562","https://openalex.org/W2007719944","https://openalex.org/W2013376612","https://openalex.org/W2033650943","https://openalex.org/W2037431404","https://openalex.org/W2064477270","https://openalex.org/W2077036969","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2088296464","https://openalex.org/W2114178877","https://openalex.org/W2150608324","https://openalex.org/W2153587887","https://openalex.org/W2160936920"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2136403807","https://openalex.org/W796810817","https://openalex.org/W2081032080","https://openalex.org/W2134733504","https://openalex.org/W2144460576"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"in":[2,73,114,139,178],"VLSI":[3,17,35],"interconnects":[4,38],"has":[5],"become":[6],"one":[7,62],"of":[8,48,64,101,171,180,183],"the":[9,37,92,106,110,119,123,128,136,145,149,154,172,188,195,205],"major":[10],"reliability":[11],"issues":[12],"for":[13,29,91,168,219],"current":[14],"and":[15,23,42,79,127],"future":[16],"technologies.":[18],"However,":[19],"existing":[20],"EM":[21,71,221],"modeling":[22],"analysis":[24,197,200],"techniques":[25],"are":[26,76,166],"mainly":[27],"developed":[28],"a":[30,53,95,140,181],"single":[31],"wire.":[32],"For":[33],"practical":[34,220],"chips,":[36],"such":[39],"as":[40],"clock":[41],"power":[43],"grid":[44],"networks":[45],"typically":[46],"consist":[47],"multi-branch":[49,141],"metal":[50,58],"segments":[51,147],"representing":[52],"continuously":[54],"connected,":[55],"highly":[56],"conductive":[57],"(Cu)":[59],"lines":[60],"within":[61],"layer":[63],"metallization,":[65],"terminating":[66],"at":[67],"diffusion":[68],"barriers.":[69],"The":[70,132,175],"effects":[72],"those":[74],"branches":[75],"not":[77],"independent":[78],"they":[80],"have":[81],"to":[82,213],"be":[83],"considered":[84],"simultaneously.":[85],"In":[86],"this":[87,102],"paper,":[88],"we":[89],"demonstrate,":[90],"first":[93,96,206],"time,":[94],"principle":[97],"based":[98],"analytic":[99,107],"solution":[100],"problem.":[103],"We":[104],"investigate":[105],"expressions":[108],"describing":[109],"hydrostatic":[111],"stress":[112,137],"evolution":[113,138],"several":[115],"typical":[116],"interconnect":[117,173],"trees:":[118],"straight-line":[120],"3-terminal":[121],"wires,":[122],"T-shaped":[124],"4-terminal":[125],"wires":[126],"cross-shaped":[129],"5-terminal":[130],"wires.":[131],"new":[133],"approach":[134],"solves":[135],"tree":[142],"by":[143],"de-coupling":[144],"individual":[146],"through":[148],"proper":[150],"boundary":[151],"conditions":[152],"accounting":[153],"interactions":[155],"between":[156],"different":[157],"branches.":[158],"By":[159],"using":[160,187,204],"Laplace":[161],"transformation":[162],"technique,":[163],"analytical":[164,176],"solutions":[165,177],"obtained":[167],"each":[169],"type":[170],"trees.":[174],"terms":[179],"set":[182],"auxiliary":[184],"basis":[185,209],"functions":[186,210],"complementary":[189],"error":[190],"function":[191],"agree":[192],"well":[193],"with":[194],"numerical":[196],"results.":[198],"Our":[199],"further":[201],"demonstrates":[202],"that":[203],"two":[207],"dominant":[208],"can":[211],"lead":[212],"0.5%":[214],"error,":[215],"which":[216],"is":[217],"sufficient":[218],"analysis.":[222]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}