{"id":"https://openalex.org/W1996055445","doi":"https://doi.org/10.1145/2744769.2747940","title":"Pushing multiple patterning in sub-10nm","display_name":"Pushing multiple patterning in sub-10nm","publication_year":2015,"publication_date":"2015-06-02","ids":{"openalex":"https://openalex.org/W1996055445","doi":"https://doi.org/10.1145/2744769.2747940","mag":"1996055445"},"language":"en","primary_location":{"id":"doi:10.1145/2744769.2747940","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2744769.2747940","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 52nd Annual Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[ECE Department, University of Texas at Austin, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[ECE Department, University of Texas at Austin, USA]","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073775409","display_name":"Lars W. Liebmann","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lars Liebmann","raw_affiliation_strings":["IBM Corporation, East Fishkill, NY"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, East Fishkill, NY","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051340429","display_name":"Bei Yu","orcid":"https://orcid.org/0000-0001-6406-4810"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bei Yu","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[ECE Department, University of Texas at Austin, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[ECE Department, University of Texas at Austin, USA]","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078415010","display_name":"Xiaoqing Xu","orcid":"https://orcid.org/0000-0002-5314-7669"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaoqing Xu","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[ECE Department, University of Texas at Austin, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[ECE Department, University of Texas at Austin, USA]","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5000933188","display_name":"Yibo Lin","orcid":"https://orcid.org/0000-0002-0977-2774"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yibo Lin","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[ECE Department, University of Texas at Austin, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[ECE Department, University of Texas at Austin, USA]","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5011883763"],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":3.7484,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.93572354,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/extreme-ultraviolet-lithography","display_name":"Extreme ultraviolet lithography","score":0.911872148513794},{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.7673649787902832},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.7455605268478394},{"id":"https://openalex.org/keywords/immersion-lithography","display_name":"Immersion lithography","score":0.7275887131690979},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.580493688583374},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.517113208770752},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.453390896320343},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.43363526463508606},{"id":"https://openalex.org/keywords/next-generation-lithography","display_name":"Next-generation lithography","score":0.42074859142303467},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41244417428970337},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.38219842314720154},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.32925206422805786},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.26582908630371094},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.23628917336463928},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.18419349193572998},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.13318711519241333}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.911872148513794},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.7673649787902832},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7455605268478394},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.7275887131690979},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.580493688583374},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.517113208770752},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.453390896320343},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.43363526463508606},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.42074859142303467},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41244417428970337},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.38219842314720154},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.32925206422805786},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.26582908630371094},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.23628917336463928},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.18419349193572998},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.13318711519241333},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2744769.2747940","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2744769.2747940","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 52nd Annual Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6600000262260437}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":66,"referenced_works":["https://openalex.org/W1542195992","https://openalex.org/W1966149271","https://openalex.org/W1969521626","https://openalex.org/W1971739315","https://openalex.org/W1974376306","https://openalex.org/W1978518297","https://openalex.org/W1984417816","https://openalex.org/W1985052961","https://openalex.org/W1990485341","https://openalex.org/W1993999542","https://openalex.org/W1997420670","https://openalex.org/W2000999402","https://openalex.org/W2003388181","https://openalex.org/W2003803236","https://openalex.org/W2014172543","https://openalex.org/W2015622761","https://openalex.org/W2017784955","https://openalex.org/W2018082951","https://openalex.org/W2018868256","https://openalex.org/W2024961309","https://openalex.org/W2025304056","https://openalex.org/W2032622168","https://openalex.org/W2033404897","https://openalex.org/W2034194269","https://openalex.org/W2035821057","https://openalex.org/W2039468162","https://openalex.org/W2040894443","https://openalex.org/W2047394675","https://openalex.org/W2051394940","https://openalex.org/W2052163612","https://openalex.org/W2054549114","https://openalex.org/W2067939252","https://openalex.org/W2069138423","https://openalex.org/W2070822532","https://openalex.org/W2076719376","https://openalex.org/W2081206460","https://openalex.org/W2083350702","https://openalex.org/W2088095433","https://openalex.org/W2097032051","https://openalex.org/W2105685623","https://openalex.org/W2107458461","https://openalex.org/W2116621052","https://openalex.org/W2122848041","https://openalex.org/W2126301723","https://openalex.org/W2128751559","https://openalex.org/W2133838018","https://openalex.org/W2143286762","https://openalex.org/W2159287000","https://openalex.org/W2172169799","https://openalex.org/W2179808641","https://openalex.org/W2342679249","https://openalex.org/W2509912622","https://openalex.org/W2949058971","https://openalex.org/W3100108623","https://openalex.org/W3149715914","https://openalex.org/W3150135088","https://openalex.org/W4238204060","https://openalex.org/W4240075604","https://openalex.org/W4251247564","https://openalex.org/W4251430640","https://openalex.org/W4252809058","https://openalex.org/W4311910168","https://openalex.org/W6660293745","https://openalex.org/W6669629026","https://openalex.org/W6810899888","https://openalex.org/W6947774901"],"related_works":["https://openalex.org/W4281556684","https://openalex.org/W2078864937","https://openalex.org/W2971086886","https://openalex.org/W2054486439","https://openalex.org/W2077244098","https://openalex.org/W1971760865","https://openalex.org/W2053625825","https://openalex.org/W2003971204","https://openalex.org/W2393446398","https://openalex.org/W4401516118"],"abstract_inverted_index":{"Due":[0],"to":[1,22,40,78,117,128],"elongated":[2],"delay":[3],"of":[4],"extreme":[5],"ultraviolet":[6],"lithography":[7,34],"(EUVL),":[8],"the":[9,15,89,107,124],"semiconductor":[10],"industry":[11],"has":[12,53],"been":[13,54],"pushing":[14,129],"193nm":[16],"immersion":[17],"lithopgrahy":[18],"using":[19],"multiple":[20,130],"patterning":[21,33,131],"print":[23],"critical":[24],"features":[25],"in":[26,132],"22nm/14nm":[27],"technology":[28],"nodes":[29],"and":[30,44,92],"beyond.":[31],"Multiple":[32],"(MPL)":[35],"poses":[36],"many":[37,69],"new":[38],"challenges":[39],"both":[41],"mask":[42,49,115],"design":[43,85,91],"IC":[45],"physical":[46,84,118],"design.":[47,119],"The":[48],"layout":[50],"decomposition":[51],"problem":[52],"extensively":[55],"studied,":[56],"first":[57],"on":[58,62,106],"double":[59],"patterning,":[60],"then":[61],"triple":[63],"or":[64],"even":[65],"quadruple":[66],"patterning.":[67],"Meanwhile,":[68],"studies":[70],"have":[71],"shown":[72],"that":[73,88],"it":[74],"is":[75],"very":[76],"important":[77],"consider":[79],"MPL":[80],"implications":[81],"at":[82],"early":[83],"stages":[86],"so":[87],"overall":[90],"manufacturing":[93],"closure":[94],"can":[95],"be":[96],"reached.":[97],"In":[98],"this":[99],"paper,":[100],"we":[101],"provide":[102],"a":[103],"comprehensive":[104],"overview":[105],"state-of-the-art":[108],"research":[109],"results":[110],"for":[111],"MPL,":[112],"from":[113],"synergistic":[114],"synthesis":[116],"We":[120],"will":[121],"also":[122],"discuss":[123],"open":[125],"problems":[126],"as":[127],"sub-10nm.":[133]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":11},{"year":2016,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}