{"id":"https://openalex.org/W2140069842","doi":"https://doi.org/10.1145/2717764.2717779","title":"3D VLSI","display_name":"3D VLSI","publication_year":2015,"publication_date":"2015-03-12","ids":{"openalex":"https://openalex.org/W2140069842","doi":"https://doi.org/10.1145/2717764.2717779","mag":"2140069842"},"language":"en","primary_location":{"id":"doi:10.1145/2717764.2717779","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2717764.2717779","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2015 Symposium on International Symposium on Physical Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043616116","display_name":"K. Arabi","orcid":null},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Karim Arabi","raw_affiliation_strings":["Qualcomm Technologies, Inc., San Diego, CA, USA","[Qualcomm Technologies Inc, San Diego, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies, Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]},{"raw_affiliation_string":"[Qualcomm Technologies Inc, San Diego, CA, USA]","institution_ids":["https://openalex.org/I19268510"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025604916","display_name":"Kambiz Samadi","orcid":null},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Kambiz Samadi","raw_affiliation_strings":["Qualcomm Technologies, Inc., San Diego, CA, USA","[Qualcomm Technologies Inc, San Diego, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies, Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]},{"raw_affiliation_string":"[Qualcomm Technologies Inc, San Diego, CA, USA]","institution_ids":["https://openalex.org/I19268510"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058197553","display_name":"Yang Du","orcid":"https://orcid.org/0000-0003-2254-778X"},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Yang Du","raw_affiliation_strings":["Qualcomm Technologies, Inc., San Diego, CA, USA","[Qualcomm Technologies Inc, San Diego, CA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies, Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]},{"raw_affiliation_string":"[Qualcomm Technologies Inc, San Diego, CA, USA]","institution_ids":["https://openalex.org/I19268510"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9918000102043152,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.7901265621185303},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6711054444313049},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5922532677650452},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5522487163543701},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5518758893013},{"id":"https://openalex.org/keywords/emerging-technologies","display_name":"Emerging technologies","score":0.5099157094955444},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.456360787153244},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.44727522134780884},{"id":"https://openalex.org/keywords/cost-reduction","display_name":"Cost reduction","score":0.4332069158554077},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4187491536140442},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37263673543930054},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3367595076560974},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2787218689918518},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2364773154258728},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.21276873350143433},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.10701972246170044}],"concepts":[{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.7901265621185303},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6711054444313049},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5922532677650452},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5522487163543701},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5518758893013},{"id":"https://openalex.org/C207267971","wikidata":"https://www.wikidata.org/wiki/Q120208","display_name":"Emerging technologies","level":2,"score":0.5099157094955444},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.456360787153244},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.44727522134780884},{"id":"https://openalex.org/C2778820799","wikidata":"https://www.wikidata.org/wiki/Q3454688","display_name":"Cost reduction","level":2,"score":0.4332069158554077},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4187491536140442},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37263673543930054},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3367595076560974},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2787218689918518},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2364773154258728},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.21276873350143433},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.10701972246170044},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2717764.2717779","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2717764.2717779","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2015 Symposium on International Symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.47999998927116394,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1581879640","https://openalex.org/W1981823766","https://openalex.org/W2002806561","https://openalex.org/W2002862525","https://openalex.org/W2048148374","https://openalex.org/W2079693449","https://openalex.org/W2157629140","https://openalex.org/W6634849051"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2333804548","https://openalex.org/W1990828594","https://openalex.org/W3093450488","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W3163301441","https://openalex.org/W1522190160","https://openalex.org/W2534942874","https://openalex.org/W2289302158"],"abstract_inverted_index":{"As":[0],"the":[1,8,106,122],"semiconductor":[2],"industry":[3],"faces":[4],"serious":[5],"challenges":[6,33],"extending":[7],"CMOS":[9],"roadmap,":[10],"traditional":[11],"cost":[12],"reduction":[13],"benefits":[14,112],"that":[15,75,120],"accompanied":[16],"power/performance/area":[17],"(PPA)":[18],"advantages":[19],"of":[20,30,62,88,98,124],"successive":[21],"technology":[22,74,108],"nodes":[23],"have":[24,45],"decreased":[25],"due":[26,93],"to":[27,52,94,126],"a":[28,49,58],"myriad":[29],"process":[31],"integration":[32,43,73,91],"and":[34,39,109,113],"increased":[35],"variability,":[36],"reliability,":[37],"power":[38],"thermal":[40],"constraints.":[41],"3D":[42,66,72,78],"technologies":[44,79],"been":[46],"pursued":[47],"as":[48],"potential":[50,123],"solution":[51],"help":[53,127],"integrate":[54],"more":[55,90],"functions":[56],"within":[57],"confined":[59],"available":[60],"dimensions":[61],"advanced":[63],"mobile":[64],"devices.":[65],"VLSI":[67],"(3DV)":[68],"is":[69],"an":[70],"emerging":[71],"unlike":[76],"packaging-driven":[77],"(e.g.,":[80],"2.5D,":[81],"TSV-based":[82],"3D,":[83],"etc.)":[84],"can":[85],"deliver":[86],"orders":[87],"magnitude":[89],"densities":[92],"extremely":[95],"small":[96],"sizes":[97],"vertical":[99],"vias.":[100],"In":[101],"this":[102],"paper,":[103],"we":[104],"describe":[105],"3DV":[107,125],"its":[110],"current":[111],"challenges.":[114],"We":[115],"also":[116],"survey":[117],"recent":[118],"literature":[119],"show":[121],"continue":[128],"Moore's":[129],"law":[130],"trajectory":[131],"beyond":[132],"2D.":[133]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2016-06-24T00:00:00"}