{"id":"https://openalex.org/W1984606362","doi":"https://doi.org/10.1145/2629516","title":"Testable cross-power domain interface (CPDI) circuit design in monolithic 3D technology","display_name":"Testable cross-power domain interface (CPDI) circuit design in monolithic 3D technology","publication_year":2014,"publication_date":"2014-10-06","ids":{"openalex":"https://openalex.org/W1984606362","doi":"https://doi.org/10.1145/2629516","mag":"1984606362"},"language":"en","primary_location":{"id":"doi:10.1145/2629516","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2629516","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064910584","display_name":"Jing Xie","orcid":"https://orcid.org/0000-0003-4363-8744"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jing Xie","raw_affiliation_strings":["The Pennsylvania State University","(The Pennsylvania State University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Pennsylvania State University","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"(The Pennsylvania State University","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058197553","display_name":"Yang Du","orcid":"https://orcid.org/0000-0003-2254-778X"},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Yang Du","raw_affiliation_strings":["Qualcomm Corporation Research and Development","Qualcomm Corporation Research and Development#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Corporation Research and Development","institution_ids":["https://openalex.org/I19268510"]},{"raw_affiliation_string":"Qualcomm Corporation Research and Development#TAB#","institution_ids":["https://openalex.org/I19268510"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385336","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-2093-1788"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["The Pennsylvania State University","(The Pennsylvania State University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The Pennsylvania State University","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"(The Pennsylvania State University","institution_ids":["https://openalex.org/I130769515"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.05362689,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"11","issue":"1","first_page":"1","last_page":"17"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.6895712614059448},{"id":"https://openalex.org/keywords/power-domains","display_name":"Power domains","score":0.6220652461051941},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5766015648841858},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5662307739257812},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5360605716705322},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5344967246055603},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5317441821098328},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.48223862051963806},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.4810067117214203},{"id":"https://openalex.org/keywords/domain","display_name":"Domain (mathematical analysis)","score":0.44857466220855713},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.4305366277694702},{"id":"https://openalex.org/keywords/power-optimization","display_name":"Power optimization","score":0.4185773730278015},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35116201639175415},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31206977367401123},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.27795547246932983},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2551928460597992},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1568070948123932},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.08699464797973633}],"concepts":[{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.6895712614059448},{"id":"https://openalex.org/C16021271","wikidata":"https://www.wikidata.org/wiki/Q17152552","display_name":"Power domains","level":3,"score":0.6220652461051941},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5766015648841858},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5662307739257812},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5360605716705322},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5344967246055603},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5317441821098328},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.48223862051963806},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.4810067117214203},{"id":"https://openalex.org/C36503486","wikidata":"https://www.wikidata.org/wiki/Q11235244","display_name":"Domain (mathematical analysis)","level":2,"score":0.44857466220855713},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.4305366277694702},{"id":"https://openalex.org/C168292644","wikidata":"https://www.wikidata.org/wiki/Q10860336","display_name":"Power optimization","level":4,"score":0.4185773730278015},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35116201639175415},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31206977367401123},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.27795547246932983},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2551928460597992},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1568070948123932},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.08699464797973633},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/2629516","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2629516","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-133770","is_oa":false,"landing_page_url":"http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1550-4832&rft.volume=11&rft.issue=1&rft.date=2014&rft.spage=&rft.aulast=Xie&rft.aufirst=Jing&rft.atitle=Testable+cross-power+domain+interface+%28CPDI%29+circuit+design+in+monolithic+3D+technology&rft.title=ACM+Journal+on+Emerging+Technologies+in+Computing+Systems","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G8556691660","display_name":null,"funder_award_id":"0903432, 1017277","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W108989492","https://openalex.org/W1963985775","https://openalex.org/W1965287694","https://openalex.org/W1969237862","https://openalex.org/W1984711740","https://openalex.org/W1989073365","https://openalex.org/W2008362573","https://openalex.org/W2051928579","https://openalex.org/W2072479814","https://openalex.org/W2098335003","https://openalex.org/W2104304150","https://openalex.org/W2116175063","https://openalex.org/W2116966184","https://openalex.org/W2126600159","https://openalex.org/W2146478807","https://openalex.org/W2146704626","https://openalex.org/W2158305111","https://openalex.org/W2160130898","https://openalex.org/W2162517322","https://openalex.org/W2163742724","https://openalex.org/W2168159483","https://openalex.org/W2169278276"],"related_works":["https://openalex.org/W3010631755","https://openalex.org/W2383563100","https://openalex.org/W2393658466","https://openalex.org/W4248234938","https://openalex.org/W1981084410","https://openalex.org/W2078506771","https://openalex.org/W2914442136","https://openalex.org/W2368652795","https://openalex.org/W2391880898","https://openalex.org/W4389672975"],"abstract_inverted_index":{"Optimizing":[0],"energy":[1,142],"consumption":[2,143],"for":[3,18],"electronic":[4],"systems":[5],"has":[6,84],"been":[7],"an":[8],"important":[9],"design":[10,14,96,106,112,136],"consideration.":[11],"Multipower":[12],"domain":[13,31,80],"is":[15,113],"widely":[16],"used":[17],"low-power":[19,121],"and":[20,50,72,108,119,140],"high-performance":[21],"applications.":[22],"Data":[23],"transfer":[24],"between":[25],"power":[26,43,79,98],"domains":[27],"needs":[28],"a":[29,58,70,85,92,116,125],"cross-power":[30],"interface":[32,67],"(CPDI).":[33],"The":[34,111],"existing":[35],"level-conversion":[36],"flip-flop":[37,71],"(LCFF)":[38],"structures":[39],"all":[40],"need":[41],"dual":[42],"rails,":[44],"which":[45,89],"lead":[46],"to":[47,81,131],"large":[48],"area":[49,109],"performance":[51],"overhead.":[52],"In":[53],"this":[54],"article,":[55],"we":[56],"propose":[57],"scanable":[59],"CPDI":[60],"circuit,":[61],"utilizing":[62],"monolithic":[63],"3D":[64],"technology.":[65,122],"This":[66,134],"functions":[68],"as":[69],"provides":[73],"reliable":[74],"data":[75],"conversion":[76],"from":[77],"one":[78],"another.":[82],"It":[83,123],"built-in":[86],"scan":[87],"feature,":[88],"makes":[90],"it":[91],"testable":[93],"design.":[94],"Our":[95],"separates":[97],"rails":[99],"in":[100,115],"each":[101],"tier,":[102],"substantially":[103],"reducing":[104],"physical":[105],"complexity":[107],"penalty.":[110],"implemented":[114],"20nm,":[117],"28nm,":[118],"45nm":[120],"shows":[124,138],"20%--35%":[126],"smaller":[127],"insertion":[128],"delay":[129],"compared":[130],"normal":[132],"designs.":[133],"proposed":[135],"also":[137],"scalability":[139],"better":[141],"than":[144],"previous":[145],"LCFF":[146],"circuits.":[147]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}