{"id":"https://openalex.org/W2021057923","doi":"https://doi.org/10.1145/2591513.2591567","title":"TSV power supply array electromigration lifetime analysis in 3D ICS","display_name":"TSV power supply array electromigration lifetime analysis in 3D ICS","publication_year":2014,"publication_date":"2014-05-20","ids":{"openalex":"https://openalex.org/W2021057923","doi":"https://doi.org/10.1145/2591513.2591567","mag":"2021057923"},"language":"en","primary_location":{"id":"doi:10.1145/2591513.2591567","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2591513.2591567","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 24th edition of the great lakes symposium on VLSI","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5029272799","display_name":"Qiaosha Zou","orcid":"https://orcid.org/0000-0001-6662-4316"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qiaosha Zou","raw_affiliation_strings":["the Pennsylvania State University, University Park, USA","The Pennsylvania State University , University Park , USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"the Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"The Pennsylvania State University , University Park , USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100375840","display_name":"Tao Zhang","orcid":"https://orcid.org/0000-0002-7839-8675"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tao Zhang","raw_affiliation_strings":["the Pennsylvania State University, University Park, USA","The Pennsylvania State University , University Park , USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"the Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"The Pennsylvania State University , University Park , USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101777595","display_name":"Cong Xu","orcid":"https://orcid.org/0000-0002-9278-1363"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cong Xu","raw_affiliation_strings":["the Pennsylvania State University, University Park, USA","The Pennsylvania State University , University Park , USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"the Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"The Pennsylvania State University , University Park , USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385336","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-2093-1788"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["the Pennsylvania State University, University Park, USA","The Pennsylvania State University , University Park , USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"the Pennsylvania State University, University Park, USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"The Pennsylvania State University , University Park , USA","institution_ids":["https://openalex.org/I130769515"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130769515"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.10320067,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"239","last_page":"240"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.981777548789978},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7635975480079651},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6147976517677307},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5921014547348022},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5803912878036499},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5796349048614502},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5713193416595459},{"id":"https://openalex.org/keywords/power-integrity","display_name":"Power integrity","score":0.5622499585151672},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5307495594024658},{"id":"https://openalex.org/keywords/degradation","display_name":"Degradation (telecommunications)","score":0.48575690388679504},{"id":"https://openalex.org/keywords/circuit-reliability","display_name":"Circuit reliability","score":0.4727652370929718},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4707781970500946},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.42182859778404236},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.420624703168869},{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.4190611243247986},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4022233486175537},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.33401238918304443},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.30584514141082764},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2767086625099182},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.2738204598426819},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.17751523852348328},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07295450568199158}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.981777548789978},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7635975480079651},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6147976517677307},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5921014547348022},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5803912878036499},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5796349048614502},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5713193416595459},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.5622499585151672},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5307495594024658},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.48575690388679504},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.4727652370929718},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4707781970500946},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.42182859778404236},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.420624703168869},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.4190611243247986},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4022233486175537},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.33401238918304443},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.30584514141082764},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2767086625099182},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.2738204598426819},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.17751523852348328},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07295450568199158},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/2591513.2591567","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2591513.2591567","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 24th edition of the great lakes symposium on VLSI","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-133773","is_oa":false,"landing_page_url":"http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000380617300057","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1968059333","https://openalex.org/W1969191661","https://openalex.org/W1971124352","https://openalex.org/W1982553332","https://openalex.org/W1983731832","https://openalex.org/W2007719944","https://openalex.org/W2041723838","https://openalex.org/W2050832669","https://openalex.org/W2107868198","https://openalex.org/W2122506842"],"related_works":["https://openalex.org/W2965410099","https://openalex.org/W4235454973","https://openalex.org/W4386105410","https://openalex.org/W2148913576","https://openalex.org/W3097351224","https://openalex.org/W2250058922","https://openalex.org/W2142764951","https://openalex.org/W1998607656","https://openalex.org/W2146176401","https://openalex.org/W2809795632"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"can":[2,61],"cause":[3],"severe":[4],"reliability":[5],"issues":[6],"in":[7,46,80,104,124],"contemporary":[8],"integrated":[9,15],"circuits.":[10],"For":[11],"the":[12,19,26,31,47,54,81,86,99,110],"emerging":[13],"three-dimensional":[14],"circuits":[16],"(3D":[17],"ICs),":[18],"introduction":[20],"of":[21,88,94],"through-silicon":[22],"vias":[23],"(TSVs)":[24],"as":[25],"vertical":[27],"signal":[28],"carrier":[29],"complicates":[30],"electromigration":[32],"analysis.":[33],"In":[34,65],"particular,":[35],"an":[36,125],"accurate":[37],"EM":[38,72,100],"analysis":[39,73],"on":[40,77,98],"TSV":[41,78,112],"arrays":[42,79],"that":[43,75,109],"are":[44,102],"used":[45],"power":[48,82],"supply":[49,83],"network":[50],"is":[51,115],"critical":[52],"since":[53],"large":[55],"current":[56,90,120],"going":[57],"through":[58],"those":[59],"TSVs":[60],"accelerate":[62],"their":[63],"degradation.":[64],"this":[66],"work,":[67],"we":[68],"propose":[69],"a":[70],"novel":[71],"framework":[74],"focuses":[76],"network,":[84],"under":[85],"circumstance":[87],"uneven":[89],"distribution.":[91],"The":[92],"impacts":[93],"various":[95],"design":[96],"factors":[97],"lifetime":[101,114],"discussed":[103],"detail.":[105],"Our":[106],"results":[107],"reveal":[108],"predicted":[111],"array":[113],"largely":[116],"biased":[117],"without":[118],"proper":[119],"distribution":[121],"analysis,":[122],"resulting":[123],"unexpected":[126],"early":[127],"failure.":[128]},"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}